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Hot-melt strippable pressure-sensitive adhesive resin as well as preparation method and application thereof

A pressure-sensitive adhesive, hot-melt technology, used in the chemical industry, can solve problems such as large solvent emissions, low cohesion, and harmful residues, and achieve the effect of high-efficiency and easy-to-operate environment and excellent peel strength.

Inactive Publication Date: 2019-07-23
广州五行材料科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] Another object of the present invention is to provide a method for preparing the above-mentioned hot-melt peelable pressure-sensitive adhesive resin, which is efficient and easy to use, using a bulk polymerization process without any emissions to synthesize thermal Melted pressure-sensitive adhesive resin, which solves the defects of ordinary pressure-sensitive adhesive resins such as low cohesion, large solvent discharge, and harmful residues

Method used

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  • Hot-melt strippable pressure-sensitive adhesive resin as well as preparation method and application thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0024] A four-neck flask with a condenser and a stirrer was heated to 120°C, filled with nitrogen, and 0.5g of 2-hydroxy-4-(methacryloyloxy)benzophenone, 5g of 2-(4-cyclohexene- 1,2 dicarboxyimide) ethyl acrylate, 20g of isooctyl acrylate, 44.5g of butyl acrylate, 30g of acrylic acid, 95g of glycidyl tert-carbonate, and 0.97g of dioctyl peroxydicarbonate are mixed evenly , 120 ° C stirring reaction for 7 hours to obtain a hot-melt peelable pressure-sensitive adhesive resin.

Embodiment 2

[0026] A four-necked flask with a condenser and a stirrer was heated to 125°C, filled with nitrogen, and 1g of 2-(4-benzoyl-3-hydroxyphenoxy)ethyl 2-acrylate, 20g of 2-(1,2 -cyclohexanedicarboxyimide) ethyl acrylate, 40g isodecyl acrylate, 29g butyl acrylate, 10g acrylic acid, 106.75g carbon 12-14 alkyl glycidyl ether and 1g dioctyl peroxydicarbonate The esters were mixed evenly, and stirred and reacted at 125° C. for 6 hours to obtain a hot-melt peelable pressure-sensitive adhesive resin.

Embodiment 3

[0028] A four-necked flask with a condenser and a stirrer was heated to 120°C, filled with nitrogen, and 0.8g of 4-acryloyloxybenzophenone, 13g of isobornyl methacrylate, 30g of isotridecyl acrylate , 34g of butyl acrylate, 22.2g of acrylic acid, 57.39g of octyl glycidyl ether and 1.1g of dioctyl peroxydicarbonate were mixed uniformly, and stirred and reacted at 120°C for 6 hours to obtain a hot-melt peelable pressure-sensitive adhesive resin.

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Abstract

The invention belongs to the technical field of the chemical industry, and discloses hot-melt strippable pressure-sensitive adhesive resin as well as a preparation method and an application thereof. The pressure-sensitive adhesive resin is prepared by steps as follows: (methyl) acrylate monomers with the diphenylketone structure on side chains, (methyl) acrylate monomers with the aliphatic ring structure on side chains and the number of aliphatic ring carbon atoms larger than or equal to 7, (methyl) acrylate monomers containing branched alkyl carbon chains with the number of carbon atoms larger than or equal to 8 on side chains, butyl acrylate, carboxyl-containing monomers and aliphatic monoepoxy resin with the number of carbon atoms larger than or equal to 8 are mixed, dioctyl peroxide dicarbonate is added, all components are mixed uniformly and subjected to a stirring reaction at 120-130 DEG C, and the hot-melt strippable pressure-sensitive adhesive resin is obtained by free radicalpolymerization. The resin is applied to various strippable pressure-sensitive adhesives or labels, has higher adhesive property after being ultraviolet-cured, is free of adhesive residues after beingstripped and can be repeatedly used.

Description

technical field [0001] The invention belongs to the technical field of chemical industry, and more specifically relates to a hot-melt peelable pressure-sensitive adhesive resin and its preparation method and application. Background technique [0002] Pressure-sensitive adhesives are the key resins for various labels, tapes, and medical and sanitary stickers. Commonly used pressure-sensitive adhesive resins are divided into hot-melt type, solvent-based and UV-curable type. Hot-melt type pressure-sensitive adhesive resins are easy to construct and environmentally friendly. It has a wide range of applications, but the cohesion of hot-melt pressure-sensitive adhesive resin is relatively weak, and it is not resistant to high temperature, and it is easy to leave glue when peeling off. In contrast, solvent-based hot-melt adhesive resins have stronger cohesive force and better peelability, but a large amount of solvent volatilizes during use. UV-curable pressure-sensitive adhesive ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C09J7/38C09J133/08C09J133/10C09J7/25C08F220/18C08F220/06C08F220/36C08F220/30G09F3/10
CPCC08F220/18C09J133/14C09J2467/005C09J2467/006C09J7/255C09J7/385C08F220/1804C08F220/1811C09J2301/122C09J2301/302C09J2301/304G09F3/10C08F220/06C08F220/365C08F220/302C08F220/1808C08F220/301
Inventor 杨德彬唐东明贾国忠
Owner 广州五行材料科技有限公司
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