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Ceramic surface metallization method and metallized ceramic

A ceramic surface and metallization technology, which is applied in the field of metallized ceramics and ceramic surface metallization, can solve problems such as unstable performance of power devices, complicated process, and large copper foil thickness, and achieves the avoidance of oxygen residues, advanced preparation methods, cost-effective preparation

Active Publication Date: 2022-03-11
东莞智昊光电科技有限公司 +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, the thickness of the copper foil covered with copper in this process is relatively large, and it is difficult to obtain high-precision etching lines in the subsequent etching process, and it is difficult to control the residual oxygen element at the interface after sintering, resulting in porosity between the copper foil and the ceramic substrate. Causes unstable performance of power devices
[0004] The DPC process is a technology that metallizes the surface of the ceramic substrate by means of vacuum magnetron sputtering. Before depositing the Cu layer, a layer of Ti needs to be deposited as a transition layer to enhance the bonding force between the Cu layer and the ceramic substrate and complete the pattern. After the transfer, Ti needs to be etched, and the process is more complicated
In addition, the production equipment of vacuum thin film technology is expensive and the production efficiency is low.

Method used

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  • Ceramic surface metallization method and metallized ceramic
  • Ceramic surface metallization method and metallized ceramic
  • Ceramic surface metallization method and metallized ceramic

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0089] This embodiment provides a method for metallizing ceramic surfaces and metallized ceramics, the steps are as follows:

[0090] S1. Use the laser beam to irradiate the ceramic substrate. The parameters of the laser beam are: laser pulse width 2.4t / ms, laser frequency 4.5f / Hz, laser scanning speed 330V / (mm*min -1 ), writing a circuit pattern area on the ceramic substrate;

[0091] S2. Immerse the irradiated ceramic substrate in a copper plating solution for electroless copper plating, and grow a seed copper layer with a thickness of 1000 nm on the circuit pattern area; wherein, the copper plating solution includes water and the following concentration components: copper sulfate 0.8g*L -1 , Formaldehyde 0.5g*L -1 , sodium potassium tartrate 5g*L -1 、EDTA2NA 5g*L -1 , Sodium hydroxide 2.5g*L -1 .

[0092] S3, on the seed copper layer, lay liquid solder CuNi 12 Ti 35 , and then lay a copper foil with a thickness of 0.8mm, and braze for 30min at a vacuum of 300Pa and ...

Embodiment 2

[0095] This embodiment provides a method for metallizing ceramic surfaces and metallized ceramics, which are different from the process parameters in Embodiment 1, and the steps are as follows:

[0096] S1. Use the laser beam to irradiate the ceramic substrate. The parameters of the laser beam are: laser pulse width 2.3t / ms, laser frequency 5f / Hz, laser scanning speed 320V / (mm*min -1 ), writing a circuit pattern area on the ceramic substrate;

[0097] S2. Immerse the irradiated ceramic substrate in a copper plating solution for electroless copper plating, and grow a seed copper layer with a thickness of 1100 nm on the circuit pattern area; wherein, the copper plating solution includes water and the following concentration components: chloride Copper 1g*L -1 , Formaldehyde 0.4g*L -1 , sodium potassium tartrate 5g*L -1 、EDTA2NA 5g*L -1 , Sodium hydroxide 3g*L -1 .

[0098] S3, on the seed copper layer, lay liquid solder CuNi 12 Ti 35 , and then lay a copper foil with a thi...

Embodiment 3

[0101] This embodiment provides a method for metallizing ceramic surfaces and metallized ceramics, which are different from the process parameters in Embodiment 1, and the steps are as follows:

[0102] S1. Use the laser beam to irradiate the ceramic substrate. The parameters of the laser beam are: laser pulse width 2.4t / ms, laser frequency 4.5f / Hz, laser scanning speed 330V / (mm*min -1 ), writing a circuit pattern area on the ceramic substrate;

[0103] S2. Immerse the irradiated ceramic substrate in a copper plating solution for electroless copper plating, and grow a seed copper layer with a thickness of 1200 nm on the circuit pattern area; wherein, the copper plating solution includes water and the following concentration components: copper sulfate 0.8g*L -1 , Formaldehyde 0.5g*L -1 , sodium potassium tartrate 5g*L -1 、EDTA2NA 5g*L -1 , Sodium hydroxide 2.5g*L -1 .

[0104] S3, on the seed copper layer, lay liquid solder CuNi 12 Ti 35 , and then lay a copper foil wit...

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Abstract

The invention relates to the technical field of electronic product manufacturing, in particular to a ceramic surface metallization method and metallized ceramic, and the method comprises the following steps: irradiating a ceramic substrate with a laser beam, and writing a circuit pattern area on the ceramic substrate; immersing the irradiated ceramic substrate in a copper plating solution for chemical copper plating, and growing a seed copper layer on the circuit pattern area; a brazing filler metal and a copper foil are sequentially placed on the seed copper layer for brazing; and etching to expose the ceramic substrate in the non-circuit pattern area. According to the method, a thick copper layer can be formed on the surface of the ceramic substrate, a high-precision circuit pattern can be formed, and the binding force of the copper layer and the substrate is good.

Description

technical field [0001] The invention relates to the technical field of electronic product manufacturing, in particular to a method for metallizing the surface of ceramics and metallized ceramics. Background technique [0002] In recent years, LED technology has been continuously upgraded, and LED light efficiency is getting higher and higher. The photoelectric conversion efficiency of high-power LED chips can only reach 70-80%, which means that about 20%-30% of electrical energy is converted into heat energy. In order to improve the photoelectric conversion efficiency, reduce the conversion of electrical energy to thermal energy, and improve thermal conductivity, ceramic substrates have been widely used as functional modules. Most of the current market uses DBC and DPC processes. [0003] The DBC process is a direct copper cladding technology to metallize the surface of the ceramic substrate. This technology is mainly used for the packaging of power electronic modules, semi...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C04B41/88C04B41/80C04B37/02C04B41/91
CPCC04B41/88C04B41/80C04B41/5127C04B41/0036C04B41/009C04B37/026C04B41/91C04B41/5353C04B2237/123C04B2237/124C04B2237/122C04B41/4539C04B35/581
Inventor 孙业民张永林刘泽张安豪
Owner 东莞智昊光电科技有限公司
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