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Electric element carrier plate and manufacturing method thereof

A technology of electrical components and manufacturing methods, which is applied in the direction of electrical components, printed circuit manufacturing, printed circuits connected with non-printed electrical components, etc. , low cost, easy to make effect

Inactive Publication Date: 2008-10-29
HONG FU JIN PRECISION IND (SHENZHEN) CO LTD +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, in the electrical component carrier 10, the passive element 12 is embedded inside the electrical component carrier 10, the manufacturing process is complicated and the cost is high; Passive components are embedded inside the electrical component carrier 10, limiting its scope of use

Method used

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  • Electric element carrier plate and manufacturing method thereof
  • Electric element carrier plate and manufacturing method thereof
  • Electric element carrier plate and manufacturing method thereof

Examples

Experimental program
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Effect test

Embodiment Construction

[0019] see figure 2 and image 3 , the first preferred embodiment of the electrical component carrier 100 of the present invention. The electrical component carrier 100 includes a base 110 , at least one passive component 120 and a filling material 130 .

[0020] The substrate 110 is a printed circuit board, which can be any circuit board used in the industry, such as phenolic resin copper clad board, epoxy resin copper clad board, glass cloth epoxy resin copper clad board, polyester Imide resin copper clad board, copper clad PTFE glass cloth laminate, ceramic substrate, aluminum oxide nitride substrate (ALN), silicon carbide substrate (SiC) and other circuit boards. The substrate 110 includes a base layer 112 , a conductive layer 114 and a solder resist layer 116 , the conductive layer 114 is disposed on the base layer 112 , and the solder resist layer 116 is disposed on the conductive layer 114 . The conductive layer 114 is provided with a plurality of welding spots 114 ...

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PUM

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Abstract

The invention provides an electric element carrier plate which comprises a substrate, at least one passive element and a filling material. Each substrate comprises a base layer and a conducting layer, and at least one groove is arranged on the base layer; the conducting layer is formed on one surface of the base layer, where the groove is arranged; the passive element is held in the groove and electrically connected with the conducting layer. The filling material is filled in the groove and coats the passive element. The electric element carrier plate of the invention has high reliability, low cost and wide scope of application. The invention also relates to a manufacturing method of the electric element carrier plate.

Description

technical field [0001] The invention relates to an electrical component carrier, in particular to an electrical component carrier integrated with passive components and a manufacturing method thereof. Background technique [0002] Electrical component carrier boards are widely used in electronic products to carry electrical components such as semiconductors and provide electrical connections for the electrical components, such as figure 1 Shown is an existing electrical component carrier 10, the electrical component carrier 10 is a printed circuit board (PCB), the electrical component carrier 10 is internally integrated with a passive element 12, and the passive element 12 is a capacitor, an inductance resistor and other electrical components. The passive element 12 is embedded inside the electrical component carrier 10, and is electrically connected to the surface of the electrical component carrier through a circuit disposed inside the electrical component carrier, so as ...

Claims

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Application Information

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IPC IPC(8): H05K1/18
CPCH05K3/3442H05K3/4611Y10T29/4913Y10T29/49128H05K3/4697H05K2201/043H05K1/141H05K3/284H05K1/183
Inventor 吴英政刘坤孝
Owner HONG FU JIN PRECISION IND (SHENZHEN) CO LTD
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