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Low-temperature sintered elargol and preparation method thereof

A low-temperature sintering, silver glue technology, applied in the direction of adhesives, epoxy resin glue, adhesive types, etc., to achieve the effect of improving electrical properties, packing compaction, and reducing rheological properties

Inactive Publication Date: 2022-03-04
SHANGHAI TENGSHUO ELECTRONICS MATERIAL CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The low-temperature sintered silver glue can be sintered under pressure-free conditions at 180°C. After sintering, the bonding strength to bare silicon substrates without metal coatings is greater than 15MPa. It has high thermal conductivity and high reliability, and is especially suitable for solving the problem of bare silicon without metal coatings. Heat Dissipation Issues in Substrate Electronics Packages

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0021] (1) Weigh 3.0g polyether modified bisphenol A epoxy resin EP4000 (manufactured by Japan Adike Co., Ltd.), 3.0g methylhexahydrophthalic anhydride, 5.0g ethylene glycol butyl ether and 9.0g Diethylene glycol butyl ether is put into a stirring tank, and the rotation and revolution mixer is used to stir for 2min at 2000rpm;

[0022] (2) Add 68g of flake silver powder into (1), and stir with a self-rotation and revolution mixer at 2000rpm for 2min, and control the temperature below 40°C during the stirring process;

[0023] (3) Add 12g of nano-silver powder in (2), and stir with 2000rpm for 2min with a self-rotation and revolution mixer, and control the temperature below 40°C during the stirring process;

[0024] (4) Disperse (3) 10 times with a three-roll mill, and control the temperature below 40°C during the dispersion process;

[0025] (5) Put the dispersed silver colloid into a vacuum degassing machine, and vacuum degassing at room temperature for 3 minutes.

Embodiment 2

[0027] (1) Weigh 3.0g polyether modified bisphenol A epoxy resin EP4000 (manufactured by Japan Adike Co., Ltd.), 3.0g dodecenylsuccinic anhydride, 5.0g ethylene glycol butyl ether and 13.0g diethyl ether Glycol butyl ether is put into a stirring tank, and the rotation and revolution mixer is used to stir for 2min at 2000rpm;

[0028] (2) Add 62g of flaky silver powder into (1), and stir with a self-rotating mixer at 2000rpm for 2min, and control the temperature below 40°C during the stirring process;

[0029] (3) Add 14g of nano-silver powder in (2), and stir with 2000rpm for 2min with a self-rotation and revolution mixer, and control the temperature below 40°C during the stirring process;

[0030] (4) Disperse (3) 10 times with a three-roll mill, and control the temperature below 40°C during the dispersion process;

[0031] (5) Put the dispersed silver colloid into a vacuum degassing machine, and vacuum degassing at room temperature for 3 minutes.

Embodiment 3

[0033] (1) Take by weighing 3.0g polyether modified bisphenol A epoxy resin EP4000 (manufactured by Japan Adike Co., Ltd.), 3.0g methylhexahydrophthalic anhydride, 16.0g terpineol, put into the mixing tank In the process, use a self-rotating and revolving mixer to stir at 2000rpm for 2min;

[0034] (2) Add 66g of flake silver powder into (1), and stir for 2min at 2000rpm with a self-rotating and revolving mixer, and control the temperature below 40°C during the stirring process;

[0035] (3) Add 12g of nano-silver powder in (2), and stir with 2000rpm for 2min with a self-rotation and revolution mixer, and control the temperature below 40°C during the stirring process;

[0036] (4) Disperse (3) 10 times with a three-roll mill, and control the temperature below 40°C during the dispersion process;

[0037] (5) Put the dispersed silver colloid into a vacuum degassing machine, and vacuum degassing at room temperature for 3 minutes.

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Abstract

The invention relates to low-temperature sintered silver colloid and a preparation method thereof. The low-temperature sintered silver colloid is prepared from the following components in percentage by mass: 60 to 80 percent of flaky silver powder, 10 to 20 percent of nano silver powder, 2.0 to 5.0 percent of flexible epoxy resin, 2.0 to 5.0 percent of anhydride curing agent and 5.0 to 15.0 percent of solvent. The preparation method of the low-temperature sintered elargol comprises the following steps: firstly, mixing the resin, the curing agent and the solvent, then adding the flake silver powder, stirring and mixing, then adding the nano silver powder, dispersing for 10 times through a three-roller grinder after mixing, and finally, carrying out vacuum defoaming at room temperature. The silver colloid disclosed by the invention can be sintered at 180 DEG C under a non-pressure condition, the bonding strength of the sintered silver colloid to a bare silicon substrate without a metal coating is greater than 15MPa, and the silver colloid has high heat conductivity and high reliability, and is particularly suitable for solving the heat dissipation problem of packaging of electronic devices with the bare silicon substrate without the metal coating.

Description

technical field [0001] The invention relates to the technical field of electronic device packaging, in particular to a low-temperature sintered silver paste and a preparation method thereof. Background technique [0002] With the gradual development of electronic devices in the direction of small size, multi-function, high reliability, etc., higher requirements are put forward for electronic packaging interface interconnection materials, such as high operating temperature (over 200°C) and high current density. Traditional Advanced tin-lead solder and lead-free solder cannot meet such conditions of use. The low-temperature sintered silver paste containing nano-silver can withstand the working temperature above 500°C after sintering, which can effectively avoid the problem of joint remelting in the subsequent processing and use of electronic devices, and silver has good electrical and thermal conductivity. Therefore, low-temperature sintered silver paste is especially suitabl...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C09J163/00C09J9/02
CPCC09J163/00C09J9/02C08K2201/011C08K2003/0806C08K2201/001C08K7/00C08K3/08
Inventor 刘雨张建平
Owner SHANGHAI TENGSHUO ELECTRONICS MATERIAL CO LTD
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