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Preparation method of W-Cu electrical contact

A technology for electrical contacts and electrical contact materials, which is applied to circuits, electrical switches, electrical components, etc., can solve the problems of cumbersome operation, high consumption and high cost, and achieve the effect of reducing costs.

Inactive Publication Date: 2010-03-10
KUNMING UNIV OF SCI & TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] At present, the traditional powder metallurgy pressing method cannot prepare electrical contacts with complex shapes, and other metallurgical smelting methods are more cumbersome to operate, and the process of adding alloy elements is also very complicated and difficult to control; the material utilization rate of traditional machining methods is very low. Low, the production process is cumbersome, the loss is large, and the cost is high

Method used

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  • Preparation method of W-Cu electrical contact
  • Preparation method of W-Cu electrical contact
  • Preparation method of W-Cu electrical contact

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0024] Weigh 840g of W powder, 150g of Cu powder, and 10g of Ni powder, and mill them in a ball mill for 10 hours; mix the alloy powder and binder at a volume ratio of 1.63 after ball milling, and knead at 165°C for 2 hours; then pass through an extruder Make the feed at 130°C; put the prepared feed into the injection molding machine for injection, the injection temperature is 130°C, the injection pressure is 135Mpa, and the mold temperature is 50°C; after that, the green body is completely immersed in the temperature of 30°C In the n-heptane solvent for 2 hours, the paraffin and stearic acid components were dissolved; then the green body was dried in a constant temperature drying oven at 40°C and then put into a tube furnace with a flow rate of 2.5ml / min·cm 2 Thermal degreasing under a protective hydrogen atmosphere: heating at 3°C / min to 180°C, holding for 60 minutes, then heating at 3°C / min to 250°C, holding for 120 minutes, and then heating at 3°C / min Heat to 350°C, hold...

Embodiment 2

[0026] Weigh 599 g of W powder, 400 g of Cu powder, and 1 g of Ni powder, and mill them in a ball mill for 70 hours; mix the alloy powder and binder at a volume ratio of 1.17 after ball milling, and knead at 140°C for 2 hours; then pass through an extruder Make the feed at 130°C; put the prepared feed into the injection molding machine for injection, the injection temperature is 165°C, the injection pressure is 80Mpa, and the mold temperature is 40°C; after that, the green body is completely immersed in the temperature of 45°C in a n-heptane solvent for 6 hours to dissolve the paraffin and stearic acid components; then put the green body in a constant temperature drying oven at 40°C and then put it into a tube furnace with a flow rate of 2.5ml / min·cm 2 Thermal degreasing under a nitrogen protective atmosphere: heat to 40°C at a rate of 3°C / min, hold for 60 minutes, then heat to 250°C at a rate of 3°C / min, hold for 60 minutes, and then heat at a rate of 3°C / min Heat to 350°C,...

Embodiment 3

[0028] Weigh 745g of W powder, 250g of Cu powder, and 5g of Co powder, and mill them in a ball mill for 40 hours; mix the alloy powder and binder at a volume ratio of 1.40 after ball milling, and knead at 150°C for 2 hours; then pass through an extruder Make the feed at 140°C; put the prepared feed into the injection molding machine for injection, the injection temperature is 140°C, the injection pressure is 120Mpa, and the mold temperature is 60°C; after that, the green body is completely immersed in the temperature of 60°C In the n-heptane solvent for 10 hours, the paraffin and stearic acid components were dissolved; then the green body was dried in a constant temperature drying oven at 40°C and then put into a tube furnace with a flow rate of 2.5ml / min·cm 2 Under the protective atmosphere of argon gas, thermal degreasing: heating to 180°C at a speed of 3°C / min, holding for 50 minutes, heating at a speed of 3°C / min to 250°C, holding for 100 minutes, and then heating at a sp...

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Abstract

The invention relates to a preparation method of a tungsten-copper electrical contact which adopts the injection moulding process. The method comprises the following steps: placing tungsten powder, copper powder and trace element Ni, Co, Mn and Mo according to a certain ratio in a ball mill to perform ball milling, mixing the prepared alloy powders and binder to smelt, injecting to prepare the green body with an injection machine, defating and finally sintering to obtain the electrical contact. The consistency (relative theoretical density) of the contact which is sintered through the liquid phase sintering is more than 98%. The tungsten-copper electrical contact of the invention has the advantage that the contact has high conductivity, low contact resistance and good fusion welding resistance, electric arc burning loss resistance and thermal stability, the electrical contact with a complicated shape can be prepared through one-step forming process, no subsequent machining is needed, the continuous production can be realized, and the production cost can be greatly reduced.

Description

technical field [0001] The invention relates to a tungsten-copper composite material and an injection molding technology for preparing electric contacts. Background technique [0002] Tungsten-copper composite materials not only have the characteristics of high plasticity, good electrical conductivity, and thermal conductivity of copper, but also have the characteristics of high strength, high hardness, and low expansion coefficient of tungsten. These unique comprehensive properties make tungsten-copper alloy widely used in electrical contacts, especially in the field of contacts and electrode materials of high-voltage and ultra-high-voltage switching appliances, and in microelectronics technology as microwave amplifier substrates, heat dissipation components and other electronic packages. Materials for thermal deposition of materials. [0003] However, W-Cu is a typical non-miscible system, and the solubility of tungsten in liquid copper is extremely low, 10 at 1200 °C. 5...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01H11/04B22F3/115C22C27/04C22C1/05
Inventor 史庆南韩波王效琪起华荣王军丽
Owner KUNMING UNIV OF SCI & TECH
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