76results about "Stacked and attached PCBs" patented technology

There is provided a flexible display having a plurality of innovations configured to allow bending of a portion or portions to reduce apparent border size and / or utilize the side surface of an assembled flexible display.

A stack structure with semiconductor chips embedded in carriers comprises two carriers stacking together as a whole, at least two semiconductor chips having active surfaces with electrode pads and inactive surfaces corresponding thereto placed in the cavities of the carriers, at least one dielectric layer formed on the active surface of the semiconductor chip and the surface of the carrier, at least a conductive structure formed in the opening of the dielectric layer, and at least a circuit layer formed on the surface of the dielectric layer wherein the circuit layer is electrically connected to the electrode pad by the conductive structure, so as to form a three-dimensional module to increase the storage capacity dramatically and integrate the semiconductor chips in the carriers for efficiently reducing the size of the module, so that the combinations can be changed flexibly to form the required storage capacity according to the demands.

A semiconductor device and method of fabricating the same. The semiconductor device includes at least one first contact pin on a first substrate and at least one second contact pin on a second substrate. The at least one first and second contact pins may be included in first and second contact pin arrays. The first and second contact pins of the first and second contact pin arrays may be aligned.

A connection member can be produced without a via-forming step. The connection member includes an insulating substrate which has an upper surface, a lower surface opposed to the upper surface, and a side surface which connects these surfaces; and at least one wiring which extends from the upper surface to the lower surface through the side surface.

The invention relates to a circuit board unit and a method for production thereof. The circuit board unit comprises a circuit board topmost laminate with conductive tracks on the upper side for mounting surface-mountable devices. The circuit board topmost laminate features a thickness dimensioned such that the anticipated heat dissipated by the surface-mountable devices is transported from the upper side to the underside of the circuit board laminate to good effect. The circuit board unit further comprises an electrically insulating laminate arranged under the circuit board topmost laminate, inserts made of a material with good heat conductivity and electrical insulation embedded in the electrically insulating laminate at sites below surface-mountable devices with high heat dissipation, and a cooling plate arranged below the electrically insulating laminate and the inserts.

Card type information device includes wiring board having a wiring pattern with an electronic component mounted on a first face of wiring board and an antenna connecting electrode, antenna board having antenna pattern with antenna terminal electrode formed on a first face of antenna board, magnetic material placed between wiring board and antenna board confronting each other, flexible wiring board for coupling the antenna connecting electrode to antenna terminal electrode, and housing for accommodating wiring board, antenna board, magnetic material, and flexible wiring board. Wiring board and antenna board are made from one and the same insulating motherboard.

A multi-layered flexible print circuit board comprising an insulating layer, a circuit layer formed on the front and back surfaces of the insulating layer and a hole connecting between the circuit layers via the insulating layer, wherein there is provided an electrically-conductive member having a metal layer formed thereon at least on the surface thereof which is press-fitted into the hole to electrically conduct the circuit layer.

A flexible flat circuit cable includes first and second flexible circuit substrates extending in an extension direction. The first flexible circuit substrate has a first surface forming a first conductor layer and an insulation layer, and the second flexible circuit substrate has a first surface forming a second conductor layer and an insulation layer. A bonding material layer is applied at a predetermined section between the first flexible circuit substrate and the second flexible circuit substrate to bond the first and second flexible circuit substrates together in such a way to maintain a predetermined spacing distance between the first and second flexible circuit substrate and forming a gapped segment at sections where no bonding material is applied. The first and second flexible circuit substrates form a cluster section within the gapped segment, which has opposite ends respectively forming first and second connected sections each of which forms a connection plug or is provided with a connector.

A stacked small memory card includes an upper memory card and a lower memory card, the upper memory card and the lower memory card respectively formed a first heat sink and a second heat sink, the first heat sink and the second heat sink are stacked together, so that, the heat of the upper memory card and the lower memory card may be dispersed via the first heat sink and the second heat sink. Thus, the stacked small memory card of present invention having high function of disperses heat to promote its durability and lifetime effectively.

A multichip module comprises a multilayer substrate circuit having conductive patterns on its surface(s) to which microelectronic device(s) are attached. A part of the substrate is flexible and bifurcated. Two rigid members are attached lengthwise, one on either side of the substrate, and the free ends of the bifurcation are reflexed respectively about these members and bonded to them. Electrodes are located on the bifurcations so that they will be exposed outwardly and / or downwardly after reflexing. The module may further be provided with protective heat spreading covers. The electrodes and rigid members may be configured to engage a mating socket or they may be solderable to a printed circuit board.

A printed circuit board includes a lower plate provided with an internal circuit wiring and having a recessed part at a surface thereof and a plurality of projection patterns at a lower surface of the recessed part; an upper plate having the same structure of the lower plate and adhered to the lower plate so that surfaces formed with the recessed part are opposite to each other; a heat circulation medium injected into an internal space formed by the recessed parts of the lower and upper plates.

A method and circuit board arrangement for an intrinsically safe portable device includes two or more circuit boards having a frame structure that forms a contiguous boundary around a space between the circuit boards. In the space there are circuit components mounted on both circuit boards, and a connector that connect the two circuit boards. An encapsulant material fills the space bounded by the frame structure between the circuit boards to exclude airborne material from coming into contact with the encapsulated circuit components.

Provided is an FPC, which comprises an insulating layer 2, wiring layers 3 and 4 laminated above and under the insulating layer 2, and a layer connection for connecting the wiring layers 3 and 4 electrically. The layer connection is constituted to comprise: a conductor press-fit hole 5 of a cone shape extending through the insulating layer 2 and the upper and lower wiring layers 3 and 4 and expanded to the side of one wiring layer 3; and a conductor 6 filled and press-fitted without any clearance in the conductor press-fit hole such that it is jointed to the wiring upper layer 3 deformed into the cone shape of the conductor press-fit hole 5, and is protruded from the other wiring lower layer 4 to have its surface partially coated and jointed. As a result, the contact area between the wiring layers 3 and 4 and the conductor 6 filled in the conductor press-fit hole 5 can be enlarged to retain the contact strength between the wiring layers 3 and 4 and the conductor 6 sufficiently thereby to provide a high connection reliability for the layer connection.

The present invention provides a substrate for a flexible printed wiring board including an adhesive layer containing an epoxy resin composition, insulating layers respectively stacked on both sides of the adhesive layer and formed with a pair of films containing a nonthermoplastic polyimide resin, and conductor layers respectively disposed on the outer surfaces of the films. The total thickness of the insulating layers respectively stacked on both sides of the adhesive layer is 10 to 100 μm and 2 to 10 times the thickness of the adhesive layer. The mutual adhesion strength between the insulating layers through the intermediary of the adhesive layer is 7.0 N / cm or more.

A heat-dissipating board structure and a circuit board module are provided. The heat-dissipating board structure includes a first board, a second board, a heat-transmitting layer and a buffering liquid. The first board has a first inner surface and the first inner surface has a plurality of first metal protrusions thereon. The second board is correspondingly engaged with the first board to form an accommodating chamber therebetween. The second board has a second inner surface and the second inner surface has a plurality of second metal protrusions thereon. The heat-transmitting layer is disposed in the accommodating chamber and arranged between the first metal protrusions and the second metal protrusions. The buffering liquid is filled in a residual space of the accommodating chamber. Therefore, the heat-dissipating board structure can meet the design requirements of a light-weight and thin electronic product and can effectively remove heat from a heat source.