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Heat conductive insulation material and preparation method thereof

A technology of thermally conductive insulating material and thermally conductive insulating filler, which is applied in the field of engineering plastics, can solve the problems of high price, does not consider whether the material is conductive, and the material is not insulating, etc., and achieves a low gas content, easy to form a conductive network, and increased thermal conductivity. Effect

Inactive Publication Date: 2010-12-01
KINGFA SCI & TECH CO LTD +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Patent CN 1333801A introduces a method for improving the thermal conductivity of polymer composite materials, which uses high aspect ratio carbon fiber and low aspect ratio powder filler to compound according to a certain ratio, and can obtain the highest thermal conductivity of 25W / m.K. Molecular composite materials, but whether the material is conductive or not is not considered in the design process, and its polymer matrix is ​​also limited to LCP (liquid crystal polymer); patent CN 10333434A introduces a thermally conductive insulating material prepared from vinyl silicone resin, thermally conductive filler Inorganic powder is used, but the thermal conductivity of the prepared material does not exceed 5W / m.K
Although the existing methods can prepare materials with high thermal conductivity, the materials are not insulating; and the thermal conductivity of thermally conductive insulating materials does not exceed 5W / m.K, and the price is expensive

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0035] Thermally conductive and insulating plastics for injection molding, the percentages of each component are liquid crystal polymer (LCP) 30%, 30μm alumina 41%, 5μm aluminum nitride 15%, glass fiber 10%, silane coupling agent 2%, hard Zinc fatty acid 2%.

[0036] Add the silane coupling agent, zinc stearate and LCP into the high-speed mixer, mix evenly, add some thermally conductive fillers alumina and aluminum nitride, continue to stir evenly, and then feed the evenly mixed material into the extruder through the main feeding port In the extruder, part of the heat-conducting filler alumina and aluminum nitride is fed into the extruder through the side feeding port, extruded and granulated to obtain a primary granulated material, and finally the obtained primary granulated material is added to the extruder from the main feeding port. In the extruder, the glass fiber is fed into the extruder from the side feeding port, extruded and granulated at 350°C to obtain thermally con...

Embodiment 2

[0039] Thermally conductive and insulating plastics for injection molding, the percentages of each component are polyphenylene sulfide (PPS) 50%, 40μm boron nitride 30%, 3μm calcium fluoride 5%, potassium titanate fiber 13%, silane coupling agent 1%, calcium stearate 1%.

[0040] Add the silane coupling agent, calcium stearate and PPS into the high-speed mixer, mix evenly, add some thermally conductive fillers boron nitride and calcium fluoride, continue to stir evenly, and then add the evenly mixed material through the main feeding port In the extruder, part of the heat-conducting filler boron nitride and calcium fluoride are fed into the extruder through the side feeding port, extruded and granulated to obtain primary pellets, and finally the obtained primary pellets are added from the main feed port Into the extruder, the potassium titanate fiber is fed into the extruder from the side feeding port, extruded and granulated at 290°C to obtain thermally conductive and insulati...

Embodiment 3

[0043] Thermally conductive and insulating plastics for injection molding, the percentages of each component are PA66 30%, 50μm silicon carbide 40%, 2μm zinc oxide 10%, glass fiber 17%, silane coupling agent 1.5%, stearic acid amide 1.5%.

[0044] Add the silane coupling agent, stearic acid amide and PPS into the high-speed mixer, mix evenly, add part of the thermal conductive filler silicon carbide and zinc oxide, continue to stir evenly, and then feed the mixed material through the main feeding port to extrude In the extruder, part of the thermally conductive filler silicon carbide and zinc oxide is fed into the extruder through the side feeding port, extruded and granulated to obtain primary pellets, and finally the obtained primary pellets are fed into the extruder from the main feed port In the process, the glass fiber is fed into the extruder from the side feeding port, extruded and granulated at 260°C to obtain thermally conductive and insulating plastics for injection m...

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PUM

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Abstract

The invention discloses a heat conductive insulation material and a preparation method thereof. The heat conductive insulation material comprises the following components in percentage by weight: 15 to 50 percent of plastic substrate, 15 to 45 percent of heat conductive insulation filler A, 5 to 15 percent of heat conductive filler B, 10 to 30 percent of mineral fiber C, 0 to 2 percent of coupling agent and 0 to 2 percent of lubricant. The heat conductive insulation material has the advantages of perfect forming processing performance, high heat conductivity, higher uniformity and a small amount of gas content during processing; heat conductive fillers with different length-diameter ratios are combined, fillers with a large length-diameter ratio are arranged in melt flowing direction, and fillers with a small length-diameter ratio fill gaps left when the fillers with the large length-diameter ratio are arranged, so that the number of interfaces among filler components is greatly reduced, a conduction network is formed more easily, and heat conductivity is remarkably increased; moreover, the mineral fiber is added during the second machining process, so that the loss of material performance can be compensated due to the addition of high-powder fillers, and performance is better.

Description

technical field [0001] The invention relates to the technical field of engineering plastics, and relates to a thermally conductive insulating material and a preparation method thereof. Background technique [0002] With the rapid development of microelectronic integration technology and assembly technology, the volume of electronic components and logic circuits is getting smaller and smaller, while the operating frequency is increasing sharply. At this time, the heat generated by electronic equipment is rapidly accumulating and increasing. , in order to ensure the normal operation of electronic components with high reliability for a long time, the ability to dissipate heat in time becomes an important limiting factor affecting their service life, so it is urgent to develop insulating materials with high thermal conductivity. [0003] Traditional heat-conducting materials generally use aluminum or ceramic materials, but these materials are difficult to process, expensive, and...

Claims

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Application Information

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IPC IPC(8): C08L77/02C08L77/06C08L77/00C08L81/02C08L67/02C08L55/02C08L23/12C08L23/06C08L69/00C08K13/04C08K3/28C08K3/38C08K3/34C08K3/22C08K3/16C08K7/14C08K7/06C08K7/08C09K19/38H01B3/47
Inventor 易庆锋姜苏俊蒋智强宁方林叶南飚陈健曾祥斌
Owner KINGFA SCI & TECH CO LTD
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