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Printed circuit etching liquid

A technology of printed circuit and etching solution, which is applied in the field of etching in the production of fine lines of printed circuit boards, can solve the problems of inability to meet the requirements of circuit refinement, inability to meet electrical performance requirements, poor stability of hydrogen peroxide, etc. The effect of stable nitric acid content, low price and fast speed

Inactive Publication Date: 2009-09-30
UNIV OF ELECTRONICS SCI & TECH OF CHINA +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0013] Among the existing etching solutions, the ferric chloride etching solution is rarely used for line etching in production due to its serious pollution.
Copper chloride etching solution is a commonly used etching system in production, but for fine line etching, the side erosion of this etching solution is serious and cannot meet the electrical performance requirements
The hydrogen peroxide-sulfuric acid system limits its use due to the poor stability of hydrogen peroxide.
Persulfuric acid etchant can't meet our current requirements for circuit refinement

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment approach 1

[0056] Preparation of nitric acid etching solution:

[0057] (1) Add 100ml of deionized water into the etching tank, measure about 27.47ml of 65% nitric acid into the etching tank, and then add a small amount of deionized water.

[0058] (2) Measure about 23.19ml of 98% concentrated sulfuric acid, slowly add it into the etching tank, and stir the solution continuously during the process of adding the concentrated sulfuric acid.

[0059] (3) Add 15.90 g of anhydrous sodium sulfate into the etching tank, and stir to completely dissolve the anhydrous sodium sulfate.

[0060] (4) Add 1.00 ml of an additive with a concentration of 10%.

[0061] (5) add deionized water to 500ml, prepare 500ml nitric acid concentration and be 5%, sulfuric acid concentration is 8%, anhydrous sodium sulfate concentration is 3%, and additive concentration is the nitric acid etching solution of 0.02%.

[0062] Adjust the temperature of the etching solution to 50°C, select a copper clad laminate with a ...

Embodiment approach 2

[0064] Prepare 500 ml of nitric acid etching solution with a nitric acid concentration of 7%, a sulfuric acid concentration of 12%, anhydrous sodium sulfate concentration of 3%, and an additive concentration of 0.05% according to the steps of Embodiment 1. Control the etching temperature to 60°C. Select a copper clad laminate with a copper foil thickness of 18 μm, a size of 5cmx 5cm, and a pattern transfer line width of 50 μm. Put the copper clad board into an etching tank for etching. After 15 minutes, the line etching was complete. The measured line width is 36.43 μm, and the metallographic micrograph shows that the section of the conductive line is trapezoidal.

Embodiment approach 3

[0066] Prepare 500 ml of nitric acid etching solution with a nitric acid concentration of 7%, a sulfuric acid concentration of 10%, anhydrous sodium sulfate concentration of 3%, and an additive concentration of 0.07% according to the steps of Embodiment 1. Control the etching temperature to 60°C. Select a copper clad laminate with a copper foil thickness of 18 μm, a size of 5cmx 5cm, and a pattern transfer line width of 80 μm. Put the copper clad board into an etching tank for etching. After 8 minutes, the line etching was completed. The measured line width is 74.23 μm, and the metallographic micrograph shows that the section of the conductive line is trapezoidal.

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Abstract

The invention belongs to the technical field of printed circuit board manufacturing. The invention provides an economical, practical, fast, efficient and easy-to-regenerate printed circuit etching solution. The formula of the etching solution is: HNO3 (5% ~ 15%), H2SO4 (8% ~ 20%), Na2SO4 (1% ~ 6%), additive 0.01 ~ 0.2%, wherein the additive contains one or one of the following The compounding agent of the above surfactants: C10~C12 fatty alcohol polyoxyethylene ether sulfosuccinic acid half ester disodium salt, fatty alcohol polyoxypropylene polyoxyethylene ether, polyoxyethylene (20) sorbitan monolauryl Ester, alkyl polyoxyethylene ether sulfate ammonium salt or sodium salt, alkylphenol polyoxyethylene ether sulfate ammonium salt or sodium salt, fatty alcohol polyoxyethylene ether, fatty acid polyoxyethylene ether, nonylphenol polyoxyethylene vinyl ether. The side erosion of the printed circuit produced by the invention is very small, and the etchant is easy to regenerate, can be recycled for a long time, the waste liquid is easy to treat, and has little pollution to the environment.

Description

technical field [0001] The invention belongs to the technical field of printed circuit board manufacturing, and in particular relates to an etching technology in the manufacture of fine lines of a printed circuit board (PCB). Background technique [0002] In the manufacturing process of printed circuit boards, it is necessary to put the copper clad laminates that have undergone pattern transfer into the etching solution to etch away the copper foil that is not covered by the resist layer, so as to obtain the corresponding printed circuit conductive lines. At present, the commonly used etching solution systems mainly include the following types: [0003] (1) Ferric chloride etching solution [0004] Ferric chloride etching is also a solution system with ferric chloride as the main component and a certain amount of hydrochloric acid added. This etchant is easy to obtain, cheap, has a wide range of allowable concentration of dissolved copper, and is easy to operate. However,...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C23F1/18
Inventor 何为周国云龙发明何波王守绪袁正希胡可关健
Owner UNIV OF ELECTRONICS SCI & TECH OF CHINA
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