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Polyesteramide hot melt adhesive with low melting point and preparation method thereof

A polyester amide, low melting point technology, used in adhesives, fiber types, textiles and papermaking, etc., can solve the problem of polyester hot melt adhesive performance not reaching a satisfactory level, and achieve fast curing and good thermal stability. Effect

Active Publication Date: 2011-01-05
SHANGHAI TIANYANG HOT MELT ADHESIVE CO LTD +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, the performance of the existing polyester hot melt adhesives for clothing has not yet reached a satisfactory level and needs to be further improved.

Method used

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  • Polyesteramide hot melt adhesive with low melting point and preparation method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0018] In a four-necked flask of a 2.0L distillation unit equipped with a thermometer, a mechanical stirrer, and a reflux condenser, add terephthalic acid (2.0mol), propylene glycol (2.0mol), diethylene glycol (1.50mol) and tetratitanate Ethyl ester (0.0007mol), blow nitrogen, heat, start stirring, turn on the condensed water, when the temperature in the kettle reaches 145°C, the material begins to dissolve, and when the temperature continues to rise to about 180°C, methanol begins to distill, continue the reaction and keep the temperature in the kettle When the temperature reaches 180-185°C and the distilled water reaches more than 90% of the theoretical amount, the esterification reaction ends.

[0019] Add isophthalic acid (1.2mol), adipic acid (0.3mol), decanediamine (0.35mol) and caprolactam (0.35mol) in the above-mentioned product and stir to heat up, carry out esterification and amidation reaction, when still internal temperature When it reaches about 185°C, water begin...

Embodiment 2-6

[0021] The steps and process conditions of Embodiment 2-6 are basically the same as those of Example 1. The modified process conditions and raw material molar ratio are shown in Table 1, and the properties of the resulting product are also listed in Table 1.

[0022] Relevant processing conditions and material proportioning and product performance of table 1 embodiment 2-6 (raw material proportioning is the amount of substance, mol)

[0023]

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Abstract

The invention provides a preparation method of a polyesteramide hot melt adhesive with a low melting point, which mainly comprises the following steps of: (1) carrying out an esterification reaction on terephthalic acid, propylene glycol and diglycol under the action of a tetrabutyl titanate catalyst; (2) adding isophthalic acid, aliphatic dicarboxylic acid, decamethylene diamine and caprolactam into the products of the step (1) to carry out esterification and amidation reactions; and (3) adding 2,6-tertiary butyl-4-methylphenol as a polycondensation stabilizer into the reaction system, and carrying out copolycondensation under reduced pressure to obtain a copolymer. The obtained polyesteramide hot melt adhesive has the advantages of good heat stability, heat resistance, cold resistance, quick solidification and the like, is widely applied to the adhesion of synthetic fiber and is especially applicable to nylon products.

Description

technical field [0001] The invention relates to a low-melting-point polyester amide hot-melt adhesive modified with amide monomers such as decyl diamine and caprolactam, and a preparation method thereof. technical background [0002] As an environmentally friendly adhesive product, polyester hot melt adhesive has huge room for development. At present, in the polyester hot-melt adhesive industry, the focus of development should be multi-polymer copolymerization and polymer blending. Through modification, the polyester hot-melt adhesive has more excellent comprehensive properties to meet the needs of various industries. [0003] Currently known polyester hot-melt adhesives are obtained by transesterification and esterification of dibasic acid esters and dibasic alcohols or dibasic acid anhydrides and dibasic alcohols, followed by reduced-pressure compression polymerization. Such as Chinese patent CN 1990809A provides a kind of by terephthalic acid C 1 ~C 4 Alkyl esters and ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C09J177/12C08G69/44D06M15/59D06M101/34
Inventor 李哲龙朱万育张海玲曾作祥黄亮节张攀
Owner SHANGHAI TIANYANG HOT MELT ADHESIVE CO LTD
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