Nano thin film with separation and protection function and manufacturing method thereof

Abstract

The invention relates to a nano film with the function of obstructing and protection and the manufacturing method belonging to the technical field of protective film and manufacturing method, aiming at improving the performance of protective film; with the plasma device which is provided with a magnetic field strengthening device, the plasma chemical vapor deposition and the gas of organic silicone chemistry as the working gas, the nano film is manufactured on the parent metal surface by depositing and converging with a thickness of 1 to 1000nm, a transmission rate of oxygen less than 50ml / cm2 / 24h and a transmission rate of water vapor less than 10g / m2 / 24h. The magnetic field strengthening device is magnet assembly(12) made of permanent magnets, consisting of an outside and inside magnet assembly(13),(14) which are respectively corresponding to a left and a right roll electrode(2),(3), and the magnetic field strengthening device can increase the density of the plasma in the plasma area; the nano film has high density, great obstructing performance, uneasy breaking-off and corrosion resistance, being widely applicable as the protective layer for food, drug package and functional apparatus; the manufacturing method is suitable for the production line of continuous coiling based on the parent metal.

Description

technical field [0001] The invention belongs to the technical field of protective film and its production, and relates to a nano film with barrier and protective functions and its production method. Background technique [0002] In the prior art, there are many types of protective films in terms of manufacturing methods and varieties and structural forms. For protective films that can block gas molecules and have protective functions, one is to combine the barrier layer with the adhesive through the chemical coating method. The substrates are bonded to each other. One is to deposit the barrier layer on the substrate by using the existing plasma chemical vapor deposition (PECVD) method; the common disadvantages are that the density is not high and the porosity is large. Therefore, the performance of barrier gas molecules is low, the bonding strength with the substrate is low, and it is easy to fall off; in addition, the adhesive used in the former has chemical pollution, and ...

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Problems solved by technology

[0002] In the prior art, there are many types of protective films in terms of manufacturing methods and varieties and structural forms. For protective films that can block gas molecules and have protective functions, one is to combine the barrier layer with the adhesive through the chemical coating method. The substrates are bonded to each other. One is to deposit the barrier layer on the substrate by using the existing plasma chemical vapor deposition (PECVD) method; the common disadvantages are that the density is not high and the porosity is large. Therefore, the performance of barrier gas molecules is low, the bonding strength with the substrate is low, and it is easy to fall off; in addition, the adhesive used in the former has chemical pollution, and the thickness of the barrier layer is uneven, and the surface flatness is low, while the latter is limited to the glow discharge intensity, plasma region The plasma density inside is not high, the deposition rate of the barrier layer is low, the barrier layer is thicker, above the micron level, and the density is not high, so the production efficiency is low and the cost is high

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