Black resin composition, polyimide with black resin cured film and production method therefor, and flexible printed wiring board using black resin cured film
A technology of black resin and polyimide, which is applied in chemical instruments and methods, printed circuits, printed circuits, etc., can solve the problems that light is difficult to penetrate to the bottom, and cannot fully guarantee the light curing property, so as to achieve superior flame retardancy , high concealment effect
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Synthetic example 1
[0325] (Synthesis example 1: (a) Synthesis 1 of carboxyl group-containing photosensitive resin)
[0326] Add triethylene glycol dimethyl ether (=1,2-bis(2-methoxyethoxy)ethane) as a polymerization solvent to a reaction vessel equipped with a stirrer, a thermometer, a dropping funnel, and a nitrogen gas introduction tube 100.0 g, and heated up to 80°C while stirring under a nitrogen stream. In the state of maintaining 80 ℃, spend 3 hours from the dropping funnel to drop the following ingredients mixed in advance at room temperature: 12.0 g (0.14 moles) of methacrylic acid, 28.0 g (0.16 moles) of benzyl methacrylate, 60.0 g (0.42 mol) of butyl methacrylate and 0.5 g of azobisisobutyronitrile as a radical polymerization initiator. After completion of the dropwise addition, the temperature of the reaction solution was raised to 90° C. while stirring, and the temperature of the reaction solution was kept at 90° C. and stirring was continued for 2 hours to cause a reaction. Throug...
Synthetic example 2
[0342] (Synthesis example 2: (a) Synthesis 2 of carboxyl group-containing photosensitive resin)
[0343] To a reaction vessel equipped with a stirrer, a thermometer, and a nitrogen gas introduction tube, 40.00 g of triethylene glycol dimethyl ether (=1,2-bis(2-methoxyethoxy)ethane) was added as a polymerization solvent, and then 20.62 g (0.100 mol) of norbornene diisocyanate was added there, and it heated to 80 degreeC, stirring under nitrogen flow, and dissolved it. To this solution, 50.00 g (0.025 mol) of polycarbonate diol (product name PCDL T5652 manufactured by Asahi Kasei Co., Ltd., weight average molecular weight 2000), 3.70 g of 2,2-bis(hydroxymethyl)butanoic acid were added to the solution over 1 hour. (0.025 mol) and 13.02 g (0.100 mol) of 2-hydroxyethyl methacrylate dissolved in 40.00 g of triethylene glycol dimethyl ether. The solution was heated and stirred at 80° C. for 5 hours to cause a reaction. Through the above reaction, a carboxyl-containing photosensitiv...
Synthetic example 3
[0344] (Synthesis example 3: Synthesis 1 of base binder other than (a) carboxyl group-containing photosensitive resin)
[0345] Into a reaction container equipped with a stirrer, a thermometer, and a nitrogen gas introduction tube, 30.00 g of triethylene glycol dimethyl ether (=1,2-bis(2-methoxyethoxy)ethane) was added as a polymerization solvent, and then 10.31 g (0.050 mol) of norbornene diisocyanate was added there, and it heated to 80 degreeC, stirring under nitrogen flow, and was made to melt|dissolve. To this solution, 50.00 g (0.025 mol) of polycarbonate diol (product name PCDL T5652 manufactured by Asahi Kasei Co., Ltd., weight average molecular weight 2000) and 6.51 g (0.050 mol) of 2-hydroxyethyl methacrylate were added to the solution over 1 hour. A solution dissolved in 30.00 g of triethylene glycol dimethyl ether. The solution was heated and stirred at 80° C. for 5 hours to cause a reaction. Through the above reaction, a base binder solution (R-1) was obtained. ...
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