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Structure and preparation method of novel high-thermal-conductivity s electronic packaging base plate material

An electronic packaging and high thermal conductivity technology, which is applied in the structure and preparation of substrate materials for new high thermal conductivity electronic packaging, can solve the problems of large thermal expansion coefficient and insignificant improvement of thermal conductivity, so as to reduce thermal expansion coefficient, improve thermal conductivity, and reduce thermal conductivity. cost effect

Active Publication Date: 2020-04-17
NANJING ZHONGJIANG NEW MATERIAL TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0004] In order to solve the above-mentioned problems in the prior art, the purpose of the present invention is to solve the technical problems in the prior art that the thermal conductivity of the substrate material for electronic packaging is not significantly improved and the thermal expansion coefficient is large at a low filler doping amount; the novel high thermal conductivity electronics of the present invention The substrate material for packaging is different from the traditional doping of powder directly. First, the organic polyurethane foam impregnation method is used to sinter the mesh porous alumina ceramics as the thermal conductive skeleton of the epoxy resin-based material, and then the surface is modified by the silane coupling agent to fill the ring. Oxygen resin potting, after high temperature curing, a ceramic / resin composite substrate material with good thermal conductivity is formed. At the same time, the invention provides a new type of interpenetrating network structure of substrate materials for electronic packaging. The ceramic skeleton formed by sintering greatly improves The interfacial thermal resistance between powders is reduced and the thermal conductivity is rapidly improved at a lower filling amount. Therefore, the special three-dimensional network porous structure prepared by the present invention is beneficial to Form a continuous heat conduction network, enhance the heat dissipation capacity of electronic component packaging materials and limit the free expansion of polymers

Method used

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  • Structure and preparation method of novel high-thermal-conductivity s electronic packaging base plate material
  • Structure and preparation method of novel high-thermal-conductivity s electronic packaging base plate material
  • Structure and preparation method of novel high-thermal-conductivity s electronic packaging base plate material

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Effect test

Embodiment 1

[0028] 1) Preparatory steps: prepare ceramic slurry; polyurethane foam sponge, size is 48cm*48cm*20cm, volume density is 0.0286g / cm 3 ; PT-7016 type epoxy resin (A) and curing agent (B), the viscosity after mixing is 600cps, the curing time is 6h at 25°C, 1h at 50°C, and the volume resistivity (50HZ) is 1.6×10 15Ω·cm; other preparation materials include epoxy resin defoamer XYS-6201 (foam breaking polyorganosiloxane), silicone mold, etc.

[0029] 2) Making a mesh porous ceramic skeleton: use w(NaOH)=20% NaOH solution to treat the polyurethane foam for 3 hours respectively, then wash and dry it with water, and use w(PVA)=5% PVA solution to its surface modified, and then the α-Al 2 o 3 The ceramic slurry prepared with powder as the main raw material is coated on the surface of the pretreated polyurethane foam, and then the reticular porous ceramic skeleton is prepared by extrusion, drying and calcination. The porosity of the prepared reticular porous ceramic skeleton is 92.5%....

Embodiment 2

[0033] 1) Preparatory steps: prepare ceramic slurry; polyurethane foam sponge, size is 48cm*48cm*20cm, volume density is 0.0597g / cm 3 ; PT-7016 type epoxy resin (A) and curing agent (B), the viscosity after mixing is 600cps, the curing time is 6h at 25°C, 1h at 50°C, and the volume resistivity (50HZ) is 1.6×10 15 Ω·cm; other preparation materials include epoxy resin defoamer XYS-6201 (foam breaking polyorganosiloxane), silicone mold, etc.

[0034] 2) Making a mesh porous ceramic skeleton: use w(NaOH)=20% NaOH solution to treat the polyurethane foam for 3 hours respectively, then wash and dry it with water, and use w(PVA)=5% PVA solution to its surface modified, and then the α-Al 2 o 3 The ceramic slurry prepared with powder as the main raw material is coated on the surface of the pretreated polyurethane foam, and then the reticular porous ceramic skeleton is prepared by extrusion, drying and calcination. The porosity of the prepared reticular porous ceramic skeleton is 88.3%...

Embodiment 3

[0038] 1) Preparatory steps: prepare ceramic slurry; polyurethane foam sponge, the size is 48cm*48cm*20cm; PT-7016 epoxy resin (A) and curing agent (B), the viscosity after mixing is 600cps, and the curing time is 25°C 6h, 1h at 50°C, volume resistivity (50HZ) 1.6×10 15 Ω·cm; silane coupling agent KH-560; other preparation materials include epoxy resin defoamer XYS-6201 (foam breaking polyorganosiloxane), silicone mold, etc.

[0039] 2) Making a mesh porous ceramic skeleton: use w(NaOH)=20% NaOH solution to treat the polyurethane foam for 3 hours respectively, then wash and dry it with water, and use w(PVA)=5% PVA solution to its surface modified, and then the α-Al 2 o 3 The ceramic slurry prepared with powder as the main raw material is coated on the surface of the pretreated polyurethane foam, and then the reticular porous ceramic skeleton is prepared by extrusion, drying and calcination. The porosity of the prepared reticular porous ceramic skeleton is 88.3%. , bulk dens...

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Abstract

The invention discloses a structure and a preparation method of a novel high-thermal-conductivity electronic packaging base plate material. The method comprises: sintering by using an organic polyurethane foam impregnation method to obtain a net-shaped porous aluminum oxide ceramic as a heat conduction framework of an epoxy resin-based material; carrying out surface modification with a silane coupling agent, filling with an epoxy resin, and carrying out encapsulation; and carrying out high-temperature curing to form the ceramic / resin composite base plate material with good heat conduction performance. The invention belongs to the field of base plate materials for electronic packaging. In the prior art, the existing ceramic / resin composite material cannot form a heat conduction network under low filler content. According to the invention, based on the problem in the prior art, a net-shaped porous structure is constructed by an organic foam impregnation method, and a light composite baseplate material is prepared through surface modification, epoxy resin negative pressure impregnation and other technologies, so that the heat conductivity of the composite material is substantially improved and the thermal expansion coefficient is substantially reduced under the condition of the low ceramic volume fraction; and the method is easy to operate, low in cost, excellent in performance and suitable for large-area popularization.

Description

technical field [0001] The invention belongs to the field of substrate materials for electronic packaging, and specifically refers to the structure and preparation method of a novel substrate material for electronic packaging with high thermal conductivity. Background technique [0002] In recent years, with the rapid development of electronic integration technology and the continuous increase in assembly density, electronic components have developed in the direction of lightness, thinness, and smallness, resulting in a large amount of heat accumulation in electronic components within a small volume range. High temperature will affect the performance of electronic components and lead to their failure, so it is particularly important to develop high thermal conductivity materials to reduce the operating temperature of electronic components. Polymers have been widely used in electronic device packaging due to their low cost, electrical insulation, corrosion resistance, and str...

Claims

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Application Information

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IPC IPC(8): C08L63/00C08K9/00C08K9/06C08K7/24
CPCC08K7/24C08K9/00C08K9/06C08L63/00
Inventor 傅仁利吴彬勇黄义炼邹燕清刘后宝
Owner NANJING ZHONGJIANG NEW MATERIAL TECH
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