Patents
Literature
Hiro is an intelligent assistant for R&D personnel, combined with Patent DNA, to facilitate innovative research.
Hiro

76results about "Stacked and attached PCBs" patented technology

Flexible display device with reduced bend stress wires and manufacturing method for the same

There is provided a flexible display having a plurality of innovations configured to allow bending of a portion or portions to reduce apparent border size and / or utilize the side surface of an assembled flexible display.
Owner:LG DISPLAY CO LTD

Stack structure with semiconductor chip embedded in carrier

A stack structure with semiconductor chips embedded in carriers comprises two carriers stacking together as a whole, at least two semiconductor chips having active surfaces with electrode pads and inactive surfaces corresponding thereto placed in the cavities of the carriers, at least one dielectric layer formed on the active surface of the semiconductor chip and the surface of the carrier, at least a conductive structure formed in the opening of the dielectric layer, and at least a circuit layer formed on the surface of the dielectric layer wherein the circuit layer is electrically connected to the electrode pad by the conductive structure, so as to form a three-dimensional module to increase the storage capacity dramatically and integrate the semiconductor chips in the carriers for efficiently reducing the size of the module, so that the combinations can be changed flexibly to form the required storage capacity according to the demands.
Owner:PHOENIX PRECISION TECH CORP

Thin multi-chip flex module

A multichip module comprises a multilayer substrate circuit having conductive patterns on its surface(s) to which microelectronic device(s) are attached. The conductive patterns include a series of electrical contacts adjacent to one edge of the substrate. The substrate is bonded to two rigid frames, one on each opposite surface. Each substrate has a series of castellations on one edge that are aligned and electrically connected to the respective contacts on the substrate, preferably by soldering. The castellations can serve as a self-aligning mechanism when the module is brought into contact with a low-profile pin array, and the module may be held in place on a motherboard by guide rails in a socket that engages the edges perpendicular to the castellated edge of the module. The module may further be provided with protective heat spreading covers.
Owner:MICROELECTRONICS ASSEMBLY TECH

Thin multi-chip flex module

A flexible circuit comprises a folded dielectric sheet having conductive patterns on its surface(s) to which microelectronic device(s) are attached. The dielectric sheet is folded 180° about a selected axis and a bond layer joins the two halves over a portion of their respective surface areas so that a remaining portion of their areas remain unbonded and a bifurcated structure is thereby formed. Electrical contacts are provided on the unbonded or bifurcated portions of the flexible sheets. The flex may be attached to a rigid frame and provided with protective heat spreading covers. The folded flex design is particularly suitable for reel-to-reel manufacturing.
Owner:MICROELECTRONICS ASSEMBLY TECH

Semiconductor device and method of manufacturing the same

A semiconductor device and method of fabricating the same. The semiconductor device includes at least one first contact pin on a first substrate and at least one second contact pin on a second substrate. The at least one first and second contact pins may be included in first and second contact pin arrays. The first and second contact pins of the first and second contact pin arrays may be aligned.
Owner:SAMSUNG ELECTRONICS CO LTD

Thin multi-chip flex module

A flexible circuit comprises two flexible dielectric sheets having conductive patterns on their surface(s) to which microelectronic device(s) are attached. A bond layer joins the two sheets over a portion of their respective surface areas so that a remaining portion of their areas remain unbonded and a bifurcated structure is thereby formed. Electrical contacts are provided on the unbonded or bifurcated portions of the flexible sheets. The flex may be attached to a rigid frame and provided with protective heat spreading covers.
Owner:MICROELECTRONICS ASSEMBLY TECH

Flexible flat circuit cable with gapped section

A flexible flat circuit cable includes first and second flexible circuit substrates extending in an extension direction. The first flexible circuit substrate has a first surface forming a first conductor layer and an insulation layer, and the second flexible circuit substrate has a first surface forming a second conductor layer and an insulation layer. A bonding material layer is applied at a predetermined section between the first flexible circuit substrate and the second flexible circuit substrate to bond the first and second flexible circuit substrates together in such a way to maintain a predetermined spacing distance between the first and second flexible circuit substrate and forming a gapped segment at sections where no bonding material is applied. The first and second flexible circuit substrates form a cluster section within the gapped segment, which has opposite ends respectively forming first and second connected sections each of which forms a connection plug or is provided with a connector.
Owner:ADVANCED FLEXIBLE CIRCUITS

