Method for generating skyrmion in magnetic multilayer film through current induction, magnetic storage unit and memory
A magnetic memory and magnetic storage technology, applied in static memory, digital memory information, parts and components of electromagnetic equipment, etc., can solve problems such as complex device structure, inability to achieve large-scale production, and high equipment requirements
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[0047] Preparation of the device:
[0048] The specific structure of the device including the magnetic multilayer film is Ta(5) / [Pt(0.5) / Co(0.5)] 3 / Ru(0-3nm) / [Co(0.5) / Pt(0.5)] 3 / Ta(5), the unit is nanometer, Ta is used for the bottom layer and protective layer.
[0049] The device is grown on the photoetched device, and the photoetched device includes such as figure 1 The silicon wafer shown in (c) (300 nm thermal oxide layer). Using AJA's ultra-high vacuum magnetron sputtering device, 5nm Ta was used as a buffer layer, followed by a Pt / Co magnetization layer and a Ru wedge structure, and finally 5nm Ta was plated as a protective layer.
[0050] After the growth is completed, use acetone to ultrasonically clean the photoresist on the surface of the silicon wafer, so that the silicon wafer only remains as figure 1 (c) Shaped device. It should be emphasized here that when preparing the Ru layer of the sample, it is necessary to use a baffle equipped with magnetron sputter...
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