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Halogen-free flame-retardant epoxy resin composition, flexible copper clad laminate made therefrom and preparation of the flexible copper clad laminate

A flexible copper clad laminate and epoxy resin technology, applied in the direction of circuit substrate materials, printed circuit components, etc., can solve the problems of exudation or migration of small molecular fillers, poor mechanical properties of plates, uneven dispersion of fillers, etc. Mechanical properties, excellent dimensional stability, the effect of enhancing compatibility

Inactive Publication Date: 2008-10-08
GUANGDONG SHENGYI SCI TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Due to the addition of a large amount of organophosphorus flame retardants and other inorganic fillers, on the one hand, there is a potential risk of uneven dispersion of fillers in the process of preparing the resin composition; Large, and there is a danger of small molecule fillers seeping or migrating to the surface during processing or subsequent use

Method used

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  • Halogen-free flame-retardant epoxy resin composition, flexible copper clad laminate made therefrom and preparation of the flexible copper clad laminate

Examples

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Effect test

Embodiment 1

[0059] Phosphorus-containing epoxy resin (commercial model G-24, epoxy equivalent 340g / eq, phosphorus content 2.4 mass %, manufactured by Jiangshan Jianghuan Chemical Industry Co., Ltd.) 39 parts by weight; synthetic rubber (commercial model Nipol 1072, acrylonitrile content 27 mass %, manufactured by Zeon Corporation) 20 parts by weight; rubber-modified epoxy resin (commercial model Epon Resin 58005, elastomer content 40 mass %, Hexion Specialty Chemicals, Inc. manufactured) 13 parts by weight; phosphorus-containing phenolic resin (commercial product Model XZ 92741, phosphorus content 9 mass %, manufactured by Dow Chemical Company) 28 parts by weight; Diaminodiphenyl sulfone 2.5 parts by weight; 1-cyanoethyl-2-ethyl-4-methylimidazole (2E4MZ-CN) 0.30 Parts by weight; 30 parts by weight of aluminum hydroxide (average particle diameter of 1 to 5 μm, purity above 99%); 0.20 parts by weight of antioxidant (product model 1010, manufactured by CIBA GEIGY Co.). The solid content of t...

Embodiment 2

[0061] Phosphorus-containing epoxy resin (product model XZ 92530, epoxy equivalent 340g / eq, phosphorus content 3.0 mass%, manufactured by Dow Chemical Company) 38 parts by weight; synthetic rubber (commodity model Nipol 1072, acrylonitrile content 27 mass%, Zeon Corporation manufacturing) 20 weight parts; Rubber-modified epoxy resin (commodity model Hy RK84, elastomer content 32 mass %, CVC Specialty Chemicals Inc., manufacture) 16 weight parts; Phosphorus-containing phenolic resin (commercial model XZ92741, phosphorus content 9 mass %, manufactured by Dow Chemical Company) 26 parts by weight; Diaminodiphenyl sulfone 2.0 parts by weight; 0.30 parts by weight of 1-cyanoethyl-2-ethyl-4-methylimidazole (2E4MZ-CN); Aluminum hydroxide ( 30 parts by weight of an average particle diameter of 1 to 5 μm, and a purity of 99% or more); 0.20 parts by weight of an antioxidant (product model 1010, manufactured by CIBA GEIGY Co.). The solid content of the glue solution is adjusted to 40% wit...

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Abstract

The invention relates to a halogen-free flame-retardant epoxy resin composite, the flexible copper clad laminate made from the epoxy resin composite and the production method. The halogen-free flame-retardant epoxy resin composite is composed of solid components and organic solvents, wherein, the solid components include: phosphorus epoxy resin, synthetic rubber, rubber-modified epoxy resin and composite curing agent. The flexible copper clad laminate made from the halogen-free flame-retardant epoxy resin composite is a three-layer flexible copper clad laminate, including a polyimide insulation film, a coating of halogen-free flame-retardant epoxy resin composite coated on the polyimide insulation film, and a copper foil pressed on the coating of halogen-free flame-retardant epoxy resin composite. The resin composite of the invention is halogen-free and dispenses with other organic phosphorus flame retardants; the flexible copper clad laminate made from the composite has the flame retardancy up to UL94 V-0-level and has the advantages of high peeling strength, excellent dimensional stability, softness, good ion migration resistance and processing performance.

Description

technical field [0001] The invention relates to a halogen-free flame-retardant epoxy resin composition, a flexible copper-clad laminate made by using the halogen-free flame-retardant epoxy resin composition, and a method for manufacturing the flexible copper-clad laminate. Background technique [0002] For a long time, three-layer flexible copper clad laminates (FCCL) have used brominated resins with high bromine content to achieve flame retardant purposes. Although they have good flame retardant effects, they will produce corrosive and toxic hydrogen halide gases during combustion. , and the amount of smoke is large, and there may be a hidden danger of producing carcinogenic dioxins when the combustion is incomplete; in addition, the coefficient of thermal expansion (CTE) of brominated resins is larger than that of non-brominated resins. In order to meet the green environmental protection trend of "lead-free process" and "halogen-free substrate materials", manufacturers are...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08L63/00C08L13/00C08K5/41C08K5/3445C08K3/22H05K1/03
Inventor 刘生鹏茹敬宏伍宏奎梁立盖其良
Owner GUANGDONG SHENGYI SCI TECH
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