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Tin-bismuth series lead-free solder and preparation method thereof

A lead-free solder, tin-bismuth technology, applied in welding equipment, welding/cutting media/materials, manufacturing tools, etc., can solve problems such as thermal fatigue resistance, poor ductility, limited promotion and application, and insufficient welding reliability, and achieve Good wettability, improved shear resistance, good wetting and spreadability, and the effect of shear resistance

Inactive Publication Date: 2017-05-24
ANHUI HUAZHONG WELDING MATERIAL CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Due to the poor thermal fatigue resistance and ductility of SnBi eutectic solder, its welding reliability is insufficient and wire processing is difficult, which limits its further promotion and application.
The monotectic alloy solder announced by Beijing General Research Institute of Nonferrous Metals——silver-free Sn-Bi-Cu lead-free solder (CN200610089257.4) suppresses the segregation of Bi element in the soldering solidification process to a large extent, but its soldering interface It is still inevitable that a weak zone of Bi-rich layer will be formed, resulting in poor reliability of solder joints (greater cracking tendency)

Method used

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  • Tin-bismuth series lead-free solder and preparation method thereof

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Experimental program
Comparison scheme
Effect test

Embodiment 1

[0026] A tin-bismuth lead-free solder, calculated by weight percentage, is made of the following raw materials:

[0027] Bismuth 26%, CeO 2 Nano particles 2.4%, silver 0.3% and P 0.04%, the balance is tin. CeO 2 The particle size of the nanoparticles is 50 nm.

[0028] Preparation:

[0029] 1) Weigh bismuth powder, silver powder, P, CeO according to the ratio 2 Nanoparticles and tin powder, and mix them into initial powder;

[0030] 2) Add appropriate amount of ether and stearic acid into the ball mill jar, then add the initial powder into it, then install the ball mill jar, then evacuate the ball mill jar and feed inert gas into it, at a speed of 300r / min Under the condition of ball milling for 120h;

[0031] 3) Take out the ball-milled alloy powder and dry it in the air to fully volatilize the ether and stearic acid to obtain the tin-bismuth-based lead-free solder.

Embodiment 2

[0033] A tin-bismuth lead-free solder, calculated by weight percentage, is made of the following raw materials:

[0034] Bismuth 27%, CeO 2 Nanoparticles 2.6%, Silver 0.4% and Ge 0.03%, the balance being tin. CeO 2 The particle size of the nanoparticles is 10 nm.

[0035] Preparation:

[0036] 1) Weigh bismuth powder, silver powder, Ge, CeO according to the ratio 2 Nanoparticles and tin powder, and mix them into initial powder;

[0037] 2) Add an appropriate amount of ether and stearic acid into the ball mill jar, then add the initial powder into it, then install the ball mill jar, then evacuate the ball mill jar and pass inert gas into it, at a speed of 400r / min Under the condition of ball milling for 100h;

[0038] 3) Take out the ball-milled alloy powder and dry it in the air to fully volatilize the ether and stearic acid to obtain the tin-bismuth-based lead-free solder.

Embodiment 3

[0040] A tin-bismuth lead-free solder, calculated by weight percentage, is made of the following raw materials:

[0041] Bismuth 24%, CeO 2 Nano particles 3.0%, silver 0.6% and Ge 0.06%, the balance is tin. CeO 2 The particle size of the nanoparticles is 10 nm.

[0042] The preparation method of the low melting point lead-free solder in this embodiment is the same as the method described in embodiment 2, the only difference is that the weight percentages of the components of the lead-free solder alloy are weighed according to the proportions in this embodiment.

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Abstract

The invention provides tin-bismuth series lead-free solder and a preparation method thereof. The tin-bismuth series lead-free solder is prepared from the following raw materials in percentage by weight: 24-28% of bismuth, 2.0-3.0% of CeO2 nano-particles, 0.1-0.6% of silver, 0.01-0.16% of an anti-oxidation element and the balance of tin. The preparation method comprises the following steps: (1) weighing bismuth powder, silver powder, powder of the anti-oxidation element, the CeO2 nano-particles and tin powder according to a ratio, and mixing the weighed materials into initial powder; (2) adding proper amounts of diethyl ether and stearic acid into a ball milling tank, adding the initial powder into the ball milling tank, mounting the ball milling tank in place, vacuumizing the ball milling tank, injecting an inert gas into the vacuumized ball milling tank, and carrying out ball milling at the rotating speed of 300-600 r / min for 40-120 h; and (3) taking out alloy powder obtained after the ball milling, drying the alloy powder in the air, and sufficiently evaporating diethyl ether and stearic acid, so as to obtain the tin-bismuth series lead-free solder. The tin-bismuth series lead-free solder, namely a solder alloy, not only has a very low melting point, but also is high in wettability, spreadability, oxidation resistance and corrosion resistance.

Description

technical field [0001] The invention belongs to the technical field of soldering materials, and in particular relates to a tin-bismuth-based lead-free solder and a preparation method thereof. Background technique [0002] Sn-Pb solder has been used in the electronics industry for quite a long time. Due to its low melting point, high cost performance and easy availability, it has become the most important low-temperature solder system and is widely used in non-ferrous metals, Welding of food containers, construction, machinery and piping installations, etc. However, with the advent of the information age, electronic products emerge in an endless stream. While these electronic products benefit mankind, the lead contained in them is also increasingly polluting the ecological environment and human health. The Chinese government also promptly formulated the "Administrative Measures for the Prevention and Control of Pollution Produced by Electronic Information Products", which wa...

Claims

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Application Information

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IPC IPC(8): B23K35/26
CPCB23K35/262
Inventor 曹立兵
Owner ANHUI HUAZHONG WELDING MATERIAL CO LTD
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