Low thermal conductivity wall thermal insulation coating and its preparation method
A low thermal conductivity, thermal insulation coating technology, applied in the direction of anti-corrosion coatings, fire-resistant coatings, polyamide coatings, etc., can solve the problems of poor thermal insulation performance and impact resistance, low thermal conductivity protective layer, low wall bonding strength, etc., to achieve anti-corrosion The effect of good water performance, good flexibility and good corrosion resistance
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Embodiment 1
[0031] A low thermal conductivity wall thermal insulation coating, comprising the following raw materials: 75 parts of polyamide resin, 55 parts of epoxy resin, 45 parts of modified hollow ceramic microspheres, 35 parts of silica airgel, and 30 parts of talcum powder 25 parts of glass wool, 20 parts of inorganic additives, 15 parts of infrared reflective pigments, 15 parts of additives and 85 parts of deionized water;
[0032] The modified hollow ceramic microspheres include the following raw materials: 22 parts of hollow ceramic microspheres, 10 parts of hydrofluoric acid solution and 5 parts of chromium aluminum phosphate solution;
[0033] The auxiliary agent includes the following raw materials in parts: 3 parts of film-forming auxiliary agent, 3 parts of antifreeze agent, 1 part of curing agent, 1 part of dispersant, 0.2 part of defoamer and 0.2 part of wetting agent.
[0034] Wherein, the particle diameter of the hollow ceramic microspheres is 30 microns, the concentrati...
Embodiment 2
[0047] A low thermal conductivity wall thermal insulation coating, comprising the following raw materials: 85 parts of polyamide resin, 65 parts of epoxy resin, 55 parts of modified hollow ceramic microspheres, 40 parts of silica airgel, 33 parts of talcum powder 27 parts of glass wool, 23 parts of inorganic additives, 20 parts of infrared reflective pigments, 18 parts of additives and 95 parts of deionized water;
[0048] The modified hollow ceramic microspheres include the following raw materials: 25 parts of hollow ceramic microspheres, 13 parts of hydrofluoric acid solution and 8 parts of chromium aluminum phosphate solution;
[0049] The auxiliary agent includes the following raw materials: 5 parts of film-forming auxiliary agent, 5 parts of antifreeze agent, 2 parts of curing agent, 2 parts of dispersant, 1.2 parts of defoaming agent and 0.8 part of wetting agent.
[0050] Wherein, the particle diameter of the hollow ceramic microspheres is 60 microns, the concentration ...
Embodiment 3
[0063] A low thermal conductivity wall thermal insulation coating, comprising the following raw materials: 80 parts of polyamide resin, 60 parts of epoxy resin, 50 parts of modified hollow ceramic microspheres, 37.5 parts of silica airgel, 31.5 parts of talcum powder 26 parts of glass wool, 21.5 parts of inorganic additives, 17.5 parts of infrared reflective pigments, 17.5 parts of additives and 90 parts of deionized water;
[0064] The modified hollow ceramic microspheres include the following raw materials: 23.5 parts of hollow ceramic microspheres, 11.5 parts of hydrofluoric acid solution and 6.5 parts of chromium aluminum phosphate solution;
[0065] The auxiliary agent includes the following raw materials: 4 parts of film-forming auxiliary agent, 4 parts of antifreeze agent, 1.5 parts of curing agent, 1.5 parts of dispersant, 0.7 part of defoamer and 0.5 part of wetting agent.
[0066] Wherein, the particle diameter of the hollow ceramic microspheres is 45 microns, the co...
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