Single-component epoxy resin flowing type underfill adhesive and preparation method thereof

Abstract

The invention belongs to the field of filling adhesives, and especially relates to a single-component epoxy resin flowing type underfill adhesive. The underfill adhesive comprises the following components in parts by mass: 10-50 parts of bisphenol F epoxy resin, 10-20 parts of a first filler, 5-10 parts of a second filler, 5-10 parts of a curing agent, 2-5 parts of a curing accelerator, 5-15 partsof a reactive diluent, 0.1-3 parts of a flexibilizer and 0.1-3 parts of an ion trapping agent, wherein the particle size of the first filler is greater than the particle size of the second filler. The fillers used in the invention are relatively low in mass fraction; through organic cooperation of the first filler and the second filler, the thermal conductivity coefficient of the whole underfilladhesive can be increased while the viscosity of a system is controlled; and the underfill adhesive has the characteristics of good cohesiveness, good thermal conductivity and insulation performance,good heat resistance, low viscosity, good fluidity, low hygroscopicity and the like.

Description

technical field [0001] The invention belongs to the field of filling adhesives, in particular to a one-component epoxy resin flow type bottom filling adhesive and a preparation method thereof. Background technique [0002] In the 21st century, due to the demand for wireless communications, portable computers, broadband Internet products and car navigation electronic products, the integration of electronic devices is getting higher and higher, the chip area is expanding, and the number of integrated circuit pins is increasing. At the same time, chip packaging is required The size is further miniaturized and miniaturized, integrated circuits are becoming lighter, thinner, and smaller, and the integration, density, and performance of integrated circuits are gradually improved, so many new packaging technologies and packaging forms have emerged. [0003] Packaging is to put "clothes" on the chip, protect the chip from damage caused by physical, chemical and other environmental f...

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Problems solved by technology

[0007] However, with the advent of the 5G era, the calculation of the chip is further increased, the heat generation is high, and the heat dissipation problem is becoming more and more prominent. However, the thermal conductivity of the traditional underfill adhesive is very low, which basically does not help the heat dissipation of electronic components.

Adding heat-conducting particles in the filler is a way to increase the thermal conductivity of the glue, but with the increase of heat-conducting particles, the fluidity of the glue will decrease again, which cannot satisfy the filling effect of the glue

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