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Silver-based alloy target blank for vacuum magnetron sputtering and its preparation method and application

A vacuum magnetron sputtering and silver-based alloy technology, which is applied in metal material coating process, sputtering coating, vacuum evaporation coating, etc., can solve the problem of decreased film reflectivity, degradation of substrate adhesion, silver grain Growth and other problems, to achieve the effect of low resistivity, good adhesion, good sulfuration resistance

Active Publication Date: 2019-02-19
NORTHEASTERN UNIV LIAONING
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The generated sulfides or oxides will absorb blue light, which will reduce the reflectivity of the blue light band in the reflective layer, thereby reducing the reflectivity of the film. In addition, it is easy to produce silver grain growth or silver atom aggregation.
Therefore, the silver-based thin film will have problems such as decreased conductivity and reflectivity, and poor adhesion to the substrate.

Method used

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  • Silver-based alloy target blank for vacuum magnetron sputtering and its preparation method and application
  • Silver-based alloy target blank for vacuum magnetron sputtering and its preparation method and application
  • Silver-based alloy target blank for vacuum magnetron sputtering and its preparation method and application

Examples

Experimental program
Comparison scheme
Effect test

preparation example Construction

[0027] In the specific implementation process, the present invention is used for the preparation method of vacuum magnetron sputtering silver-based alloy target blank, including the following process steps:

[0028] (1) Use 10 according to the ratio -5 The precision balance accurately weighs the weight of the metal elements required for each alloy, and uses a high-frequency induction furnace with an argon protection device for alloy melting; first, put the metal copper into a graphite crucible and heat it up to melt, and then heat it up at 1120 ° C ± 50 Add zinc at about ℃ for alloying smelting. After smelting, lower the graphite crucible to the cooling platform, and cast it under the conditions of hot top protection, permanent magnetic stirring and directional forced cooling. The obtained copper-zinc alloy billet is cooled to room temperature. Afterwards, it is taken out for rolling and shearing to obtain a copper-zinc binary master alloy for future use. Before smelting, high...

Embodiment 1

[0034] After the smelting is completed, the specific chemical composition of the silver-based alloy target blank in this embodiment is as follows: the copper content is 0.5wt%; the yttrium content is 0wt% to 1.0wt%; the additional alloying elements are selected from the following elements One or more than two kinds of: Ni, Ce, Zn, Al, Mg, Nd, Si, the total addition amount is 0.035wt%-0.14wt%; the balance is silver.

[0035]

Cu

Y

Ni

Ce

Zn

Al

Mg

Nd

Si

Ag

1 #

0.5

0

0.005～0.02

0.005～0.02

0.005～0.02

0.005～0.02

0.005～0.02

0.005～0.02

0.005～0.02

margin

2 #

0.5

0.1

0.005～0.02

0.005～0.02

0.005～0.02

0.005～0.02

0.005～0.02

0.005～0.02

0.005～0.02

margin

3 #

0.5

0.5

0.005～0.02

0.005～0.02

0.005～0.02

0.005～0.02

0.005～0.02

0.005～0.02

0.005～0.02

margin

4 #

0.5

1.0

0.005～0.02

0.005～0.02

0.005～0.02

0.005～0.02

0.00...

Embodiment 2

[0040] After the smelting is completed, the specific chemical composition of the silver-based alloy target blank in this embodiment is as follows: the copper content is 1.0wt%; the yttrium content is 0wt% to 1.0wt%; the additional alloying elements are selected from the following elements One or more than two kinds of: Ni, Ce, Zn, Al, Mg, Nd, Si, the total addition amount is 0.035wt%-0.14wt%; the balance is silver.

[0041]

Cu

Y

Ni

Ce

Zn

Al

Mg

Nd

Si

Ag

5 #

1.0

0

0.005～0.02

0.005～0.02

0.005～0.02

0.005～0.02

0.005～0.02

0.005～0.02

0.005～0.02

margin

6 #

1.0

0.1

0.005～0.02

0.005～0.02

0.005～0.02

0.005～0.02

0.005～0.02

0.005～0.02

0.005～0.02

margin

7 #

1.0

0.5

0.005～0.02

0.005～0.02

0.005～0.02

0.005～0.02

0.005～0.02

0.005～0.02

0.005～0.02

margin

8 #

1.0

1.0

0.005～0.02

0.005～0.02

0.005～0.02

0.005～0.02

0.00...

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Abstract

The invention belongs to the technical field of metal material processing, and specifically relates to a silver-based alloy target blank for vacuum magnetron sputtering and its preparation method and application. In terms of weight percentage, the alloy contains 98.26wt% to 99.465wt% of metallic silver and 0.535wt% to 1.74wt% of other alloying elements. The other alloying elements are selected from at least one of the following elements: copper, yttrium, Nickel, cerium, zinc, aluminum, magnesium, neodymium, silicon, etc. Through different alloy proportions and preparation methods, the silver-based alloy target produced by the present invention has excellent properties such as good sulfide resistance and low resistivity, and can be used in vacuum magnetron sputtering after processing.

Description

technical field [0001] The invention belongs to the technical field of metal material processing, and in particular relates to a silver-based alloy target blank for vacuum magnetron sputtering and its preparation method and application. Background technique [0002] Silver-based films made of silver or silver-based alloys have some excellent properties, such as: high reflectivity, high transmittance, low extinction coefficient, high thermal conductivity, low resistivity, and excellent surface smoothing effect. Therefore, silver-based alloys are widely used in the preparation of reflective films for optical recording media, semi-transmissive reflective films, thermal diffusion films, reflective electrode films for flat panel displays, and electromagnetic wave shielding films. For example, the organic electroluminescence (organic EL) display is a self-luminous flat panel display, so it needs a reflective anode film composed of reflective metal films such as silver, aluminum, c...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C22C5/06C22C5/08C22C1/03C23C14/35C23C14/14
CPCC22C1/03C22C5/06C22C5/08C23C14/14C23C14/35
Inventor 张勤杨洪英张德胜夏军金哲男佟琳琳陈国宝肖发新刘子龙吕建芳
Owner NORTHEASTERN UNIV LIAONING
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