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Epoxy resin silica sol, epoxy resin organic-inorganic nano hybrid material and preparation method thereof

An epoxy resin curing and epoxy resin technology, which is applied in the field of epoxy resin silica sol preparation, can solve problems such as poor processability and poor particle dispersion stability, and achieve the effects of excellent insulation performance, uniform and stable dispersion, and stable material quality.

Active Publication Date: 2013-04-17
上海上惠纳米科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] The object of the present invention is to address above-mentioned deficiencies, provide a kind of epoxy resin silica sol and preparation method thereof, adopt this method to prepare epoxy resin silica sol, solve particle dispersion stability poor in the process of nano particle filling modified epoxy resin, processing gender issues, etc.

Method used

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  • Epoxy resin silica sol, epoxy resin organic-inorganic nano hybrid material and preparation method thereof
  • Epoxy resin silica sol, epoxy resin organic-inorganic nano hybrid material and preparation method thereof

Examples

Experimental program
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Effect test

Embodiment 1

[0026] Embodiment 1: a kind of epoxy resin silica sol that this embodiment provides, it is made of following components: epoxy resin, organosilicon, silane coupling agent, organic solvent, ammoniacal liquor, wherein the mole of each component The ratio is: epoxy resin 1: organosilicon 0.1-2: silane coupling agent 0.01-2: organic solvent 0.9-18: ammonia water 0.001-0.06.

[0027] The organosilicon is one of methyl orthosilicate, ethyl orthosilicate and butyl orthosilicate.

[0028] The organic solvent is one of N,N-dimethylformamide, acetone, butanone and toluene.

[0029] The silane coupling agent is γ-aminopropyltriethoxysilane, γ-glycidyloxypropyltrimethoxysilane, γ-(methacryloyloxy)propyltrimethoxysilane, N- One of (β-aminoethyl)-γ-aminopropyltrimethoxysilane.

[0030] Described epoxy resin is bisphenol A type epoxy resin, bisphenol F type epoxy resin, bisphenol S type epoxy resin, bisphenol AD ​​type epoxy resin, novolak type epoxy resin, cycloaliphatic epoxy resin One ...

Embodiment 2

[0041] Embodiment 2: This embodiment provides a kind of epoxy resin silica sol and preparation method thereof, and its step is basically the same as embodiment 1, and its difference is:

[0042] Epoxy resin silica sol component and preparation method thereof, specifically the following proportions and steps:

[0043] (1) Take 7.6ml (0.034mol) of tetraethyl orthosilicate and dissolve it in 60ml (0.78mol) of N,N-dimethylformamide to make a mixed solution;

[0044] (2) Measure 10ml (0.13mol) of N,N-dimethylformamide in a three-necked flask, add 0.936ml (0.0040mol) of γ-aminopropyltriethoxysilane and 0.12ml of ammonia water to prepare into a mixed solution;

[0045] (3) Under the condition of mechanical stirring, through the dropping funnel, at room temperature, in the solution prepared in step (2), slowly drop into the mixed solution prepared in step (1), the rate of addition is controlled to be 15- 20s / drop, the stirring speed is 100-200r / min, after the dropwise addition is co...

Embodiment 3

[0051] Embodiment 3: see figure 1 , the epoxy resin silica sol provided in the present embodiment and preparation method thereof, its steps are basically the same as in Embodiment 1, 2, and its difference is:

[0052] Components and preparation methods of epoxy resin silica sol, which are specifically the following ratios and steps:

[0053] (1) Take 7.6ml (0.084mol) of tetraethyl orthosilicate and dissolve it in 60ml (0.76mol) of N,N-dimethylformamide to make a mixed solution;

[0054] (2) Measure 10ml (0.13mol) of N,N-dimethylformamide in a three-necked flask, add 0.936ml (0.011mol) of γ-aminopropyltriethoxysilane and 0.32ml of ammonia water to prepare into a mixed solution.

[0055] (3) Under the condition of mechanical stirring, slowly drop the mixed solution prepared in step (1) into the solution prepared in step (2), after the addition is completed, add epoxy resin, and stir for 10 ~ 12 hours;

[0056] (4) Transfer the mixed solution prepared in step (3) to a beaker,...

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Abstract

The invention discloses epoxy resin silica sol which is characterized by being prepared from the following components: epoxy resin, organic silicon, silane coupling agent, organic solvent and ammonia water at a molar ratio of 1:(0.1-2):(0.01-2):(0.9-18):(0.001-0.06). The invention also discloses a preparation method of the epoxy resin silica sol. The invention also discloses an epoxy resin organic-inorganic nano hybrid material adopting the epoxy resin silica sol, which is characterized in that the epoxy resin curing agent is one or more of methylhexahydrophthalic anhydride, methylhexahydrophthalic anhydride acid, 4,4-diaminodiphenylmethane and 4,4-diamino diphenyl sulfone. The invention also discloses a preparation method of the epoxy resin organic-inorganic nano hybrid material. The product provided by the invention has excellent insulating property, and the method is stable and efficient.

Description

technical field [0001] The invention relates to the field of insulating materials for electronic and electrical components, in particular to a preparation method and application of epoxy resin silica sol. Background technique [0002] Epoxy resin is a thermosetting resin with a very wide range of applications. Because of its outstanding bonding properties, dielectric properties, electrical insulation and chemical corrosion resistance, etc., it has played an irreplaceable role in the fields of coatings, aerospace, electronic packaging, and insulating materials. However, due to the high cross-linking density of pure epoxy resin and the three-dimensional cross-linking network structure inside, it is very brittle. In terms of fatigue resistance, impact toughness, dimensional stability, heat resistance, electrical insulation, thermal conductivity, etc. It is difficult to meet the requirements of the growing modern material industry. Therefore, the development of higher performa...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08L63/02C08L63/00C08K3/36C08G59/42C08G59/50
Inventor 施利毅付继芳余文琪贾海森陈立亚董星
Owner 上海上惠纳米科技有限公司
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