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Silver paste for disk capacitor electrode

A capacitor electrode, silver paste technology, applied in fixed capacitor electrodes, parts of fixed capacitors, conductive materials dispersed in non-conductive inorganic materials, etc., can solve the problems of sintering performance, adhesion, welding resistance, etc. Achieve good electrical conductivity, continuous silver surface, and small sintering shrinkage

Active Publication Date: 2011-03-16
广东羚光新材料股份有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] In order to solve the above problems, the purpose of the present invention is to provide a kind of silver paste for environment-friendly original film capacitor electrodes developed according to environmental requirements, which is lead-free, cadmium-free, low-toxic, and has little environmental pollution, and effectively solves the problems of sintering performance, Defects in adhesion and soldering resistance, the inorganic materials used can meet the requirements of foreign environmental protection, and the technology used can ensure the stability and consistency of the silver paste

Method used

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  • Silver paste for disk capacitor electrode

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0032] 1. Preparation of lead-free glass powder

[0033] By mass percentage B 2 o 3 20wt%, SiO 2 15wt%, Bi 2 o 3 60wt%, Al 2 o 3 3.5wt%, Y 2 o 3 1.5 wt%. Mix evenly with a pot mill, preheat at 450°C for 30 minutes, melt at 1200°C for 60 minutes, quench, ball mill until the particle size is less than 15 μm, filter and dry.

[0034] 2. Preparation of organic carrier

[0035] Ethyl cellulose 20Wt%, terpineol 30Wt%, diethylene glycol butyl ether 40Wt%, surfactant Wt 5%, leveling agent Wt 5%, after mixing the above components, heat and dissolve at 80-100°C, Obtain a transparent glue.

[0036] 3. Mix 60Wt% ultra-fine silver powder, 4Wt% lead-free glass powder, 1Wt% Y 2 o 3 , made into powder, after stirring evenly, adding 35wt% organic carrier, after high-speed dispersion, rolled by three-roll mill until the fineness is less than 10 μm, adding diethylene glycol monobutyl ether to adjust the viscosity.

[0037] How to use the silver paste:

[0038] ① Screen printing on...

Embodiment 2

[0043] 1. Preparation of lead-free glass powder

[0044] By mass percentage B 2 o 3 18wt%, SiO 2 17Wt%, Bi 2 o 3 60wt%, Al 2 o 3 1.5wt%, TiO 2 and ZrO 2 3.5 wt%. Mix evenly with a pot mill, preheat at 450°C for 30 minutes, melt at 1200°C for 60 minutes, quench, ball mill until the particle size is less than 15 μm, filter and dry.

[0045] 2. Preparation of organic carrier

[0046] Ethyl cellulose 25wt%, terpineol 30wt%, diethylene glycol butyl ether 33wt%, surfactant 6wt%, leveling agent 6wt%, after mixing the above components, heat and dissolve at 80-100 ℃ to obtain Transparent glue.

[0047] 3. Mix 58Wt% ultra-fine silver powder, 3.5Wt% lead-free glass powder, 2.3Wt% TiO 2 and ZrO 2 , made into powder, after stirring evenly, adding 36.2Wt% organic carrier, after high-speed dispersion, rolling to fineness less than 10 μm by three-roll rolling mill, adding terpineol to adjust viscosity.

[0048] How to use the silver paste: Please refer to Example 1

Embodiment 3

[0050] 1. Preparation of lead-free glass powder

[0051] By mass percentage B 2 o 3 22wt%, SiO 2 20Wt%, Bi 2 o 3 52wt%, Al 2 o 3 0.5wt%, FeO 5.5wt%. Mix evenly with a pot mill, preheat at 450°C for 30 minutes, melt at 1200°C for 60 minutes, quench, ball mill until the particle size is less than 15 μm, filter and dry.

[0052] 2. Preparation of organic carrier

[0053] Ethyl cellulose 28wt%, terpineol 30wt%, diethylene glycol butyl ether acetate 33wt%, surfactant 3wt%, leveling agent 6wt%, after mixing the above components, heat and dissolve at 80-100 ℃ , to obtain a transparent glue.

[0054] 3. Mix 55Wt% superfine silver powder, 4% lead-free glass powder, 1Wt% La 2 o 3 , made into powder, stirred evenly, added 35wt% organic carrier, dispersed at high speed, rolled by three-roll mill to fineness less than 10 μm, added diethylene glycol butyl ether acetate to adjust viscosity.

[0055] How to use the silver paste: Please refer to Example 1

[0056] Use the above si...

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Abstract

The invention discloses silver paste for a disk capacitor electrode. The silver paste comprises the following components by weight percent: 50-80% of ultrafine silver powder with the particle size of less than 2mu m, 2-15% of lead-free glass powder, 0.1-10% of inorganic additive, 5-25% of polymer resin, 10-40% of solvent and 0-10% of organic additive, wherein the sum of the weight percentages of the components is 100%. The silver paste has good dispersivity, narrow particle size distribution, low sintering shrinkage rate and good conductivity, the screen printing patterns are smooth and flat,the silver surface is continuous and bright, the silver paste has high adhesive force and good electrical performance; and the glass powder does not contain lead, cadmium and the compounds of lead and cadmium, thus the environmental requirements of the European Union RoHS can be met.

Description

technical field [0001] The invention relates to the field of electronic materials, in particular to a silver paste for disc capacitor electrodes. technical background [0002] Electronic silver paste is a kind of conductive material used in the dip coating and screen printing process in the electronics industry. It is a high-tech product integrating electronics, chemical industry and metallurgy. It is one of the main basic materials in the electronics industry. Basic material for piezoelectric ceramic capacitors. The electronic silver paste is sintered on the substrate to form a conductive film through screen printing, leveling, drying, sintering and other processes, which can be applied to various electronic components. At present, the domestic silver paste for wafer capacitor electrodes has certain defects in sintering performance, adhesion, and soldering resistance. The inorganic materials used cannot meet the requirements of foreign environmental protection, and are mai...

Claims

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Application Information

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IPC IPC(8): H01B1/22H01G4/008
Inventor 李跃文王惠敏黎万全娄红涛梁炳联陈平基宋先刚彭梅志刘名惠
Owner 广东羚光新材料股份有限公司
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