Manufacturing method of low-voltage transient voltage suppression diode chip
A technology of transient voltage suppression and manufacturing method, which is applied in semiconductor/solid-state device manufacturing, circuits, electrical components, etc., can solve problems such as increasing costs, and achieve the effect of increasing P/N junction depth and reducing surface leakage current.
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[0023] The manufacturing method of the low-voltage transient voltage suppression diode chip of the invention will be further described in detail below in conjunction with the accompanying drawings.
[0024] Such as figure 1 and figure 2 As shown, the present invention uses a single-crystal silicon grinding disc with a resistivity of 0.001-0.02 Ω·cm in the P-type crystal orientation, and first performs chemical polishing treatment to remove the surface defect layer of the ground silicon wafer. Use nitric acid, hydrofluoric acid, and glacial acetic acid mixed acid according to the ratio of polishing to carry out polishing treatment on the silicon wafer at low temperature, and the thickness of single-side etching is 5-30um.
[0025] The polished silicon wafers are heat treated with a high-low-high temperature curve. First, perform one-step high-temperature annealing, and then continue the multi-step temperature-increasing heat treatment process at 750-900°C. Annealing is carr...
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