Process applied to single-surface corroded p-n junction or suede structure of crystalline silicon solar cell
A solar cell, single-sided corrosion technology, applied in the field of solar cells, can solve the problems of destroying the ozone layer, reducing the photoelectric conversion efficiency of solar cells, reducing the effective area of the p-n junction on the light-receiving surface, etc., to improve the open-circuit voltage and short-circuit current. The effect of high controllability and avoiding battery edge leakage
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Embodiment 1
[0024] A kind of process that mentions in this embodiment is applied to the single-side corrosion p-n junction of crystalline silicon solar cell, comprises the following steps:
[0025] (1) Carry out chemical pretreatment to silicon chip to form suede structure;
[0026] (2) Perform high-temperature diffusion on the silicon wafer to form a p-n junction structure;
[0027] (3) Carry out acidic chemical liquid treatment to silicon chip to remove phospho-silicate glass;
[0028] (4) Protect the p-n junction on the non-corrosion surface of the silicon wafer with a dielectric film;
[0029] (5) Remove the natural oxide layer (SiO2) on the corroded surface of the silicon wafer or the dielectric film material on the corroded surface with an acidic chemical solution;
[0030](6) The p-n junction of the corroded surface of the silicon wafer is etched by a chemical reaction with an alkaline chemical solution;
[0031] (7) Effectively clean the dielectric film on the silicon wafer and...
Embodiment 2
[0043] A kind of process that mentions in this embodiment is applied to the single-side corrosion p-n junction of crystalline silicon solar cell, comprises the following steps:
[0044] (1) Carry out chemical pretreatment to silicon chip to form suede structure;
[0045] (2) Perform high-temperature diffusion on the silicon wafer to form a p-n junction structure;
[0046] (3) Carry out acidic chemical liquid treatment to silicon wafer to remove borosilicate glass;
[0047] (4) Protect the p-n junction on the non-corrosion surface of the silicon wafer with a dielectric film;
[0048] (5) Remove the natural oxide layer (SiO2) on the corroded surface of the silicon wafer or the dielectric film material on the corroded surface with an acidic chemical solution;
[0049] (6) The p-n junction of the corroded surface of the silicon wafer is etched by a chemical reaction with an alkaline chemical solution;
[0050] (7) Effectively clean the dielectric film on the silicon wafer and t...
Embodiment 3
[0062] A kind of technique that is applied to the one-side corrosion p-n junction and textured structure of crystalline silicon solar cell that mentions in this embodiment comprises the following steps:
[0063] (1) Carry out chemical pretreatment to silicon chip to form suede structure;
[0064] (2) Perform high-temperature diffusion on the silicon wafer to form a p-n junction structure;
[0065] (3) Carry out acidic chemical liquid treatment to silicon chip to remove phospho-silicate glass;
[0066] (4) Protect the p-n junction on the non-corrosion surface of the silicon wafer with a dielectric film;
[0067] (5) Remove the natural oxide layer (SiO2) on the corroded surface of the silicon wafer or the dielectric film material on the corroded surface with an acidic chemical solution;
[0068] (6) The p-n junction and the suede structure of the corroded surface of the silicon wafer are subjected to chemical reaction corrosion with an alkaline chemical solution;
[0069] (7)...
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