20W thick-film and high-frequency load plate and production method thereof

Abstract

The invention discloses a 20W thick-film and high-frequency load plate, which comprises an aluminum nitride substrate (1) of 5*2.5*0.635mm, wherein a back guide layer is printed on the back surface of the aluminum nitride substrate; a resistor (3) and a wire (2) are printed on the front surface of the aluminum nitride substrate; the wire is connected with the resistor to form a load circuit; a ground terminal of the load circuit is electrically connected with the back guide layer through silver paste; a glass protection film (4) is printed on the resistor; a black protection film (5) is also printed on the wire and the upper surface of the glass protection film; thixotropic paste of which the viscosity is 50,000-55,000cps is adopted as the paste printed on the resistor on the front surface of the substrate; and screen printing is carried out on the paste through a 400mesh high-precision steel wire. The load plate has good VSWR performance, the power on the aluminum nitride substrate of 5*2.5*0.635mm reaches 20W, the operating frequency reaches 20GMHz, the application requirements of an existing 4G network can be met, the application requirements of a future 5G network can also be met, and furthermore, the production technology disclosed by the invention plays a good guarantee role in guarantee of the performance of a product.

Description

technical field [0001] The invention relates to an aluminum nitride ceramic substrate loading sheet, in particular to a thick-film high-frequency 20-watt loading sheet. Background technique [0002] The aluminum nitride ceramic substrate load plate is mainly used in the communication base station to absorb the reverse input power of the communication components. If it cannot withstand the required power, the load will burn out, which may cause the entire device to burn out. At present, most communication base stations use high-power ceramic load chips to absorb the reverse input power in communication components. The basic size is required to be smaller and smaller, and the power to be absorbed is larger and larger. The product characteristic is VSWR (Standing Poppy) as small as possible. With more than half of the base station deployment of the 4G network, the development of the 5G network has been put on the agenda. Because the frequency of use of the 5G network is high,...

AI Technical Summary

Problems solved by technology

[0003] At present, the production of high-frequency load chips adopts the vacuum sputtering production process. The production process of vacuum sputtering is expensive, and the production is difficult to control. At present, there is no domestic manufacturer that can use the vacuum sputtering process to produce power load chips. Therefore, providing high-power load chips to meet the needs of 4G and 5G networks, and at the same time, providing a practical production method is a bottleneck that manufacturers urgently need to break through

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