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Multilayer printed circuit board structure

A multi-layer printing and circuit board technology, which is applied to printed circuits, printed circuit parts, circuit substrate materials, etc., can solve the problems of reduced prepreg attachment area, poor thermal conductivity and moisture resistance, and high cost of copper foil to achieve heat resistance Good effect, low hygroscopicity, non-explosive board effect

Inactive Publication Date: 2014-09-24
叶云照
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  • Claims
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AI Technical Summary

Problems solved by technology

[0004] However, this manufacturing method is made by processing copper foil substrates. In addition to the high cost of copper foil, after prepreg, the adhesion area of ​​the prepreg is often reduced, resulting in reduced viscosity, poor thermal conductivity and moisture resistance. And it is easy to have a board burst problem during the installation process

Method used

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  • Multilayer printed circuit board structure

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Embodiment Construction

[0021] In order to further understand the present invention, the preferred embodiments are given below, and with the help of the accompanying drawings and figure numbers, the specific components of the present invention and the effects achieved are described in detail as follows.

[0022] see figure 1 , which is a schematic diagram of the structure of one of the embodiments of the present invention, which is composed of an aluminum foil base layer 1, a first prepreg 2, an aluminum foil intermediate layer 3, a second prepreg 4 and a copper foil surface layer 5 composition.

[0023] see figure 1 , the first prepreg 2 is combined on the aluminum foil base layer 1, the aluminum foil intermediate layer 3 is combined on the first prepreg 2; the second prepreg 4 is combined on the aluminum foil intermediate layer 3, and the The copper foil surface layer 5 is combined on the second prepreg 4 .

[0024] Both the first prepreg 2 and the second prepreg 4 are made of a fiber cloth impr...

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Abstract

The invention discloses a multilayer printed circuit board structure which is obtained through successively stacking the components of: an aluminum foil base layer, a first prepreg, an aluminum foil middle layer, a second prepreg and a copper foil surface layer, wherein the first prepreg and the second prepreg are respectively prepared through dipping fiber cloth into a heat-conductive material, so that the heat-conductive material can be filled in the gaps of the fiber cloth, wherein the heat-conductive material is prepared through mixing a resin and a filler at least. According to the multilayer printed circuit board structure, through stacking and combining the aluminum foil base layer, the first prepreg, the aluminum foil middle layer, the second prepreg and the copper foil surface layer, and through the resin component contained in the first prepreg and the second prepreg, the multilayer printed circuit board structure can possess the advantages of: high heat conductivity, low moisture absorption property, high heat resistance, high melting point, low dielectric constant, low dielectric loss coefficient, no easy board delamination, etc.

Description

technical field [0001] The invention relates to a circuit board structure, especially a circuit board structure, which has the advantages of thermal conductivity, low moisture absorption, good heat resistance, high melting point, low dielectric constant, low dielectric loss coefficient, and is not easy to form a board. It is especially suitable for Multi-layer printed circuit board structure used for light-emitting diode substrates. Background technique [0002] In recent years, the trend of electronic instruments is towards high performance, and smaller weight, thickness, length and size. Printed wiring boards have made rapid progress, such as more layers, thinner insulating layers, and higher density. Therefore, the materials that make up the printed wiring board need to be strengthened in terms of water absorption and heat resistance, high dimensional stability, and long-term insulation. [0003] At present, the printed circuit board is usually impregnated with a kind of...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K1/00H05K1/03
Inventor 叶云照洪汉祥马玉盈
Owner 叶云照
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