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Hot melt adhesive containing water-soluble nanoscale silica sol and preparation method thereof

A nano-scale silica sol, water-soluble technology, applied in the direction of adhesives, adhesive types, polyurea/polyurethane adhesives, etc., can solve problems such as high melting point and hardness, limited use, poor strength and elasticity, and achieve fluidity Good performance, enhanced bonding ability, and the effect of increasing the softening point temperature

Inactive Publication Date: 2015-01-21
马鞍山市中澜橡塑制品有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0002] Hot melt adhesive is a solvent-free solid adhesive with thermoplastic resin as the main component. Because hot melt adhesive has fast bonding speed, non-toxicity, simple bonding process and good bonding strength and flexibility, etc. Advantages, it can bond various materials such as wood, paper, fiber, metal, plastic stools, and has a wide range of applications, especially in the fiber industry, packaging industry and binding industry, but most hot melt adhesives are used Polyester, polyamide and other hot-melt resins, due to the poor strength and elasticity of polyester hot-melt adhesives, can not withstand too much external force, and because of the high melting point and hardness of polyamide hot-melt adhesives, so in use Restricted

Method used

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Examples

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Effect test

Embodiment 1

[0012] Embodiment 1: Containing the hot-melt adhesive of water-soluble nano-scale silica sol, the parts by weight (kg) of its constituent raw materials are: thermoplastic polyurethane elastomer 35, isotactic polypropylene resin 32, chlorinated EVA 15, ethylene-ethyl acrylate Resin 35, water-soluble nano-scale silica sol 32, mixed powder 16, kaolin 30, 4,4-methylenebis(2,6-di-tert-butylphenol) 1.6, vinyltriethoxysilane 0.8, benzene Dibutyl formate 0.3, triethanolamine 2.8. The mixed powder is prepared by mixing cotton fiber powder, polypropylene fiber powder, iron powder, wood fiber powder and paper pulp powder in equal parts by weight.

[0013] The preparation method of the hot-melt adhesive that contains water-soluble nano-scale silica sol, comprises the following steps:

[0014] (1) Mix the raw materials evenly to obtain the mixed materials;

[0015] (2) Put the material into the co-rotating parallel combined twin-screw extruder to extrude and granulate. Set the barrel hea...

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PUM

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Abstract

The invention discloses a hot melt adhesive containing a water-soluble nanoscale silica sol and a preparation method thereof. The hot melt adhesive comprises the following raw materials by weight part: 30-40 of a thermoplastic polyurethane elastomer, 30-35 of isotactic polypropylene resin, 13-18 of chlorinated EVA, 33-38 of ethylene-ethyl acrylate resin, 30-35 of the water-soluble nanoscale silica sol, 15-17 of mixed powder, 25-35 of kaolin, 1.5-1.7 of 4, 4-methylenebis(2, 6-di-tert butylphenol), 0.7-0.9 of vinyl triethoxy silane, 0.2-0.4 of dibutyl phthalate, and 2.5-3.0 of triethanolamine. The hot melt adhesive provided in the invention has a reasonable formula, adopts the thermoplastic polyurethane elastomer, the isotactic polypropylene resin, the chlorinated EVA and the ethylene-ethyl acrylate resin as main materials together, their respective excellent performances are combined. Also, the mixed powder is added in the raw materials, so that the softening point temperature of the prepared hot melt adhesive is raised. Meanwhile, the water-soluble nanoscale silica sol and kaolin are added to increase the bonding strength of the hot melt adhesive, which can have good fluidity. The hot melt adhesive disclosed in the invention has the advantages of environmental protection, safety, weatherability and low cost.

Description

technical field [0001] The invention relates to the field of polymer material processing, in particular to a hot melt adhesive containing water-soluble nano-scale silica sol and a preparation method thereof. Background technique [0002] Hot melt adhesive is a solvent-free solid adhesive with thermoplastic resin as the main component. Because hot melt adhesive has fast bonding speed, non-toxicity, simple bonding process and good bonding strength and flexibility, etc. Advantages, it can bond various materials such as wood, paper, fiber, metal, plastic stools, and has a wide range of applications, especially in the fiber industry, packaging industry and binding industry, but most hot melt adhesives are used Polyester, polyamide and other hot-melt resins, due to the poor strength and elasticity of polyester hot-melt adhesives, can not withstand too much external force, and because of the high melting point and hardness of polyamide hot-melt adhesives, so in use aspects are res...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C09J175/04C09J123/12C09J123/08C09J123/28C09J11/04B29C47/92B29B9/06B29C48/92
CPCB29C47/92B29C48/92B29C2948/9259B29C2948/92704B29C2948/92885B29C2948/92895
Inventor 陈贤锋阚蕾申大伟沈根骆敏申丽霞陈玉娟沈春花沈红梅
Owner 马鞍山市中澜橡塑制品有限公司
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