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Tin-bismuth composite alloy and preparation method thereof

A composite alloy, tin-bismuth technology, applied in the field of tin-bismuth composite alloy and its preparation, can solve the problems of low reliability, high alloy brittleness, etc., and achieve the effects of improving productivity, low heating temperature, and short heating time

Active Publication Date: 2018-08-28
HOERSON ELECTRONICS TECH +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] In view of the above-mentioned deficiencies in the prior art, the object of the present invention is to provide a tin-bismuth composite alloy and its preparation method, aiming to solve the problems of high brittleness and low reliability of existing low-temperature solder alloys

Method used

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Examples

Experimental program
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Effect test

Embodiment 1

[0051] A method for preparing a conductive polymer reinforced low-temperature high-toughness tin-bismuth composite alloy material, comprising the following steps:

[0052] (1) PEDOT nanofibers were prepared by the infiltration template method. The specific steps were as follows: adding EDOT monomer and ferric chloride into acetone, ethanol and other organic solvents, stirring and standing for a long time to obtain a PEDOT polymer solution. At the same time, use deionized water, absolute ethanol and isopropanol to ultrasonically clean the porous alumina template, and immerse the template in the PEDOT polymer solution. After the infiltration is complete, clean the template and use 4M NaOH solution for etching. PEDOT nanofibers were obtained after washing with deionized water and drying.

[0053] (2) The obtained PEDOT nanofibers were mixed into the chloroauric acid solution, and electrodeposited at a voltage of -0.1V for 60s to prepare a nano-gold coating layer on the surface of...

Embodiment 2

[0058] A method for preparing a conductive polymer reinforced low-temperature high-toughness tin-bismuth composite alloy material, comprising the following steps:

[0059] (1) Put 1×10 -4 M hexadecyltrimethylammonium bromide was mixed with 2mM pyrrole, stirred vigorously, and 0.15mL of ammonium persulfate was added at 3°C, and allowed to stand for 24 hours to prepare polypyrrole nanoparticles by chemical reduction. fiber. Then, wash with distilled water and absolute ethanol in sequence, and vacuum-dry at 80° C. to obtain polypyrrole nanofibers.

[0060] (2) Prepare a layer of Ni coating layer on the surface of polypyrrole nanofibers by electroless plating, then add it into absolute ethanol for ultrasonic dispersion, and use 1M p-toluenesulfonic acid and 1M NaOH solution to complete the second After doping treatment, the desired conductive polymer nanofibers are obtained after drying.

[0061] (3) Nano-tin powder coated with o-phenanthroline with an average particle size of ...

Embodiment 3

[0065] A method for preparing a conductive polymer reinforced low-temperature high-toughness tin-bismuth composite alloy material, comprising the following steps:

[0066] (1) Dissolve 0.5M aniline monomer in ethanol as the oil phase, dissolve 0.1M silver nitrate and 0.15M ammonium persulfate in 1M hydrochloric acid aqueous solution as the water phase, and mix the two solutions to prepare tape by one-step synthesis method. The polyaniline nanofibers with Ag coating have an average diameter of 50nm. Then, the obtained polyaniline nanofibers were mixed into absolute ethanol, ultrasonically dispersed, and then subjected to secondary doping treatment with 1M dodecylsulfonic acid and 1M ammonia solution to obtain the desired conductive polymer nanofibers.

[0067] (2) Nano-tin powder and nano-bismuth powder with an average particle size of 70nm and 150nm were prepared respectively by laser method, and the two were mixed into hydrochloric acid-ethanol solution (the mass percentage o...

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Abstract

The invention discloses a tin-bismuth composite alloy and a preparation method thereof. The method comprises the following steps: synthesizing conductive polymer nano fiber, and preparing a metal coating layer on the surface of the conductive polymer nano fiber; adding the conductive polymer nano fiber with the metal coating layer into an organic solvent, and dispersing; performing secondary doping treatment; preparing nano tin powder and nano bismuth powder respectively; adding the obtained nano tin powder and nano bismuth powder into the organic solvent, and performing acid pickling treatment; performing purification treatment to obtain pure nano composite powder; mixing the obtained conductive polymer nano fiber after the secondary doping treatment, the obtained nano composite powder and a soldering flux, and stirring to obtain uniform tin-bismuth composite powder; performing sintering treatment on the tin-bismuth composite powder to obtain the tin-bismuth composite alloy. Through the method, a low-temperature tin-bismuth composite alloy material with a low melting point and high toughness is obtained.

Description

technical field [0001] The invention relates to the technical field of electronic packaging, in particular to a tin-bismuth composite alloy and a preparation method thereof. Background technique [0002] The progress of modern electronic manufacturing technology promotes the continuous development of electronic information systems in the direction of miniaturization, high density and multi-function, and the integration level, number of components and I / O pins of the system continue to increase. In order to integrate a variety of chips or devices with different functions into one system, it is necessary to reduce the thermal impact of the packaging process temperature on various chips and devices, especially for thermal mismatch, heat-sensitive materials, flexible substrates, multi-layer IC chips and built-in devices, etc., must be packaged and interconnected at the lowest possible temperature, that is, low-temperature packaging. [0003] At present, the traditional low-temp...

Claims

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Application Information

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IPC IPC(8): C22C13/02C22C1/04
CPCC22C1/0483C22C13/02
Inventor 祝温泊顾佳慧杨帆汪敏马鑫李明雨
Owner HOERSON ELECTRONICS TECH
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