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Adhesive composition, adhesive film, adhesive film roll and preparation methods thereof

A technology of adhesives and compositions, applied in the direction of non-polymer adhesive additives, adhesives, adhesive types, etc., can solve the problem of lowering the relative dielectric constant of the adhesive film, difficulty in obtaining high dielectric properties, It is difficult to improve the dielectric constant and other problems, and achieve the effect of high relative dielectric constant, no bubbles, and improved compatibility

Inactive Publication Date: 2015-05-06
CHAOZHOU THREE CIRCLE GRP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] It is difficult for the adhesive compositions made by the above-mentioned prior art to obtain corresponding high dielectric properties. The main reason is that the organic resin is difficult to be polarized due to its own chemical bond characteristics, and its dielectric constant is difficult to increase.
It is also difficult to achieve the relative permittivity ε by adding powders such as alumina and silicon oxide to organic matter. r The requirement of ≥6 is because the dielectric constant of aluminum oxide, silicon oxide and other powders is low, and the relative dielectric constant of the adhesive film is further reduced after adding organic resin
In addition, ordinary adhesive glue is prone to defects such as air bubbles during the packaging process, which will interfere with signal transmission.

Method used

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  • Adhesive composition, adhesive film, adhesive film roll and preparation methods thereof

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Experimental program
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Effect test

Embodiment 1

[0026] An embodiment of the adhesive film of the present invention, the adhesive composition used to prepare the adhesive film includes the following components by weight: barium titanate (BaTiO 3 ) 50 parts, titanium dioxide (TiO 2 ) 10 parts, 1.0 parts of lecithin dispersant, 5 parts of silane coupling agent KH-550, 8 parts of toluene, absolute ethanol, butanone, 20 parts of SBS resin, 80 parts of epoxy resin, 1 part of dicyandiamide , 0.2 parts of imidazole curing accelerator.

[0027] The high dielectric ceramic powder is barium titanate (BaTiO 3 ), the dispersant is a lecithin dispersant, the coupling agent is a silane coupling agent KH-550, the organic solvent is a mixture of toluene, dehydrated alcohol and butanone, and the matrix resin is styrene- The mixture of butadiene block copolymer (SBS) resin and epoxy resin, the curing agent is dicyandiamide, the curing accelerator is imidazoles, and the toner is titanium dioxide.

[0028] A kind of embodiment of the prepara...

Embodiment 2

[0034] An embodiment of the adhesive film of the present invention, the adhesive composition used to prepare the adhesive film includes the following components by weight: barium strontium titanate (Sr 0.2 Ba 0.8 TiO 3 ) 60 parts, 5 parts of superfine amorphous carbon black, 1.0 parts of dispersant KD-1, 5 parts of silane coupling agent KH-560, 6 parts each of toluene, isopropanol, and ethylene glycol monobutyl ether, SBS 20 parts of resin, 80 parts of polyurethane modified epoxy resin, 3 parts of diaminodiphenyl sulfone, and 0.5 parts of imidazole curing accelerator.

[0035] The high dielectric ceramic powder is barium strontium titanate (Sr 0.2 Ba 0.8 TiO 3 ), the dispersant is dispersant KD-1, the coupling agent is silane coupling agent KH-560, the organic solvent is a mixture of toluene, isopropanol and ethylene glycol monobutyl ether, and the matrix resin It is a mixture of SBS resin and polyurethane modified epoxy resin, the curing agent is diaminodiphenyl sulfone,...

Embodiment 3

[0042] An embodiment of the adhesive film of the present invention, the adhesive composition used to prepare the adhesive film includes the following components by weight: calcium zirconate titanate barium (Ca 0.2 Ba 0.8 Zr 0.1 Ti 0.9 o 3 ) 40 parts, titanium dioxide (TiO 2 ) 15 parts, dispersant KD-4 is 1.0 parts, titanate coupling agent TM-33 is 3 parts, toluene, butyl acetate, ethylene glycol monobutyl ether are 6 parts each, polyvinylidene fluoride (PVDF) 20 parts, 80 parts of modified epoxy resin, 2 parts of diaminodiphenyl sulfone, and 1 part of organic urea.

[0043] The high dielectric ceramic powder is calcium barium zirconate titanate (Ca 0.2 Ba 0.8 Zr 0.1 Ti 0.9 o 3 ), the dispersant is dispersant KD-4, the coupling agent is titanate coupling agent TM-33, and the organic solvent is a mixture of toluene, butyl acetate and ethylene glycol monobutyl ether, so The matrix resin is a mixture of polyvinylidene fluoride (PVDF) and modified epoxy resin, the curing ...

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Abstract

The invention provides an adhesive film. The adhesive film has the characteristic of simple assembling, the adhesive film also has the characteristics of high relative dielectric constant, good light proofness, adjustable color, strong adhesive strength, and the like, and the relative dielectric constant in over 6, therefore, the adhesive film is especially applicable to the adhering of capacitive fingerprint recognition chip module encapsulation. The adhesive film is a semi-cured adhesive film which has low viscosity at room temperature, but has high viscosity in the process of thermal curing; compared with a common dispensed adhering mode, the adhesive film provided by the invention has the advantages of uniform film-forming thickness, controllable adhering shape, no bubble produced, simple assembling process, and the like, therefore, the adhesive film is especially suitable for plane adhesive assembly. The invention provides an adhesive composition for forming the adhesive film. The adhesive composition has the characteristics of high relative dielectric constant, and the like. The invention also provides an adhesive film roll. The adhesive film is protected by covering PET release liner or release paper on both sides of the adhesive film in the adhesive film roll, thereby preventing the environment from polluting the adhesive film.

Description

technical field [0001] The present invention relates to an adhesive composition, in particular to an adhesive composition with a high dielectric constant, an adhesive film formed from the adhesive composition, and an adhesive composed of the adhesive film Film rolls and their method of manufacture. Background technique [0002] The relative dielectric constant of the adhesive film currently on the market is very low. For example, a kind of adhesive film is mentioned in the patent CN201310258538.8, which is characterized by a low relative dielectric constant (about 2.0) and is a transparent material; the patent The adhesive film mentioned in CN 201110301385.1 is obtained by adding alumina powder. Due to the low dielectric constant of alumina, the relative permittivity of the obtained adhesive film is small, which obviously cannot satisfy the relative permittivity ε r ≥6 requirements. Patent CN201010003397.1 mentions a method for preparing an adhesive tape, but it is mainly ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C09J163/00C09J153/02C09J183/04C09J127/08C09J133/00C09J11/04C09J11/06C09J7/00C09J7/02
Inventor 马艳红徐苏龙林莅蒙
Owner CHAOZHOU THREE CIRCLE GRP
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