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Preparation method of coated copper-silver metal powder

A bimetallic and coated technology, which is applied in metal material coating process, liquid chemical plating, coating, etc., can solve problems affecting silver surface coating, different activity, aging, etc., and achieve excellent high temperature oxidation resistance and electrical conductivity, narrow powder particle size distribution, and improved oxidation resistance

Inactive Publication Date: 2010-03-10
GUIZHOU INST OF METALLURGY & CHEM ENG
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, in the chemical replacement method, due to the presence of ammonia ions in the reaction system, the cuproammonium ions generated during the reaction undergo competitive adsorption on the surface of the copper powder, which affects the surface coating of silver. Most of the prepared copper-silver bimetallic powders For embellishment coating, the production and application prospects are greatly reduced; and the chemical reduction method introduces a high-strength reducing agent, the thermal stability of the prepared silver-coated copper powder is not enough, and it is easy to age with the aging of the reducing agent; The production process of the chemical method is too complicated and the production conditions are harsh, which is not conducive to industrial production
[0003] Chinese Patent Publication No. CN1704502A discloses "a preparation method of silver-plated copper powder", which selects the extraction and complexing agent of copper ions, but because the organic complexing agent is greatly affected by the pH value, at different pH values Its activity is different under different conditions, and this patent does not take into account the activity of ion extraction complexing agents under different pH conditions
[0004] Chinese Patent Publication No. CN101294281A (200810058362.0) discloses "a preparation method of silver-plated copper powder for low-temperature slurry". The use temperature of the copper-silver powder prepared by this patent does not exceed 200°C. Silver copper powder is not suitable for applications with higher temperature requirements, and it is prone to oxidation under high temperature conditions and loses its excellent electrical conductivity

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0015] Weigh 3.0g of micron-sized copper powder to clean the surface oxide with 5% dilute sulfuric acid, and wash it with deionized water, activate it with 30g / L tin protochloride aqueous solution for 3min, then use 5g / L palladium chloride aqueous solution to sensitize Wash for 1 min, add 100ml of deionized water, add a dispersant mixed according to PEG:PVP=2:1 and stir at high speed with an emulsifier to fully disperse; add dilute nitric acid at room temperature to adjust the pH value to 3.5, add ethylenediamine: Triaminoethylamine: maleopimaric acid: potassium citrate=1.0g of ion masking agent mixed in 1: 1: 1: 1, stir; pass into mixed gases such as nitrogen and argon to get rid of the air in the reactor for protection; weigh Silver nitrate 1.03g was formulated into a solution, and slowly added dropwise to the copper powder sol while stirring, and then diluted ammonia water was added dropwise to adjust the pH value to 11.0, and the pH value was adjusted to 11.0 after fully st...

Embodiment 2

[0017] Weigh 3.0g of micron-sized copper powder to clean the surface oxide with 5% dilute sulfuric acid, and wash it with deionized water, activate it with 40g / L tin protochloride aqueous solution for 4min, then use 8g / L palladium chloride aqueous solution to sensitize Add 100ml of deionized water for washing, add dispersant mixed according to PEG:PVP=2:1 and stir at high speed with emulsifier to fully disperse; add dilute nitric acid at room temperature to adjust the pH value to 4.0, add : ethyl acetate: aminoacetic acid: sodium citrate=1: 1: 1: 1 mixed ion-masking agent, stir; pass into nitrogen to get rid of the air in the reactor to protect; take silver nitrate 2.26g to be mixed with solution, while stirring Slowly add it dropwise to the copper powder sol, after fully reacting, add dropwise dilute ammonia water to adjust the pH value to 9.0, stir again, and then pickling, washing with water, washing with alcohol, and drying in a drying oven at 70°C to obtain copper-silver b...

Embodiment 3

[0019] Weigh 3.0g of micron-sized copper powder to clean the surface oxide with 5% dilute sulfuric acid, and wash it with deionized water, activate it with 50g / L tin protochloride aqueous solution for 5min, then use 10g / L palladium chloride aqueous solution to sensitize Wash for 2 minutes, add 100ml of deionized water, add dispersant mixed according to PEG:PVP=2:1 and stir at high speed with an emulsifier to fully disperse; add dilute nitric acid at room temperature to adjust the pH value to 5.0, add dimercaptopropanol : disodium edetate: hydrazine hydrate = 1.0g of ion masking agent mixed in 1: 1: 1, stir; feed mixed gases such as nitrogen and argon to get rid of the air in the reactor to protect; take silver nitrate 2.96g Prepare a solution, slowly add it dropwise to the copper powder sol while stirring, add dilute ammonia water dropwise to adjust the pH value to 10.0 after fully reacting, stir again, wash with water, pickle, wash with water, wash with alcohol, in a drying ov...

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Abstract

The invention discloses a preparation method of coated copper-silver metal powder which contains the pretreatment of copper powder, the preparation of silver solution and the preparation of copper-silver metal powder, wherein the preparation method of copper-silver metal powder comprises the following steps: dropwise adding dilute nitric acid in the sol of copper powder to adjusting the pH value to 3.0-5.0, adding ionic masking agent with the dosage of 1-30g / L, fully stirring, injecting inert protective gas such as nitrogen, argon or the like to remove the air in a reactor for protection, thenslowly dropping silver nitrate solution in the sol of copper powder while stirring to fully react for 30min, then dropping dilute ammonia water to adjusting the pH value to 7.0-11.0, continuously reacting for 30min, washing the reaction solution with deionized water, 5% of dilute sulphuric acid and ethanol solution for several times after the reaction and drying the obtained copper-silver metal powder at 60-80 DEG C to obtain the finished product. The product obtained by the method of the invention has excellent high temperature oxidation resistance and conductivity and narrow particle size distribution.

Description

technical field [0001] The invention relates to the technical field of materials, in particular to a method for preparing copper-silver bimetallic powder. Background technique [0002] For a long time, metal silver powder has been widely used in various fields due to its excellent properties such as electrical conductivity and oxidation resistance, which are unmatched by many other metal powders in terms of performance and application range. Compared with silver powder, the conductivity of copper powder is also very good, but due to the high activation of the surface of copper powder, the oxidation rate of copper powder is very high at very low temperature. After oxidation, the excellent conductivity is gone, and the direct application of copper powder is deadlocked. How to ensure the oxidation resistance of copper powder under the premise of ensuring the excellent electrical conductivity and production cost of copper powder has always been the research goal of the authors ...

Claims

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Application Information

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IPC IPC(8): B22F1/02C23C18/42
Inventor 薛涛聂登攀赵伟毅彭优
Owner GUIZHOU INST OF METALLURGY & CHEM ENG
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