31results about How to "Low volume shrinkage" patented technology

A photocationic polymerization initiator comprising (A) a photo acid-generating compound and (B) a fused polycyclic aromatic compound, wherein said fused polycyclic aromatic compound has a molecular structure in which a fused aromatic ring is further condensed with a non-aromatic ring, and at least one of the atoms constituting said non-aromatic ring directly bonded to a common atom in the fused aromatic ring and the non-aromatic ring, is a saturated carbon atom, said saturated carbon atom having at least one hydrogen atom. Upon blending the photopolymerizable monomer with the photocationic polymerization initiator, there is obtained a photocationically polymerizable composition having a high sensitivity for the visible light rays, which is useful for dental applications, exhibiting a sufficiently high curing rate and offering sufficient depth of curing upon the irradiation with light for only a short period of time.

A film-forming composition including a triazine ring-containing hyperbranched polymer with a repeating unit structure indicated by formula (1), and inorganic micro particles is provided. This enables the provision of a film-forming composition capable of hybridizing without reducing dispersion of the inorganic micro particles in a dispersion fluid, capable of depositing a coating film with a high refractive index, and suitable for electronic device film formation.(In the formula, R and R′ are mutually independent and indicate a hydrogen atom, an alkyl group, an alkoxy group, an aryl group, or an aralkyl group, and Ar indicates a divalent organic group including either an aromatic ring or a heterocyclic ring, or both.)

A method of encapsulating an electrical winding in an encapsulant composition. The method includes: (i) providing an electrically insulated wire; (ii) applying the encapsulation composition to the electrically insulated wire to encapsulate the wire; and (iii) winding a further layer of wire around the encapsulated wire. The electrical encapsulant composition includes a silica containing inorganic-organic nano-hybrid matrix, and particles of refractory ceramic suspended in the inorganic-organic nano-hybrid matrix.