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Preparation method of film capacitor composite dielectric film

A technology of composite dielectric film and film capacitors, applied in the direction of film/thick film capacitors, laminated capacitors, etc., can solve the problems of overall performance damage, easy cracks and decomposition, difficult processing, etc., and achieve high temperature resistance and excellent performance Mechanical properties and the effect of improving the dielectric constant

Inactive Publication Date: 2017-12-15
NANJING UNIV OF TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Although very versatile, it is difficult to process by traditional techniques since the transformation temperature does not change until about 600°C
Moreover, the currently used polyimide materials are also prone to cracks and decomposition under the influence of extreme ambient temperatures, so some problems are more likely to occur under actual service conditions and cause damage to the overall performance

Method used

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  • Preparation method of film capacitor composite dielectric film
  • Preparation method of film capacitor composite dielectric film
  • Preparation method of film capacitor composite dielectric film

Examples

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Embodiment 1

[0036] A method for preparing a composite dielectric film for a film capacitor, the wet method preparation steps of the fluorine-containing polybenzoxazole high-temperature-resistant aromatic heterocyclic film are as follows:

[0037] (1) Synthesis of fluorine-containing phenolic hydroxyl polyimide precursor: weigh 2,2-bis(3-amino-4-hydroxyphenyl)-hexafluoropropane and 4,4'-linked Phenyl ether dianhydride was mixed in the container, adding 20% ​​m-cresol of the raw material quality in the container as a reaction solvent, dripping 6 drops of isoquinoline as a catalyst, stirring at room temperature for 5 hours until fully dissolved; React at 190°C for 15 hours to prepare a viscous solution of a fluorine-containing phenolic hydroxyl polyimide polymer. Precipitate the viscous solution of the fluorine-containing polyimide polymer with methanol as a precipitant and wash it with hot methanol. The final fluorine-containing phenolic hydroxyl polyimide polymer was dried at 100°C for 13 ...

Embodiment 2

[0042] A method for preparing a composite dielectric film for a film capacitor, the wet method preparation steps of the fluorine-containing polybenzoxazole high-temperature-resistant aromatic heterocyclic two-phase composite film reinforced by titanium dioxide nanosheets are as follows:

[0043] (1) Synthesis of fluorine-containing phenolic hydroxyl polyimide precursor: weigh 2,2-bis(3-amino-4-hydroxyphenyl)-hexafluoropropane and 4,4'-linked Phenyl ether dianhydride was mixed in the container, adding 15% m-cresol of the raw material quality in the container as a reaction solvent, dripping 3 drops of isoquinoline as a catalyst, stirring at room temperature for 4 hours until fully dissolved; React at 180°C for 14 hours to prepare a viscous solution of polyimide polymer containing fluorine-containing phenolic hydroxyl groups. Precipitate the viscous solution of the polymer with methanol as a precipitant and wash with hot methanol. The washed phenolic hydroxyl groups The polyimide...

Embodiment 3

[0050] A method for preparing a composite dielectric film for film capacitors, the wet method preparation steps of the fluorine-containing polybenzoxazole high-temperature-resistant aromatic heterocyclic two-phase composite film enhanced by the dielectric enhancement of niobium calcium oxide nanosheets are as follows:

[0051] (1) Synthesis of fluorine-containing phenolic hydroxyl polyimide precursor: weigh 2,2-bis(3-amino-4-hydroxyphenyl)-hexafluoropropane and 4,4'-linked Phenyl ether dianhydride was mixed in the container, adding 15% m-cresol of the raw material quality in the container as a reaction solvent, dripping 3 drops of isoquinoline as a catalyst, stirring at room temperature for 4 hours until fully dissolved; React at 180°C for 14 hours to prepare a viscous solution of polyimide polymer containing fluorine-containing phenolic hydroxyl groups. Precipitate the viscous solution of the polymer with methanol as a precipitant and wash with hot methanol. The washed phenoli...

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Abstract

The invention discloses a preparation method of a film capacitor composite dielectric film. The preparation method comprises the following steps: (1) adopting a one-step method to synthesize a fluorine-containing phenolic hydroxyl group polyimide precursor; (2) adopting an intercalation stripping method to prepare a high dielectric oxide nanosheet; (3) preparing a two-phase polyimide / oxide nanosheet dielectric enhancer uniformly-mixed solution, or a multi-phase (three-phase) polyimide / oxide nanosheet dielectric enhancer / boron nitride nanosheet heat conduction enhancer uniformly-mixed solution; (4) drying to obtain a two-phase or multi-phase (three-phase) fluorine-containing phenolic hydroxyl group polyimide / nanosheet composite film; and (5) carrying out high temperature treatment in nitrogen condition to obtain a two-phase or multi-phase (three-phase) fluorine-containing polybenzoxazole high temperature resistant aromatic heterocycte / nanosheet composite dielectric film. The film capacitor composite dielectric film prepared in the invention has excellent performance such as high temperature resistance, high disruptive strength, dielectric constant adjustability and high energy storage density, and the process is simple, green and environmentally-friendly and can be used for large-scale manufacturing.

Description

technical field [0001] The invention relates to a preparation method of a high-temperature-resistant high-dielectric film capacitor composite dielectric film, which belongs to the field of functional polymer-based electronic electromagnetic materials and power electronics. Background technique [0002] With the continuous innovation of microelectronics science and technology, the trend of high-speed and miniaturization of various types of electronic devices is continuously strengthened, and materials with high temperature resistance and high breakdown strength are becoming more and more important. In recent years, polyimide-based materials with high temperature and high breakdown strength have gradually attracted people's attention, and are widely used in components in the fields of aviation, aerospace, electronics, transportation and telecommunications. [0003] Among the traditional piezoelectric ceramic materials, oxides such as zirconia are one of the dielectric ceramics...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08G73/22C08G73/10C08L79/04C08K7/00C08J5/18H01G4/33
CPCH01G4/33C08G73/1071C08G73/22C08J5/18C08K7/00C08J2379/04C08K2201/011C08L2203/20C08L2203/16C08L2201/08C08L79/04
Inventor 黄程薛朋黄维
Owner NANJING UNIV OF TECH
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