Method for bonding conductive geometric structures onto ceramic substrates and resulting components and metamaterials

A technology of conductive geometric structure and ceramic substrate, which is applied in the field of cast sheet-ceramic substrate components and metamaterials, can solve the problems of inability to solve the shape of conductive geometric structure, pollute non-dense ceramic plates, and difficulty in obtaining large thickness, and achieve Reduce the risk of fracturing, avoid sintering deformation, and reduce the effect of sintering shrinkage

Active Publication Date: 2017-03-01
KUANG CHI INST OF ADVANCED TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

But this method also has disadvantages: the interface bonding strength is low, and electroplating will also contaminate non-dense ceramic plates
[0006] (3) Selective electroless plating also has similar defects
However, this technology is difficult to obtain a large thickness, and there is a problem of sintering deformation
[0009] That said, prior art methods of applying conductive geometries on ceramic substrates suffer from various deficiencies, in particular the inability to address the poor shape and dimensional stability of the conductive geometries

Method used

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  • Method for bonding conductive geometric structures onto ceramic substrates and resulting components and metamaterials
  • Method for bonding conductive geometric structures onto ceramic substrates and resulting components and metamaterials
  • Method for bonding conductive geometric structures onto ceramic substrates and resulting components and metamaterials

Examples

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Effect test

no. 1 example

[0077] Such as figure 1 As shown, a planar ceramic substrate 102 is used, the planar ceramic substrate is made of fused silica ceramics by gel injection molding, its porosity is 14%, and the surface is finished to a surface roughness of Ra=0.8. The casting sheets 101, 101' for making green strips contain fused silica powder (average particle size is 3 microns) and dielectric glass powder (available from Beixu Electronics Co., Ltd.), and are made by tape casting, and their thickness is 200 microns . The percentage of glass powder is 15wt% (relative to quartz powder + glass powder).

[0078] Tackifying resin 104 (carbon five petroleum resin, available from Foshan Baolin Chemical Industry Co., Ltd.) is formulated into an organic solution with an organic solvent such as xylene or butanone. Apply the viscous organic solution of the tackifying resin 104 on the surface of the ceramic substrate 102 by spraying, and the thickness after drying is preferably 10-15 microns. Afterwards,...

no. 2 example

[0082] Such as figure 2 As shown, a planar ceramic substrate 202 is used, the planar ceramic substrate is made of fused silica ceramics by gel injection molding, its porosity is 14%, and the surface is finished to a surface roughness of Ra=0.8. The casting sheets 201, 201' for making the green strips contain fused silica powder (average particle size is 3 microns) and dielectric glass powder (available from Beixu Electronics Co., Ltd.), made by tape casting, and its thickness is 200 microns . The percentage of glass powder is 15wt% (relative to quartz powder + glass powder).

[0083] The difference from the first embodiment is that the silver-based microstructure 203 is screen-printed on the casting sheet 201 first, and then a layer of blank casting sheet 201' is artificially superimposed, and vacuum hot pressing (also called "pre-lamination") The way (pressure 20Mpa, temperature 70 ℃) to produce a double-cast sheet green tape with a conductive geometric structure, high pre...

no. 3 example

[0088] Such as image 3 As shown, a curved ceramic substrate 302 is used, the curved ceramic substrate is made of fused silica ceramics by gel injection molding, its porosity is 14%, and the surface is finished to a surface roughness of Ra=0.8. The curved ceramic substrate 302 is tile-shaped and has coaxial inner and outer surfaces. The casting sheet 301, 301' for making the green belt contains fused silica powder (average particle size is 3 microns) and dielectric glass powder (available from Beixu Electronics Co., Ltd.), and is made by tape casting, and its thickness is 200 microns . The percentage of glass powder is 15wt% (relative to quartz powder + glass powder).

[0089] First screen-print the silver-based microstructure 303 on the casting sheet 301, then manually superimpose a layer of blank casting sheet 301', and use vacuum hot pressing (also called "pre-pressing") (pressure 20Mpa, temperature 70°C ) to produce a double-cast sheet green tape with a conductive geome...

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Abstract

The invention relates to a method for laminating a conductive geometric structure to a ceramic substrate as well as a module and a metamaterial which are obtained by adopting the method provided by the invention. The method for laminating the conductive geometric structure to the ceramic substrate comprises the following steps: preparing a tape casting slice containing the conductive geometric structure; coating tackifying resin on the surface of the ceramic substrate; pasting the tape casting slice containing the conductive geometric structure on the surface of the ceramic substrate by utilizing the tackifying resin; laminating the tape casting slice on the ceramic substrate; and sintering the tape casting slice and the ceramic substrate. The method for laminating the conductive geometric structure to the ceramic substrate has the beneficial effects that sintering of the conductive geometric structure is controlled by the ceramic substrate, so that shape and dimensional stability of the conductive geometric structure can be improved, sintering deformation of the conductive geometric structure is avoided, and sintering shrinkage of the conductive geometric structure in the X and Y directions is greatly reduced.

Description

technical field [0001] The present invention relates to a method for laminating conductive geometric structures onto ceramic substrates, as well as cast sheet-ceramic substrate assemblies and metamaterials produced according to the method. Background technique [0002] How to introduce the conductive geometric structure into the ceramic matrix, and how to control the shape and dimensional stability of the conductive geometric structure, are issues of concern in the field of metamaterials and high temperature resistant radome. [0003] In the prior art, methods for imposing conductive geometries on sintered ceramic substrates (flat or curved) are: [0004] (1) Under a certain temperature and a protective atmosphere, the copper foil is covered, and then etched into a conductive geometric structure. However, copper is easy to oxidize and requires a protective gas. Copper oxidizes on its surface and forms a low melting point phase (binder) with the base ceramic. The process co...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C04B37/02
Inventor 不公告发明人
Owner KUANG CHI INST OF ADVANCED TECH
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