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Formula and preparation method of epoxy resin based anisotropic conductive adhesive film

An epoxy resin, anisotropic technology, applied in the field of preparation of functional polymer-based composite materials, can solve problems such as high temperature, easily damaged components and substrates, and failure to meet process requirements, etc., to achieve high resin viscosity and increase High cohesive force and high cross-linking density of cured product

Active Publication Date: 2015-06-03
GUANGDONG DANBOND TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

High I / O density requires connection materials to have high line resolution. The traditional tin-lead soldering process can only meet the connection with a spacing greater than 0.065mm, and cannot meet the requirements for high I / O numbers below 0.065mm. High (>230°C), the thermal stress generated is easy to damage components and substrates. With the continuous improvement of device integration, it is obvious that it can no longer meet the process requirements, and there is an urgent need to develop new connecting materials

Method used

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  • Formula and preparation method of epoxy resin based anisotropic conductive adhesive film
  • Formula and preparation method of epoxy resin based anisotropic conductive adhesive film
  • Formula and preparation method of epoxy resin based anisotropic conductive adhesive film

Examples

Experimental program
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Effect test

preparation example Construction

[0029] The preparation process of ACAF is as follows:

[0030] First, surface-treat the conductive particles with part of the silane coupling agent to improve their dispersion in the epoxy resin matrix, that is, weigh a certain amount of conductive particles according to the above formula, add an appropriate amount of active diluent, and ultrasonically stir Then add part of silane coupling agent, and continue to stir the slurry for 3 hours in ultrasonic water bath with timing electric stirrer; then weigh a certain amount of mixed epoxy resin according to the above formula, add the remaining active diluent and coupling agent, After stirring evenly, add curing agent, curing accelerator and gas phase SiO 2 , fully stirred, and mixed evenly; then add the surface-treated conductive particle slurry into the resin mixture, stir well, and mix evenly; finally add stabilizers and tougheners, stir evenly, and then coat. The coating temperature is 80°C-90°C, and it takes 5-7 minutes to coa...

Embodiment 1

[0033] A kind of epoxy resin-based anisotropic conductive adhesive film (ACAF) formula is as follows:

[0034]

[0035] First, weigh 17g of conductive particles according to the above formula, add 20g of PEGGE, add 3g of KH-550 under ultrasonic stirring, and continue to stir the slurry in an ultrasonic water bath with a timing electric stirrer for 3 hours; then weigh 100g according to the above formula and mix Epoxy resin, add the remaining 15g of PEGGE and 2g of KH-550, stir well and then add 12g of dicyandiamide, 4g of chlorourea and 3g of gas-phase SiO 2 , fully stirred, and mixed evenly; then the surface-treated conductive particle slurry was added to the resin mixture, fully stirred, and mixed evenly; finally, 2.5g of N-phenyl-β-naphthylamine / 2.5g of 2,6 -Di-tert-butyl-p-cresol and 25g of carboxyl-terminated liquid butyronitrile-22, stirred evenly and then coated.

[0036] Coat it on the surface-treated polyester film on the coating machine. The temperature of the dry...

Embodiment 2

[0044] The difference between this example and Example 1 is only: the curing accelerator chlorourea in Example 1 is replaced by 2,4,6-three (dimethylaminomethyl) phenol (DMP-30) 2-ethylhexanoic acid) salt, consumption is 4g, and others all remain unchanged, and test result is as follows:

[0045] Curing temperature: 130°C

[0046] Curing time: 30s

[0047] Storage period (25℃): 45days

[0048] Peel strength: 16N / cm

[0049] On-resistance: 4Ω

[0050] Insulation resistance: 5.8×10 11 Ω

[0051] From the results of Example 1 and Example 2, it can be seen that both curing accelerators can effectively reduce the curing temperature of epoxy resin and shorten the curing time, especially the catalytic effect of chlorourea is more significant, but it also makes the resin glue The pot life of the solution is shortened by 3-6 weeks. Although the catalytic effect of DMP-30 tris (2-ethylhexanoic acid) salt is slightly inferior to that of chlorourea, it not only does not affect the ...

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Abstract

The invention discloses a formula and preparation method of an epoxy resin based anisotropic conductive adhesive film. The formula comprises the following components in parts by weight: 28-32 parts of liquid bisphenol-A epoxy resin, 13-17 parts of solid bisphenol-A type epoxy resin, 18-22 parts of bisphenol-F epoxy resin, 18-22 parts of bisphenol-S epoxy resin, 13-17 parts of linear phenolic epoxy resin, 10-25 parts of conductive particles, 11-13 parts of a latent curing agent dicyandiamide, 2-6 parts of a curing accelerator, 2-4 parts of a dispersant, 4-6 parts of a stabilizer, 25-30 parts of a toughening agent, 30-35 parts of a thinner, and 4-6 parts of a silane coupling agent. The preparation method is implemented by using the formula. Experiments show that an ACAF formula obtained finally has good storage stability and thermal stability, and can be rapidly cured at low temperature, and the mechanical and electrical properties and the like of the ACAF formula also can satisfy the use requirements.

Description

technical field [0001] The invention relates to a formula and preparation method of anisotropic conductive adhesive film (ACAF), which belongs to the field of preparation of functional polymer-based composite materials, and is mainly used in the packaging and interconnection of flexible circuits and electronic components, as well as liquid crystal displays and The connection between the drive circuit and the chip. Background technique [0002] With the rapid development of microelectronics technology and its increasingly broad application prospects, the requirements for the integration of integrated circuits are getting higher and higher, the size of electronic components and lead spacing are continuously shrinking, and the density of packaging is constantly increasing while the volume is relatively small. . High I / O density requires connection materials to have high line resolution. The traditional tin-lead soldering process can only meet the connection with a spacing grea...

Claims

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Application Information

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IPC IPC(8): C09J7/00C09J9/02C09J163/02C09J163/00C09J11/04C09J11/06C09J11/08C09J11/00C08G59/50
Inventor 张双庆
Owner GUANGDONG DANBOND TECH
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