Process for improving the adhesion of polymeric materials to metal surfaces

Abstract

A process is described for treating metal surfaces with a composition comprising an oxidizer, an acid, a corrosion inhibitor, an unsaturated alkyl substituted with an aromatic or non-aromatic cyclic groups, and optionally but preferably a source of adhesion enhancing species selected from the group consisting of molybdates, tungstates, tantalates, niobates, vanadates, isopoly or heteropoly acids of molybdenum, tungsten, tantalum, niobium, vanadium, and combinations of any of the foregoing, an organic nitro compound, and a source of halide ions in order to increase the adhesion of polymeric materials to the metal surface.

Description

technical field [0001] This invention relates to printed circuits, and more particularly to methods of making multilayer printed circuit boards. Background technique [0002] Due to the increasing need for weight and space savings in electronic devices, printed circuits comprising one or more circuit inner layers are now widely used. [0003] In the manufacture of a typical multilayer printed circuit, a patterned circuit inner layer is first prepared by a process in which a resist is used to form a positive image of the desired circuit pattern on a copper-clad dielectric matrix material pattern, and then etch away the exposed copper. After removing the resist, the desired copper circuit pattern remains. [0004] Any one or more circuit inner layers having a particular form of circuit pattern, and circuit inner layers that may form ground planes and power planes, by sandwiching one or more partially cured dielectric matrix material layers between each inner circuit layer (...

AI Technical Summary

Problems solved by technology

However, there can be problems with the adhesion between the dielectric layer and the inner layer of the metallic copper circuit because, firstly, the bonding surface is metallic copper, and secondly, the metallic copper mainly occurs in a different phase (i.e., (1) from the oxidized Copper-reduced copper is on (2) the copper of the copper foil), which is prone to separation / delamination along the phase interface