A kind of lead-free low melting point glass powder and preparation method thereof

Abstract

The invention relates to a lead-free low-melting glass powder, which is prepared from the following components in parts by weight: 0.05-0.2 parts of lithium fluoride, 0.05-0.3 parts of zinc nitrate, 1.5-5 parts of boric acid, and 0.1-2.5 parts of barium chloride , 0.5-5.5 parts of calcium nitrate, 2.5-7.5 parts of sodium silicate, 0.5-2.5 parts of aluminum nitrate, 1.5-5 parts of sodium chloride, 0.01-0.2 parts of beryllium chloride, 0.25-1.0 parts of copper chloride, 10-2 parts of phosphoric acid 20 parts, 50-80 parts of deionized water. After weighing each component, heat and stir to mix evenly to obtain a clear liquid, which is added to the reaction kettle, then heated for reaction, and finally the reaction product is centrifuged, filtered, and dried to obtain the product. The raw material of the glass powder is easy to obtain, the components are environmentally friendly, the melting point is low, and the thermal expansion coefficient is moderate, which can replace the traditional glass system materials containing lead and bismuth, and is suitable for electric vacuum and microelectronic technology fields.

Description

technical field [0001] The invention relates to a lead-free low melting point glass powder and a preparation method thereof, belonging to the technical field of special glass preparation. Background technique [0002] Low-melting point glass powder refers to a special glass whose glass transition temperature is significantly lower than ordinary glass, and can be widely used as a bonding phase for sealing glass and electronic paste. With the rapid development of the electronics industry, low melting point glass is widely used in the sealing and protection of electronic components and display devices, such as sealing vacuum fluorescent display (VFD), plasma display (PDP) and cathode ray tube (CRT) and other vacuum devices. In addition, the conductive paste and resistance paste of electronic paste usually contain low melting point glass as the binder phase during sintering, which is widely used in conductors, resistors, switches, capacitors, etc. in hybrid integrated circuits....

AI Technical Summary

Problems solved by technology

[0003] At present, PbO-B is mainly used in the field of low melting point sealing glass in China. 2 o 3 -SiO 2 , PbO-ZnO-B 2 o 3 , Bi 2 o 3 -B 2 o 3 -ZnO and other lead and bismuth glass systems have a great impact on the environment and are not conducive to sustainable development, while other systems generally have high melting points, which are not conducive to being used as silver pastes for ceramics, glass, and polymer material substrates in the field of microelectronics , one of the main components of copper paste, control the thickness and patterning of silver paste and copper paste

In addition, the existing low-melting point glass powder has a high thermal expansion coefficient, which cannot meet the application in the field of low expansion coefficient.