Novel electronic package composite material and fabrication method thereof

Abstract

The invention provides a novel electronic package composite material and a fabrication method thereof. The fabrication method comprises the following steps of firstly, mixing silicon carbide, corn starch, maltodextrin powder, carbamide, natural japan tallow, erucyl amide, nanometer silicon dioxide, thermoplastic polyimide, polyvinyl formal, waterborne polyurethane, tertiary butylhydroquinone, calcium carbonate and water, ball-milling the mixture by a ball milling machine, placing the mixture in a baking oven for drying after stirring the mixture by a high-speed agitator, and sieving the mixture to remove blocks and large particles; secondly, placing the obtained product in a die, carrying out compression molding, and placing the product in a muffle furnace for sintering to obtain a pre-fabricated member; and finally, carrying out vacuum press infiltration on the pre-fabricated member, 6061 aluminum alloy and high-purity aluminum to obtain the novel electronic package composite material. The novel electronic package composite material provided by the invention is high in heat conductivity and has high heat dissipation performance, meanwhile, the novel electronic package composite material is relatively low in thermal expansion coefficient and stable in structure and performance.

Description

technical field [0001] The invention relates to the field of materials, in particular to a novel electronic packaging composite material and a preparation method thereof. Background technique [0002] With the technological revolution and the rapid economic development, major changes have taken place in semiconductor technology and new materials. Microelectronic materials are developing towards miniaturization and high density, which makes their power higher and generates more heat, which directly leads to continuous and rapid heating of the circuit. If the temperature cannot be lowered, it will directly affect its working efficiency and safety. If it works like this for a long time, its service life will be greatly reduced. Therefore, how to solve the problem of timely heat dissipation of semiconductor materials has become the only way for its development. Electronic packaging materials have become a breakthrough. In order to meet the development of light weight and minia...

AI Technical Summary

Problems solved by technology

Metal and alloy electronic packaging materials have the advantages of low thermal expansion coefficient and good processing performance, but have the disadvantages of low thermal conductivity and high density

Ceramic electronic packaging materials have low thermal expansion coefficient, aging resistance, corrosion resistance, and low density, but processing is difficult and the cost is high

Polymer packaging materials have the advantages of low density, low cost and easy processing, but have high thermal expansion coefficient, low thermal conductivity and are not resistant to high temperature