Organosilicon coating and preparation method thereof

Abstract

The invention belongs to the field of organosilicon, and particularly relates to an organosilicon coating and a preparation method thereof. The organosilicon coating is characterized in that the organosilicon coating comprises 90 to 120 parts of Alpha, Omega-dihydroxy polydimethylpolysiloxane, 10 to 30 parts of MQ resin, 10 to 30 parts of white carbon black, 0.3 to 1 part of vulcanization accelerators, 2 to 3 parts of methyl-tri-(butanone-oxime) silane, 2 to 3 parts of vinyl tributanoximo silane, 1 to 3 parts of propylamino triethoxy silane, 1 to 2 parts of 3-glycidyl ether oxypropyl trimethoxysilane and 70 to 90 parts of solvent. The preparation method comprises the steps of raw material selection, raw material weighing, rubber compound drying, rubber compound preparation, and the like. The organosilicon elastic coating disclosed by the invention has low viscosity and high fluidity, can be rapidly self-leveled and filled after being coated, has a high curing speed at room temperature, needs short surface drying time and curing time, has excellent electric insulation performance, high strength, low hardness, high elasticity and good toughness after being cured, has self-repairing performance and an elongation percentage reaching 200 to 500 percent, has good bonding performance, has shear strength of 2 to 5MPa over aluminum, has little odor, cannot corrode a matrix, adopts solvent oil as the solvent, can effectively insulate and protect the surfaces of printed circuit boards (PCB) and electronic devices, and can also used as other elastic coatings needing insulation performance and anticorrosion performance.

Description

technical field [0001] The invention belongs to the field of organic silicon, in particular to an organic silicon coating and a preparation method thereof. [0002] Background technique [0003] In electronic products, printed circuit boards (i.e. PCB boards) are the main carrier to realize the interconnection between various electronic components. The PCB board is densely covered with conductive lines, and the surface is coated with a solder mask (usually green or brown) and a screen printing surface (ie, the icon surface). During the processing and use of the PCB board, the surface is "three-proof". " and insulation protection are particularly important, and general acrylic resin and polyurethane insulating coatings have poor adhesion to the solder mask layer, high hardness, poor elasticity, and are easy to break, and most of them require medium and high temperature curing or UV curing. In many occasions , especially not suitable for large-scale construction. [0004] W...

AI Technical Summary

Problems solved by technology

There are mainly four problems in the products made of this formula: 1. The surface drying time is long, and the internal curing speed is slow, which affects the use of customers; 2. When used as a conformal coating, the adhesion to the contact substrate is not good. Easy to peel off; 3. The paint film formed by the product has low strength, poor elasticity and high hardness, which eventually leads to poor toughness and is easy to break during use; 4. Contains some aromatic solvents, which are highly toxic

[0012] 2. Fast curing at room temperature: As an assembly line production operation, in order to ensure work efficiency, it is necessary for this special coating to be able to dry at room temperature in 10-30 minutes (25 ℃, 50%), and the initial curing time is 5- 15 hours (25 ℃, 50%), if it cannot be cured quickly, it will lead to a lot of waste of time in the workflow and affect production efficiency;

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