Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

Halogen-free and highly-heatproof resin composition for copper-clad board

A resin composition, high heat resistance technology, applied in the field of copper clad laminates, can solve problems such as circuit short circuit, affecting circuit, open circuit, etc., and achieve the effect of reducing expansion coefficient, excellent dielectric properties, and cost reduction

Inactive Publication Date: 2019-04-30
ITEQ DONGGUAN
View PDF5 Cites 8 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

At the same time, the lines are becoming more and more dense, and the dense lines are easy to affect the circuit when the base material is damaged during mechanical processing, causing the circuit to short circuit or break.

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Halogen-free and highly-heatproof resin composition for copper-clad board
  • Halogen-free and highly-heatproof resin composition for copper-clad board
  • Halogen-free and highly-heatproof resin composition for copper-clad board

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0050] The present invention discloses a halogen-free high heat-resistant resin composition for copper-clad laminates. Based on 100 parts by weight of organic solids (PHR), the composition contains the following main components:

[0051] (a) Main chain benzoxazine resin 5-60PHR containing polystyrene;

[0052] (b) High heat-resistant epoxy resin 20-50PHR;

[0053] (c) Other curing agent 5-30PHR;

[0054] (d) Toughening resin 0.1-10PHR;

[0055] (d) Phosphorous flame retardant 10-30PHR;

[0056] (e) Inorganic filler 40~150PHR;

[0057] (d) curing accelerator 0.01 ~ 1PHR;

[0058] (f) silane coupling agent 0.01~1PHR;

[0059] (g) An appropriate amount of solvent.

[0060] The main chain benzoxazine resin containing polystyrene has the following general structural formula:

[0061]

[0062] In the formula, m is 1-200, n is 1-5,

[0063] R 1 for R 2 for R 3 for

[0064] The high heat-resistant epoxy resin is bisphenol A type novolak epoxy resin, o-cresol novol...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

The invention discloses a halogen-free and highly-heatproof resin composition for a copper-clad board. 100 PHR of organic solids of the composition mainly comprise 5-60 PHR of polystyrene-containing main chain benzoxazine resin, 20-50 PHR of highly-heatproof epoxy resin, 5-30 PHR of other curing agents, 0.1-10 PHR of toughened resin, 10-30 PHR of a phosphorus-containing fire retardant, 40-150 PHRof an inorganic filler, 0.01-1 PHR of a curing promoter, 0.01-1 PHR of a silane coupling agent, and a proper amount of a solvent. The copper foil-clad laminated board produced from the composition hasthe advantages of excellent dielectric properties, high glass transition temperature, low coefficient of thermal expansion, high heatproof property, good flame retardancy and excellent PCB processingperformances.

Description

technical field [0001] The invention relates to the technology in the field of copper-clad laminates, in particular to a halogen-free high heat-resistant resin composition for copper-clad laminates, which has excellent dielectric properties, high glass transition temperature, low thermal expansion coefficient, high heat resistance Thermal, excellent machinability and other properties, can meet the high frequency and high speed PCB multilayer board process. Background technique [0002] In order to make the flame retardant reach UL94V0 level and prevent the circuit from causing fire due to short circuit, traditional printed circuit laminates usually add brominated flame retardants, such as tetrabromobisphenol A, to the composition, but halogenated flame retardants Or when the resin burns, it will generate toxic and corrosive gas, which will cause great harm to the human body and the surrounding environment. In particular, the European Union officially implemented two environ...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Applications(China)
IPC IPC(8): C08L61/34C08L63/00C08K3/36C08K5/5399
CPCC08L61/34C08L2201/02C08L2201/08C08L2201/22C08L63/00C08K3/36C08K5/5399
Inventor 陈盛栋蒋勇新唐锋朱全胜邓恺艳涂发全杨联慧
Owner ITEQ DONGGUAN
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Patsnap Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com