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Process for manufacturing high-density molybdenum-niobium alloy sputtering target material

A molybdenum-niobium alloy and sputtering target technology, which is applied in metal material coating process, sputtering coating, ion implantation coating and other directions, can solve the problems of reducing efficiency, complex process steps, increasing target production cost and the like, Achieve the effect of reducing costs, uniform organization, and meeting the needs of high-end targets

Inactive Publication Date: 2019-09-20
LUOYANG SIFON ELECTRONICS
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

In addition, hot isostatic pressing is performed after cold isostatic pressing. To make metal inner and outer sheaths, the sheath needs to be vacuumed. The process steps are complicated, which reduces the efficiency and greatly increases the cost of target production.

Method used

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  • Process for manufacturing high-density molybdenum-niobium alloy sputtering target material
  • Process for manufacturing high-density molybdenum-niobium alloy sputtering target material
  • Process for manufacturing high-density molybdenum-niobium alloy sputtering target material

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0036] This embodiment provides a high-density molybdenum-niobium alloy sputtering target preparation process, including the following steps:

[0037] S1. Raw materials are mixed, the purity of molybdenum powder and niobium hydride powder is not less than 99.5%, the molybdenum powder passes through a 200 mesh sieve, the ball milled niobium hydride powder passes through a 160 mesh sieve, and is prepared after sieving in a ratio of 9:1 by weight Add molybdenum powder and niobium hydride powder into the V-type mixer, and flush the mixing body with argon gas into the V-type mixer for 15 minutes, then close the valve at one end of the mixer, continue to fill with argon, and then close Fill the valve with argon gas to keep the positive pressure in the mixer, start the mixing machine for 8 hours and then stop it to obtain molybdenum-niobium mixed powder;

[0038] S2. For the rubber suit powder operation, according to the needs, select a rubber sleeve with a suitable size, put the mol...

Embodiment 2

[0046] S1, the raw materials are mixed, the purity of molybdenum powder and niobium hydride powder is not less than 99.5%, the molybdenum powder is passed through a 200 mesh sieve, and the ball milled niobium hydride powder is passed through a 160 mesh sieve, and the molybdenum powder and niobium hydride powder are in a weight ratio of 9: Add the ratio of 1 to the mixer, add molybdenum powder and niobium hydride powder, flush the mixing body with argon gas in the mixer for 15 minutes, then close the valve at one end of the mixing body, continue to fill in argon, and then close the filling machine. The argon valve keeps the positive pressure in the mixer, starts the mixing machine for 8 hours and then stops it to obtain molybdenum-niobium mixed powder;

[0047] S2, rubber suit powder operation, according to the needs, select the rubber sleeve of appropriate size, put the molybdenum-niobium mixed powder obtained in step S1 into the rubber sleeve, and shake it while loading. After...

Embodiment 3

[0055] This embodiment provides a high-density molybdenum-niobium alloy sputtering target preparation process, including the following steps:

[0056] S1, the raw materials are mixed, the purity of molybdenum powder and niobium hydride powder is not less than 99.5%, the molybdenum powder is passed through a 200 mesh sieve, and the ball milled niobium hydride powder is passed through a 160 mesh sieve, and the molybdenum powder and niobium hydride powder are in a weight ratio of 9: Add the ratio of 1 to the mixer, add molybdenum powder and niobium hydride powder, flush the mixing body with argon for 15 minutes, then close the valve at one end of the mixing body, continue to fill with argon, and then close the argon filling valve to make Keep the positive pressure in the mixer, start the mixer and stop it after 12 hours to obtain molybdenum-niobium mixed powder;

[0057] S2, rubber suit powder operation, according to the needs, choose the rubber sleeve of appropriate size, put th...

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Abstract

The invention belongs to the field of manufacturing high-temperature refractory metal target materials, and particularly relates to a process for manufacturing a high-density molybdenum-niobium alloy sputtering target material. The process comprises the steps of mixing raw materials; loading mixed material powder in a rubber sleeve; performing cold isostatic pressing operation, after the pressure is increased to a certain pressure, maintaining the pressure for a period of time, then depressurizing, and finally taking out a pressed blank from the rubber sleeve; carrying out vacuum sintering or hydrogen protection sintering; carrying out hot isostatic pressing operation directly on the sintered blank; performing hot rolling operation, namely performing metal sleeve rolling on a molybdenum-niobium alloy, and annealing after hot rolling to remove stress; and carrying out machining operations such as grinding to obtain the final required product size. The process is simple in processing steps and convenient to operate, the purity and the relative density of the manufactured molybdenum-niobium alloy sputtering target material all meet the use requirements in the film coating field of high-end electronic products; and the process is low in production cost, wide in production size range, and convenient for industrial batch production.

Description

technical field [0001] The invention belongs to the field of high-temperature refractory metal target preparation, and in particular relates to a preparation process of a high-density molybdenum-niobium alloy sputtering target. Background technique [0002] Molybdenum target is a characteristic electronic material with high added value. In the electronics industry, molybdenum sputtering target is mainly used in flat-panel displays, electrode and wiring materials of thin-film solar cells, and barrier layer materials of semiconductors. These are based on molybdenum's high melting point, high electrical conductivity, low specific impedance, good corrosion resistance and good environmental performance. [0003] Compared with the pure molybdenum target, after adding a certain proportion of niobium to the molybdenum, the pixels of the liquid crystal display can be increased or enlarged by more than two times, so that the large display with long electrodes has high definition, high...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C23C14/34B22F3/04B22F3/10B22F3/15B22F3/18B22F3/24C22C27/04
CPCB22F3/04B22F3/1007B22F3/15B22F3/18B22F3/24B22F2003/248C22C27/04C23C14/3414
Inventor 李帅方方宏孙虎民张雪凤刘宁平陈亚光高艳岭
Owner LUOYANG SIFON ELECTRONICS
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