Preparation method and application of film with photonic device structure

Abstract

The invention discloses a preparation method of a film with a photonic device structure, and the method comprises the steps: fixing a polyimide film on a platform capable of spatial displacement, focusing ultrafast laser into the polyimide film, and carrying out the etching, thereby obtaining the film with the photonic device structure. The preparation method has the advantages that the processing technology is simple, compatibility with an existing technology is easy to achieve, and manufacturing of a large-area and high-complexity photoelectric integrated device can be achieved; by regulating and controlling the ultrafast laser processing structure, the core layer can be directly written in the polymer, and the preparation process is simplified. According to the thin film obtained by adopting the preparation method disclosed by the invention, the refractive index can be accurately adjusted in a relatively large range, different application requirements can be met, the birefringence effect is small, and the optical loss is low; and in the production process, the optical waveguide material can be doped in a memorial manner or modified from the molecular level, so that the optical waveguide material has gain and photoelectric effects, and functionalization of an optical waveguide device is realized.

Description

technical field [0001] The present application relates to a method for preparing a thin film with a photonic device structure, which belongs to the field of laser etching. Background technique [0002] Optical waveguide is a medium device that guides light waves to propagate in it, also known as medium optical waveguide, which is widely used in the field of optical communication. Compared with quartz-based optical waveguides, polymer optical waveguide materials have obvious comprehensive performance advantages: (1) The processing technology of polymer optical waveguides is simple, and it is easy to achieve compatibility with existing processes and processes, that is, only through spin coating and photolithography. The production of large-area and complex optoelectronic integrated devices can be realized by such processes; (2) the refractive index can be precisely adjusted in a wide range, which can meet various application requirements, with small birefringence and low optic...

AI Technical Summary

Problems solved by technology

[0003] The current polymer optical waveguide and optical device preparation technologies mainly include photolithography (subdivided into reactive ion etching, lithography, photobleaching, etc.), template replication (subdivided into soft lithography, Doctor Blading method, heating template method, etc.), maskless direct writing method (subdivided into laser direct writing method, electron beam direct writing method, proton beam direct writing method, ultraviolet light direct writing method, micro-pen direct writing method, etc.), these technologies have a common feature , that is, the upper cladding and the lower cladding that constitute the optical waveguide structure must be prepared separately, and need to go through mask making, exposure, development, or template making, replication, exposure, and finally the upper cladding must be prepared, so The process is complicated and the cost is high

In addition, the polymer material used in the above method is usually photoresist or PMMA, and the maximum service temperature is about 100°C, which limits its further application

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