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LED (Light Emitting Diode) ceramic substrate-based lamp and manufacturing method thereof

A technology of ceramic substrate and manufacturing method, which is applied in the direction of lampshade, parts of lighting device, lighting and heating equipment, etc., can solve the problems of inability to reflect out, overloaded chip heat dissipation, low reflection efficiency, etc., so as to improve the reflection efficiency and diffusion surface , the effect of changing the heat reflection effect, and the effect of enhancing the light penetration

Inactive Publication Date: 2013-05-01
深圳市文卓绿色环保科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0002] The aluminum and copper plates used in LED lamps not only need to use a large amount of rare metals as raw materials, but also exposed many problems during use: 1. It often causes chip heat dissipation overload and malfunctions; 2. LEDs are plugged in. There will be hidden dangers of leakage, and aluminum plates and copper plates are all metal products without insulation effect, which will pose hidden dangers to safety; 3. LEDs will generate a lot of heat during work, and return to normal temperature when they are not working. Shrinkage, long time will cause aging of the metal machine board
However, LED lamps all use DC power supply as the driver. This technology has the following two problems: 1. The DC power supply is composed of various electronic components such as resistors, inductors, capacitors, etc., which are prone to failure and cause the entire drive to fail to work normally; 2. 1. The volume, weight of the lamp is super large and overweight, and the DC power supply, especially the high-power DC power supply, will bring larger volume, space and heavier weight to the entire lamp, which will bring more problems to the production, transportation, installation and other operations. inconvenient
LED lamps all use steel, aluminum and other metals as reflector raw materials, which have the following two problems: 1. Low reflection efficiency, low lamp efficiency, resulting in a lot of light waste, unable to effectively reflect the light emitted by LEDs; 2. LEDs will generate a lot of heat when they work, and if they work at high temperature for a long time, the metal materials of steel and aluminum lamps will have problems such as oxidation and aging; 3. LEDs are mainly white light, and the penetrating power of white light is weak, while ordinary steel and aluminum Metal materials such as can't change their color temperature

Method used

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  • LED (Light Emitting Diode) ceramic substrate-based lamp and manufacturing method thereof
  • LED (Light Emitting Diode) ceramic substrate-based lamp and manufacturing method thereof
  • LED (Light Emitting Diode) ceramic substrate-based lamp and manufacturing method thereof

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Embodiment Construction

[0026] like figure 1 Shown, a kind of lamp manufacturing method based on LED ceramic substrate, comprises the following steps:

[0027] (1) Set up a pressing mold, use NPO ceramic powder to dry press the powder, and use the press to form a shaped ceramic body;

[0028] (2) Sinter the formed ceramic body in a vertical sintering furnace at 1300 degrees Celsius for 24 hours;

[0029] (3) Grinding the sintered ceramic body with a grinder to form a flat ceramic substrate;

[0030] (4) Design the circuit wiring diagram, and use the silver screen printing machine to screen-print the silver paste on the ceramic substrate;

[0031] (5) Lay silver foil at the welding point as a pad;

[0032] (6) Baking the silver-finished ceramic substrate in a tunnel furnace at a temperature of 800 degrees Celsius;

[0033] (7) Manufacture a reflector made of steel or aluminum. The reflective surface of the reflector is aluminum or silver. The surface of the base material of the reflective surface ...

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PUM

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Abstract

The invention provides a manufacturing method of an LED (Light Emitting Diode) ceramic substrate-based lamp. The manufacturing method comprises the following steps of: forming a pressing molding mold; performing dry-pressing molding on powder by using NPO (Negative-Positive-Zero) ceramic powder; forming a formed ceramic body by using a press; placing the formed ceramic body in a vertical sintering furnace for sintering; grinding the sintered ceramic body by using a grinding machine to form a flat plate-shaped ceramic substrate; designing a circuit wiring diagram; performing silk-screen printing of silver paste on the ceramic substrate by using a silver silk screen printer; laying a silver foil at the position of a welding point as a bonding pad; roasting the ceramic substrate which is subjected to the silk-screen printing of the silver paste by using a tunnel furnace. According to the manufacturing method, the ceramic is used as a substrate raw material; the lamp has the advantages of excellent heat conduction, insulation, erosion resistance and surface characteristic performance; by using a power scheme of ACLED (Alternating Current Light Emitting Diode), the failure rate is low, and the stability of the lamp is improved; and a nanometer machining process is used for performing surface treatment on a reflecting cover, and a nanometer material is used as a raw material for the reflecting cover, so that the lamp has superior light reflection and thermal reflection effects and a function of changing color temperature of a light source.

Description

technical field [0001] The invention relates to the field of lamps, in particular to an LED lamp and a manufacturing method thereof. Background technique [0002] The aluminum and copper plates used in LED lamps not only need to use a large amount of rare metals as raw materials, but also exposed many problems during use: 1. It often causes chip heat dissipation overload and malfunctions; 2. LEDs are plugged in. There will be hidden dangers of leakage, and aluminum plates and copper plates are all metal products without insulation effect, which will pose hidden dangers to safety; 3. LEDs will generate a lot of heat during work, and return to normal temperature when they are not working. Shrinkage will cause aging of the metal machine board for a long time. However, LED lamps all use DC power supply as the driver. This technology has the following two problems: 1. The DC power supply is composed of various electronic components such as resistors, inductors, capacitors, etc.,...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): F21S2/00F21V3/04F21V3/02H01L33/48H01L33/60F21Y101/02
Inventor 李妙文
Owner 深圳市文卓绿色环保科技有限公司
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