Multi-layered flexible print circuit board and manufacturing method thereof

Provided is an FPC, which comprises an insulating layer 2, wiring layers 3 and 4 laminated above and under the insulating layer 2, and a layer connection for connecting the wiring layers 3 and 4 electrically. The layer connection is constituted to comprise: a conductor press-fit hole 5 of a cone shape extending through the insulating layer 2 and the upper and lower wiring layers 3 and 4 and expanded to the side of one wiring layer 3; and a conductor 6 filled and press-fitted without any clearance in the conductor press-fit hole such that it is jointed to the wiring upper layer 3 deformed into the cone shape of the conductor press-fit hole 5, and is protruded from the other wiring lower layer 4 to have its surface partially coated and jointed. As a result, the contact area between the wiring layers 3 and 4 and the conductor 6 filled in the conductor press-fit hole 5 can be enlarged to retain the contact strength between the wiring layers 3 and 4 and the conductor 6 sufficiently thereby to provide a high connection reliability for the layer connection.
Owner:PANASONIC CORP

Card type information device and method for manufacturing same

Card type information device includes wiring board having a wiring pattern with an electronic component mounted on a first face of wiring board and an antenna connecting electrode, antenna board having antenna pattern with antenna terminal electrodes formed on a first face of antenna board, magnetic material placed between wiring board and antenna board confronting each other, flexible wiring board for coupling the antenna connecting electrode to antenna terminal electrode, and housing for accommodating wiring board, antenna board, magnetic material, and flexible wiring board. Wiring board and antenna board are made from one and the same insulating motherboard.
Owner:PANASONIC CORP

Printed circuit board provided with heat circulating medium and method for manufacturing the same

A printed circuit board includes a lower plate provided with an internal circuit wiring and having a recessed part at a surface thereof and a plurality of projection patterns at a lower surface of the recessed part; an upper plate having the same structure of the lower plate and adhered to the lower plate so that surfaces formed with the recessed part are opposite to each other; a heat circulation medium injected into an internal space formed by the recessed parts of the lower and upper plates.
Owner:SK HYNIX INC

Signal reception device, signal reception circuit, and reception device

The present invention provides a receiver that includes a plurality of tuners for receiving broadcasts such as satellite broadcast. A tuner circuit (1) includes an input terminal (11) for inputting a broadcast wave in which a video signal and / or an audio signal are modulated in a predetermined format, and a mount layer (13) on which a main circuit (12) for selecting, from the broadcast wave, a video signal and / or an audio signal included in a predetermined frequency band is mounted. In the tuner circuit (1), a first ground layer (15) is disposed, through a first dielectric layer (14), on the surface opposite to that on which the main circuit (12) of the mount layer (13) is arranged, and a second ground layer (17) is disposed through a second dielectric layer, thereby suppressing mutual interference between tuners.
Owner:SONY CORP

Printed circuit board comprising an electronic component integrated therein

A printed circuit board having two completed printed circuit board elements which consists of a plurality of interconnected plies or layers, wherein at least one printed circuit board element has a cutout or depression containing the component to be integrated on one of the printed circuit board elements or in the cutout of the at least one printed circuit board element, and the printed circuit board elements are connected with the component being accommodated in the cutout, as a result of which it is possible to obtain secure and reliable accommodation of the component in the printed circuit board. Furthermore, a printed circuit board of this type also contains an electronic component integrated therein.
Owner:AT & S AUSTRIA TECH & SYSTTECHN AG

Circuit board module and heat-dissipating board structure thereof

A heat-dissipating board structure and a circuit board module are provided. The heat-dissipating board structure includes a first board, a second board, a heat-transmitting layer and a buffering liquid. The first board has a first inner surface and the first inner surface has a plurality of first metal protrusions thereon. The second board is correspondingly engaged with the first board to form an accommodating chamber therebetween. The second board has a second inner surface and the second inner surface has a plurality of second metal protrusions thereon. The heat-transmitting layer is disposed in the accommodating chamber and arranged between the first metal protrusions and the second metal protrusions. The buffering liquid is filled in a residual space of the accommodating chamber. Therefore, the heat-dissipating board structure can meet the design requirements of a light-weight and thin electronic product and can effectively remove heat from a heat source.
Owner:CAREER TECH MFG
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Patsnap Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More
PatSnap group products