A kind of preparation method of copper-coated graphene reinforced copper-based electrical contact material

A technology of copper-coated graphene and electrical contact materials, which is applied to contact parts, metal/alloy conductors, non-metallic conductors, etc., can solve the problem of reducing the electrical and thermal conductivity of copper contact materials, and the difficulty in obtaining comprehensive performance of copper-based contacts Material and other issues, to achieve high hardness, improve interface wettability, high wear resistance

Active Publication Date: 2017-09-19
广州东铝轻合金有限公司
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  • Abstract
  • Description
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  • Application Information

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Problems solved by technology

[0007] Both of the above two patents improve the corrosion resistance and oxidation resistance of copper alloys by adding rare earth or rare earth oxides, but at the same time, due to the addition of low-conductivity materials such as ceramic particles and chromium, the copper contacts are reduced to a certain extent. The electrical and thermal conductivity of the material makes it difficult to obtain a copper-based contact material with excellent comprehensive properties

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  • A kind of preparation method of copper-coated graphene reinforced copper-based electrical contact material

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Embodiment 1

[0028] (1) Copper-plated graphene is prepared by depositing metallic copper on the surface of graphene (layers 1-10) by DC magnetron sputtering. The copper target with a purity of 99.99% was ground with fine sandpaper to remove the surface oxide film before installation, then cleaned with acetone, dried, and pre-sputtered for 5 minutes before DC magnetron sputtering deposition to remove the metal oxide on the surface of the target. and other impurities to ensure the purity of the copper film deposited on the surface of the subsequent graphene. The process parameters of DC magnetron sputtering are: when the vacuum degree reaches 0.1*10 -3 When Pa, argon gas with a purity of 99.99% was introduced, the working pressure was 0.8Pa, the sputtering power was 80W, and the deposition time was 30min.

[0029] (2) Copper with a purity of 99.9% is smelted in an intermediate frequency furnace, and 0.05% rare earth cerium and 0.5% metal zinc are added to the copper melt. Below the surfac...

Embodiment 2

[0033] (1) Copper-plated graphene is made by depositing metallic copper on the surface of graphene (layers 1-10) by DC magnetron sputtering. The copper target with a purity of 99.99% was ground with fine sandpaper to remove the surface oxide film before installation, then washed with acetone, dried, and pre-sputtered for 5 minutes before DC magnetron sputtering deposition to remove the metal oxide on the surface of the target. and other impurities to ensure the purity of the copper film deposited on the surface of the subsequent graphene. The process parameters of DC magnetron sputtering are: when the vacuum degree reaches 1*10 -3 When Pa, argon gas with a purity of 99.99% was introduced, the working pressure was 1.5Pa, the sputtering power was 160W, and the deposition time was 5min.

[0034] (2) Copper with a purity of 99.9% is smelted in an intermediate frequency furnace, and the copper melt is added with 2.0% rare earth lanthanum and 5.0% metal zinc by weight. Below the ...

Embodiment 3

[0038] (1) Copper-plated graphene is made by depositing metallic copper on the surface of graphene (layers 1-10) by DC magnetron sputtering. The copper target with a purity of 99.99% was ground with fine sandpaper to remove the surface oxide film before installation, then washed with acetone, dried, and pre-sputtered for 5 minutes before DC magnetron sputtering deposition to remove the metal oxide on the surface of the target. and other impurities to ensure the purity of the copper film deposited on the surface of the subsequent graphene. The process parameters of DC magnetron sputtering are: when the vacuum degree reaches 0.3*10 -3 When Pa, argon gas with a purity of 99.99% was introduced, the working pressure was 1.0Pa, the sputtering power was 100W, and the deposition time was 15min.

[0039] (2) Copper with a purity of 99.9% is smelted in an intermediate frequency furnace. The copper melt is added with 0.5% rare earth lanthanum and 1.0% metal zinc by weight. The rare ear...

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Abstract

The invention relates to a copper coated graphene reinforced copper base electric contact material preparation method. The method comprises steps of graphene copper coating, copper smelting, adding rare earth and metal to a copper melt, graphene alloy melt copper coating, casting molding, stress relief annealing, and processing and forming. As the rare earth is added to the copper alloy, the oxidation resistance and the anti-arc burning ability of the copper alloy electric contact material are improved, the copper coated graphene improves the interfacial wettability between the graphene and the metal, good interface combination is acquired, the electrical conductivity, the thermal conductivity and the anti-arc erosion of the composite material are further improved, and performance requirements of the electric contact can be better met.

Description

technical field [0001] The invention relates to a preparation method of an electrical contact material, in particular to a preparation method of a copper-plated graphene reinforced copper-based electrical contact material. Background technique [0002] The electrical contact material is a key component of the instrument and plays an important role in the life and working reliability of the instrument. Copper-based contact materials have partially replaced silver-based contacts in recent years due to their low price and similar electrical and thermal conductivity to silver, reducing the loss of precious metal silver. However, since the copper contact material is easily oxidized, copper oxide and cuprous oxide with low resistivity are formed, which increases the contact resistance of the contact element and makes it easy to generate heat during use, resulting in the reliability of the contact material. and reduced service life. [0003] The existing patent document (publicat...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01B1/02H01B1/06H01R13/02H01R13/03
CPCH01B1/02H01B1/06H01R13/02H01R13/03
Inventor 冷金凤李志伟陈浩滕新营
Owner 广州东铝轻合金有限公司
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