A kind of diamond scribing knife for dividing ceramic substrate and preparation method thereof

A ceramic substrate and diamond technology, which is applied in metal processing and other directions, can solve the problems of limiting cutting dimensional accuracy, edge chipping and large size of micro-cracks, etc., to achieve the effects of avoiding chipping, easy molding, and solving technical problems

Active Publication Date: 2020-09-29
苏州赛尔科技有限公司
View PDF7 Cites 2 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The dimensional accuracy of conventional blades severely limits the dimensional accuracy of cutting, and the lower the accuracy of the blade, the larger the size of chipping and microcracks

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0037] According to the volume ratio, accurately weigh 18.75% diamond, 52% epoxy resin powder, 6% silicon carbide, 11% aluminum oxide, 11.25% titanium oxide fiber, 1% 4-methyl benzyl alcohol, and ball mill several raw materials (120rpm / min, 3.5 hours) after mixing, use a 300-mesh sieve to sieve once to complete the molding material preparation. Put the molding material into the mold cavity, smooth it with a scraper, cover the mold, transfer the mold to the worktable of the hot press machine, heat press it with 66KN pressure, 180°C temperature, and air conditions for 15 minutes, water-cool the mold and demould to obtain a scratch. The blade is hot-pressed, and after a secondary curing at 180°C for 12 hours, it enters the machining process to grind the inner and outer diameters. The dimensional accuracy of the blade reaches 4 μm, cutting 4*3mm Al 2 o 3 Ceramic substrate, the cutting life of the blade can reach 150m, and the product yield rate is 98.5%.

Embodiment 2

[0039] According to the volume ratio, accurately weigh 18.75% diamond, 48% epoxy resin powder, 12% silicon carbide, 10% aluminum oxide, 11.05% titanium oxide fiber, 1.2% 4-methyl benzyl alcohol, and ball mill several raw materials (120rpm / min, 3.5 hours) after mixing, use a 300-mesh sieve to sieve once to complete the molding material preparation. Put the molding material into the mold cavity, smooth it with a scraper, cover the mold, transfer the mold to the worktable of the hot press machine, heat press it with 66KN pressure, 180°C temperature, and air conditions for 15 minutes, water-cool the mold and demould to obtain a scratch. The blade is hot-pressed, and after a secondary curing at 180°C for 12 hours, it enters the machining process to grind the inner and outer diameters. The dimensional accuracy of the blade reaches 4μm, and it can cut 3*3mm AlN ceramic substrates. The cutting life of the blade can reach 147m, and the product yield rate 98.5%.

Embodiment 3

[0041] According to the volume ratio, accurately weigh 18.75% diamond, 45% epoxy resin powder, 10% silicon carbide, 10.25% alumina, 15% titanium oxide fiber, 1% 4-methylbenzyl alcohol, and ball mill several raw materials (120rpm / min, 3.5 hours) after mixing, use a 300-mesh sieve to sieve once to complete the molding material preparation. Put the molding material into the mold cavity, smooth it with a scraper, cover the mold, transfer the mold to the worktable of the hot press machine, heat press it with 66KN pressure, 180°C temperature, and air conditions for 15 minutes, water-cool the mold and demould to obtain a scratch. The blade is hot-pressed, and after a secondary curing of 180°C for 12 hours, it enters the machining process to grind the inner and outer diameters. The dimensional accuracy of the blade reaches 4 μm, and it can cut 4*3mm AlN ceramic substrates. The cutting life of the blade can reach 143m, and the product yield rate 98.5%.

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

PUM

PropertyMeasurementUnit
particle diameteraaaaaaaaaa
diameteraaaaaaaaaa
lengthaaaaaaaaaa
Login to view more

Abstract

The invention discloses a diamond scribing knife for ceramic substrate segmentation as well as a preparation method thereof. The preparation method comprises the following steps: enabling a mixture ofdiamond, epoxy resin powder, silicon carbide, aluminum oxide, titanium oxide fiber and 4-methylbenzyl alcohol to pass through a 300-mesh sieve to obtain a molding material; hot-pressing the molding material to obtain a hot-pressed green body; curing the hot-pressed green body to obtain a molding body; and processing the molding body to obtain the diamond scribing knife for ceramic substrate segmentation. The diamond scribing knife disclosed by the invention can be applied to ceramic substrate segmentation, has the size precision only being 4 mum, has the sharp generality of a resin binding agent diamond scribing knife, also has the characteristics of high processing precision, small processing edge breakage, avoidance of microcrack and the like, and effectively solves the technical problem of ceramic substrate high-precision segmentation.

Description

technical field [0001] The invention belongs to the technical field of cutting knives, and in particular relates to a diamond scribing knife for dividing a ceramic substrate and a preparation method thereof. Background technique [0002] Ceramic substrate refers to a special process board in which copper foil is directly bonded to the surface of an alumina (AL2O3) or aluminum nitride (ALN) ceramic substrate (single or double-sided) at high temperature. The produced ultra-thin composite substrate has excellent electrical insulation performance, high thermal conductivity, excellent solderability and high adhesion strength, and can etch various patterns like a PCB board, and has a large current-carrying capacity. ability. Therefore, ceramic substrates have become the basic materials for high-power power electronic circuit structure technology and interconnection technology. Ceramics basically need to have high enough mechanical strength. In addition to carrying components, th...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

Application Information

Patent Timeline
no application Login to view more
Patent Type & Authority Patents(China)
IPC IPC(8): C04B26/14B26F1/44
CPCB26F1/44C04B26/14C04B14/022C04B14/324C04B14/303C04B14/4618C04B24/02
Inventor 王丽萍李威陈昱刘学民冉隆光
Owner 苏州赛尔科技有限公司
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Try Eureka
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap