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Bonding silver wire capable of improving mechanical property and preparation method thereof

A bonding wire and bonding technology, applied in the field of bonding wire, can solve the problems of easy vulcanization, oxidation, and easy disconnection of bonding silver wire, so as to reduce vulcanization corrosion, good bonding, and improve anti-oxidative vulcanization. Effects on properties and processability

Pending Publication Date: 2022-03-18
晶学金属有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] Chinese patent application number is CN201210259179.3 discloses a preparation method of bonded gold-silver alloy wire, which is composed of metal materials in the following weight ratio: 20-30% of silver, 5-1000ppm of palladium, calcium, beryllium and cerium, and the remaining content It is gold, the purpose is to reduce the cost by adding silver and other metals, and it does not solve the problem of easy disconnection, vulcanization and oxidation under high-speed bonding conditions during the preparation of bonding silver wires

Method used

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  • Bonding silver wire capable of improving mechanical property and preparation method thereof
  • Bonding silver wire capable of improving mechanical property and preparation method thereof
  • Bonding silver wire capable of improving mechanical property and preparation method thereof

Examples

Experimental program
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Effect test

Embodiment 1

[0029] Preparation of doped silver-based bonding wire

[0030] (1) Melting: Mix Ag, Au, Pd, Ca, Ti, Sn, Ce, and Eu evenly and put them in a vacuum melting machine. Vacuum is carried out under the conditions of a vacuum degree of 5×10-4Pa and a temperature of 1000°C. Melting, drawing and casting into alloy wire rods with a diameter of 6mm;

[0031] (2) Wire drawing: Carry out wire drawing processing on the above-mentioned alloy wire rod, stretch it through the first thick wire drawing machine, stretch the wire diameter from 6 to 1mm, and the drawing speed is 0.1m / s, and then pass through the second thin wire rod in sequence. The wire drawing machine is stretched to 0.1mm at a rate of 0.3m / s, and then stretched to 0.03mm at a rate of 0.6m / s by an ultra-fine wire drawing machine, and then stretched by an ultra-fine wire drawing machine in sequence Further stretching at a rate of 1m / s into an alloy wire with a wire diameter of 20μ alloy bonding wire;

[0032](3) Annealing: the a...

Embodiment 2

[0039] Preparation of bonding silver wire

[0040] The doped silver-based bonding wire obtained in Example 1 was ultrasonically cleaned in ethanol for 15 minutes, dried with high-purity nitrogen, and the pretreated doped silver-based bonding wire was repeatedly deposited with an aluminum oxide film and oxidized by using an ALD instrument. Titanium film, ALD aluminum oxide / titanium oxide composite nano film is formed on the surface of doped silver-based bonding wire to obtain bonding silver wire.

[0041] The atomic layer deposition process is as follows:

[0042] (1) For the preparation of aluminum oxide thin films, one cycle of its deposition sequence includes the following two half-reaction cycles. 1. The trimethylaluminum pulse enters the cavity and reacts with the surface of the doped silver-based bonding wire. This reaction continues until the surface reaction is completed; 2. The unreacted trimethylaluminum is assisted by nitrogen inert carrier gas 3. The water pulse i...

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Abstract

The invention discloses a bonding silver wire capable of improving mechanical properties and a preparation method thereof. The bonding silver wire is composed of a doped silver-based bonding wire and a plating layer wrapping the doped silver-based bonding wire. The doped silver-based bonding wire comprises the following components in percentage by weight: 2.0% to 3.0% of Au, 1.0% to 2.0% of Pd, 0.5% to 1.0% of Ca, 0.05% to 0.08% of Ti, 0.05% to 0.08% of Sn, 0.03% to 0.05% of Ce, 0.01% to 0.03% of Eu and the balance of Ag. And the plating layer is formed by depositing an ALD aluminum oxide / titanium oxide composite nano film with the thickness of 0.1-0.3 mu m on the surface of the doped silver-based bonding wire through an atomic layer deposition process. According to the bonding silver wire capable of improving the mechanical property and the preparation method of the bonding silver wire, the formula design is reasonable, multi-element doping and surface coating are combined, the problems that in the prior art, the mechanical property of a bonding silver wire is low, and the bonding silver wire is prone to being broken, vulcanized and oxidized under the high-speed bonding condition are solved, the preparation method and lead welding are improved, and the bonding silver wire is high in mechanical property. Therefore, the bonding silver wire forms good bonding, and the application prospect is wide.

Description

technical field [0001] The invention belongs to the technical field of bonding wires, and in particular relates to a bonding silver wire with improved mechanical properties and a preparation method thereof. Background technique [0002] As one of the important basic materials of electronic packaging, the bonding wire is to realize the electrical connection between the semiconductor chip and the pin, and to play the role of chip and external current, signal import and export. With the development trend of miniaturization, modularization and high integration of electronic products, bonding wires are required to have more excellent mechanical properties and processing properties. [0003] In addition, due to the high price of bonding gold wires, it is the current development trend of the bonding wire industry to develop new bonding wires with lower prices and better performance to replace traditional bonding gold wires. Because the cost of silver wire is lower than that of gol...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L23/49H01L21/48C21D9/52C22C5/06C22F1/14C23C16/40C23C16/455
CPCH01L24/45H01L24/43C22C5/06C23C16/403C23C16/405C23C16/45525C22F1/14C21D9/525H01L2224/45144H01L2224/45164H01L2224/45105H01L2224/45139H01L2224/4321H01L2224/43848H01L2924/00011H01L2924/01049
Inventor 薛耀华
Owner 晶学金属有限公司
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