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247results about "Programmable logic circuit arrangements" patented technology

Level shifter control circuit with delayed switchover to low-power level shifter

A level shifter control circuit selects one of two level shifters for converting a signal output from a circuit operating on a first power supply for input to a circuit operating on a second power supply. A low-power level shifter is selected when the difference between the two power-supply potentials is comparatively small. A wide-range level shifter is selected when the difference is greater. The switchover from the wide-range level shifter to the low-power level shifter is delayed to allow the power-supply potential difference to diminish to within the operating range of the low-power level shifter, thereby avoiding gaps in the level-shifted signal.
Owner:LAPIS SEMICON CO LTD

Multi-functional I/O buffers in a field programmable gate array (FPGA)

A multi-functional programmable I / O buffer in a Field Programmable Gate Array (FPGA) device. The I / O buffer is programmably configurable to meet any of a wide range of I / O standards, be it single ended or differential, 5V, 3.3V, 2.5V or 1.5V logic, without the need for implementing multiple I / O buffers to properly handle each different iteration of I / O requirements. An embedded, internal programmable resistor (e.g., a programmable 100 ohm resistor) is programmably selected for use in differential I / O applications, thus eliminating the conventional requirement for the use of an external resistor connected to each differential receiver I / O pin. The present invention also separates I / O pads into groups in each of a plurality of banks in a programmable device (e.g., PLD, FPGA, etc.), with each group being separately powered by the user. The disclosed multi-functional I / O buffer may be programmably configured by the user to be, e.g., a single ended receiver or transmitter, a reference receiver or transmitter, or a differential receiver or transmitter. The pad logic of the multi-functional I / O buffer may include a double data rate input and output mode, each of which includes two flip-flop devices operating on opposite sides of a data clock signal. One of the two flip-flop devices may be borrowed from another logic element, e.g., from a shirt register logic element.
Owner:LATTICE SEMICON CORP

Double data rate input and output in a programmable logic device

A multi-functional programmable I/O buffer in a Field Programmable Gate Array (FPGA) device. The I/O buffer is programmably configurable to meet any of a wide range of I/O standards, be it single ended or differential, 5V, 3.3V, 2.5V or 1.5V logic, without the need for implementing multiple I/O buffers to properly handle each different iteration of I/O requirements. An embedded, internal programmable resistor (e.g., a programmable 100 ohm resistor) is programmably selected for use in differential I/O applications, thus eliminating the conventional requirement for the use of an external resistor connected to each differential receiver I/O pin. The present invention also separates I/O pads into groups in each of a plurality of banks in a programmable device (e.g., PLD, FPGA, etc.), with each group being separately powered by the user. The disclosed multi-functional I/O buffer may be programmably configured by the user to be, e.g., a single ended receiver or transmitter, a reference receiver or transmitter, or a differential receiver or transmitter. The pad logic of the multi-functional I/O buffer may include a double data rate input and output mode, each of which includes two flip-flop devices operating on opposite sides of a data clock signal. One of the two flip-flop devices may be borrowed from another logic element, e.g., from a shirt register logic element.
Owner:LATTICE SEMICON CORP

Semiconductor apparatus, production method, and electronic apparatus

The present technology relates to a semiconductor apparatus, a production method, and an electronic apparatus that enable semiconductor apparatuses to be laminated and the laminated semiconductor apparatuses to be identified. A semiconductor apparatus that is laminated and integrated with a plurality of semiconductor apparatuses, includes a first penetrating electrode for connecting with the other semiconductor apparatuses and a second penetrating electrode that connects the first penetrating electrode and an internal device, the second penetrating electrode being arranged at a position that differs for each of the laminated semiconductor apparatuses. The second penetrating electrode indicates a lamination position at a time of lamination. An address of each of the laminated semiconductor apparatuses in a lamination direction is identified by writing using external signals after lamination. The present technology is applicable to a memory chip and an FPGA chip.
Owner:SONY CORP
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