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High-thermal conductivity high-performance aluminum-based copper-clad plate and preparation method thereof

An aluminum-based copper clad, high thermal conductivity technology, applied in the field of copper clad laminates, can solve problems such as unsatisfactory heat resistance, achieve excellent electrical and mechanical properties, simple preparation process, and environmental friendliness

Inactive Publication Date: 2014-12-24
DONGHUA UNIV +2
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

But its heat resistance is not ideal enough

Method used

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  • High-thermal conductivity high-performance aluminum-based copper-clad plate and preparation method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0035] Put 10 grams of KH-550 silane coupling agent and 300 grams of distilled water into a beaker, stir and mix evenly, add alumina powder, stir and react at 60°C for 1 hour, and centrifuge to obtain KH-550 silane coupling agent Surface-treated alumina powder, denoted as A-550.

[0036] According to the above formula and process, use other inorganic fillers (aluminum nitride powder, beryllium oxide powder, magnesium oxide powder, titanium dioxide powder, silicon dioxide powder, silicon carbide powder, boron nitride powder) to replace the alumina powder for the surface of the inorganic filler. After treatment, aluminum nitride powder, beryllium oxide powder, magnesium oxide powder, titanium dioxide powder, silicon dioxide powder, silicon carbide powder, and boron nitride powder that were surface-treated with KH-550 silane coupling agent were obtained, which were recorded as AN-550 in sequence , Be-550, M-550, T-550, S-550, SC-550, BN-550.

[0037] Put 10 grams of KH-560 silan...

Embodiment 2

[0040] Put 100 grams of KH-550 silane coupling agent and 3000 grams of distilled water into a stainless steel basin, stir and mix evenly, then immerse in an aluminum plate, take it out after immersing at 60°C for 1 hour, and dry it to obtain a surface treated with KH-550 silane coupling agent. The treated aluminum plate is denoted as AP-550.

[0041] Put 100 grams of KH-560 silane coupling agent, 3000 grams of distilled water, and 1000 grams of ethanol into a stainless steel basin, stir and mix evenly, then immerse in an aluminum plate, take it out after immersing at 60 ° C for 1 hour, and dry it to obtain KH-560 silane The aluminum plate with coupling agent surface treatment is denoted as AP-560.

Embodiment 3

[0043] Mix 100 g of N,N,N',N',0,0'-hexaglycidyl-2,2-bis(3-amino-4-hydroxyphenyl)hexafluoropropane with 5 g of 1,4-bis Put (2,4-diaminophenoxy)benzene into the reaction kettle, heat it to 60°C, stir the reaction until it is homogeneous, add 100 grams of resorcinol diglycidyl ether epoxy resin and 260 grams of A-550 10 grams of AN-560, stirred evenly at 60°C to obtain component A, denoted as A-1;

[0044] Mix 200 grams of methyltetrahydrophthalic anhydride and 30 grams of AN-560, and stir until uniform at room temperature to obtain component B, denoted as B-1;

[0045] Mix and stir the above-mentioned components A-1 and B-1 evenly to obtain a high thermal conductivity electrical insulating adhesive, which is designated as TCA-1.

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Abstract

The invention relates to a high-thermal conductivity high-performance aluminum-based copper-clad plate and a preparation method thereof. The copper-clad plate is composed of copper foil, a high-thermal conductivity electric insulating paste and an aluminum plate. The preparation method comprises the following steps: mixing multifunctional fluorine-containing epoxy resin with 1,4-di(2,4-diamino phenoxy) benzene for reacting, adding resorcinol diglycidyl ether epoxy resin and partial inorganic filler, and uniformly stirring and mixing to obtain a component A; uniformly mixing and stirring methyl tetrahydrophthalic anhydride and inorganic filler to obtain a component B; and uniformly mixing and stirring the component A and the component B to obtain the high-thermal conductivity electric insulating paste, then uniformly applying the high-thermal conductivity electric insulating paste onto the surface of the copper foil and the aluminum plate, and pressing and curing by a high-temperature panel pressing machine, thereby obtaining the high-thermal conductivity high-performance aluminum-based copper-clad plate. The operation process is simple; with the green and clean production process, a solvent is avoided, and the copper-clad plate has an environment-friendly effect; the copper-clad plate is wide in application range and has good market prospects, and the large-scale mass production can be easily carried out.

Description

technical field [0001] The invention belongs to the field of copper clad boards, in particular to an aluminum-based copper clad board with high thermal conductivity and high performance and a preparation method thereof. Background technique [0002] Copper clad laminate technology and production have experienced more than half a century of development history. Now it has become an important part of basic materials in electronic information products. Copper-clad laminate manufacturing is a sunrise industry, and it has broad prospects along with the development of electronic information and communication industries. Copper clad laminate manufacturing technology is a multidisciplinary technology with high technology. The development of electronics industry technology in the past century shows that copper clad laminate technology is often one of the key aspects to promote the development of the electronics industry. Its progress and development are constantly driven by the in...

Claims

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Application Information

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IPC IPC(8): B32B15/01B32B15/20B32B7/12B32B38/18B32B37/06B32B37/10B32B37/12C09J163/00C09J11/06
Inventor 虞鑫海童超梅吴冯沈海平
Owner DONGHUA UNIV
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