Adhesive varnish, adhesive film and wiring film

a technology of adhesive film and wiring film, which is applied in the direction of film/foil adhesive, heat-activated film/foil adhesive, insulating substrate metal adhesion improvement, etc., can solve the problems of poor storage stability, low adhesive strength, and low adhesive strength, so as to prevent foam formation and curling, excellent storage stability, and excellent adhesive properties and heat resistance and moisture resistance reliability

Active Publication Date: 2016-01-19
HITACHI METALS LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Benefits of technology

[0040]According to one embodiment of the invention, an adhesive varnish can be provided that, when being used as an adhesive etc., can provide excellent storage stability, adhesive properties and heat resistance and moisture-resistance reliability after the adhesion, and that, when being used as an adhesive film or a wiring film, can prevent the foam formation and curling during the drying. Also, according to another embodiment of the invention, an adhesive film and a wiring film using the adhesive varnish can be provided.

Problems solved by technology

However, the adhesive described in JP-A-H05-029399 has a problem that storage stability is poor due to high reactivity of an amino group present in a polyamide resin structure with the epoxy resin.
The adhesive described in JP-A-2004-136631 has problems that adhesive strength is only about 0.5 kN / m even though the phenoxy resin considered to be relatively excellent in adhesive strength is blended and also solder heat resistance is as slightly low as 260° C.
The adhesive containing an epoxy resin described in JP-A-2001-262111 is excellent in heat resistance but has a problem that adhesive strength is as low as about 0.6 kN / m.
Meanwhile, the adhesive containing a urethane acrylate and a silane coupling agent described in JP-A-2008-258607 is excellent in adhesion with metal conductors but there is lack of consideration of adhesion with polyimide films which are high heat-resistant base films.

Method used

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  • Adhesive varnish, adhesive film and wiring film
  • Adhesive varnish, adhesive film and wiring film
  • Adhesive varnish, adhesive film and wiring film

Examples

Experimental program
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Effect test

example 1

[0129](1) Preparation of Adhesive Varnish

[0130]Firstly, a bisphenol A-type phenoxy resin (trade name: YP-50 manufactured by Nippon Steel & Sumikin Chemical Co., Ltd.; weight average molecular weight: 73,000 in terms of styrene) used as the phenoxy resin constituting the component A was dissolved in a mixture solvent of methyl ethyl ketone and cyclohexanone, thereby preparing varnish of 25 mass %. Next, the following components were dissolved and blended in a mixture solvent composed of 270 parts by mass of methyl ethyl ketone (MEK) and 30 parts by mass of cyclohexanone to prepare an adhesive varnish: 100 parts by mass of the phenoxy resin constituting the component A; 15 parts by mass of 2-methacryloyloxyethyl isocyanate (trade name: Karenz®MO, manufactured by Showa Denko K.K.) as the polyfunctional isocyanate compound constituting the component B; 20 parts by mass of bismaleimide (trade name: BMI-2300, manufactured by Daiwa Kasei Industry Co., Ltd.) as the maleimide compound consti...

examples 2 to 12

[0133]The adhesive films 1 were made in the same manner as the Example 1 except that each composition of the adhesive varnish was different as shown in Table 1.

[0134]

TABLE 1CompositionItemsEx. 1Ex. 2Ex. 3Ex. 4Ex. 5Ex. 6Proportion(A) PhenoxyYP-50,BisphenolMw:100100100100100100(parts by mass)resin varnishNipponA-type73,000Steel(B)KarenzMOMethacryl—15151510520PolyfunctionalI, ShowaisocyanateisocyanateDenko(D)DBTDL,Dibutyltin—0.0090.0090.0090.0060.0030.012UrethanizationWako PuredilauratecatalystChemical(E)BHT, WakoDibutylhydroxytoluene—0.00450.00450.00450.0030.0020.006PolymerizationPureinhibitorChemical(C) maleimideBMI-5100,Bis-————202020DaiwamaleimideKaseiBMI-2300,Bis-—202020———DaiwamaleimideKaseiBMI-1000,Bis-———————DaiwamaleimideKaseiSolvent(S1) MEKMethylb.p.270295200280280280ethylaboutketone80° C.(S2) Cyclo-Cyclo-b.p.305100202020hexanonehexanoneabout156° C.CharacteristicsFoam formationNo foam formation⊚◯⊚⊚⊚⊚EvaluationCurlSmall curl⊚⊚◯⊚⊚⊚Solder heat resistanceNo swelling◯◯◯◯◯◯Initial ...

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Abstract

An adhesive varnish includes 100 parts by mass of a component A that includes a phenoxy resin including a plurality of hydroxyl groups in a side chain, 2 to 55 parts by mass of a component B that includes a polyfunctional isocyanate compound including, in a molecule thereof, an isocyanate and at least one of a vinyl group, an acrylate group and a methacrylate group, 5 to 30 parts by mass of a component C that includes a maleimide compound including a plurality of maleimide groups in a molecule thereof or / and a reaction product thereof, a component S1 including a low-boiling point solvent having a boiling point of not more than 100° C., and a component S2 including a high-boiling point solvent having a boiling point of more than 100° C.

Description

[0001]The present application is based on Japanese patent application No. 2013-009282 filed on Jan. 22, 2013, the entire contents of which are incorporated herein by reference.BACKGROUND OF THE INVENTION[0002]1. Field of the Invention[0003]The invention relates to an adhesive varnish, an adhesive film and a wiring film. In particularly, the invention relates to an adhesive varnish that, when being used as an adhesive etc., can provide excellent storage stability, adhesive properties and heat resistance and moisture-resistance reliability after the adhesion. Also, the invention relates to an adhesive varnish that, when being used as an adhesive film or a wiring film, can prevent the foam formation and curling during the drying.[0004]2. Description of the Related Art[0005]In recent years, electric / electronic devices have become smaller to save space and lighter and internal wiring materials used therein are required to be fine and thin wirings to realize high density wiring. In additi...

Claims

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Application Information

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Patent Type & Authority Patents(United States)
IPC IPC(8): C09J175/08C09J7/02H05K1/02C08G18/48C08G18/81C08G18/08C09J175/16H05K3/38C09J7/22C09J7/35
CPCC09J7/0242H05K1/0298H05K3/386C08G18/4879C08G18/8116C08G18/0852C09J175/16C09J2203/326C09J2475/00C09J2479/086H05K2201/0154Y10T428/24959Y10T428/2852C09J7/35C09J7/22
Inventor SHANAI, DAISUKEAOYAMA, TAKASHISASADA, KAZUHIKOKOMATSU, HIROAKI
Owner HITACHI METALS LTD
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