Extrusion type solar energy backboard and manufacturing method thereof
A solar back sheet, extrusion-type technology, applied in chemical instruments and methods, other household appliances, electrical components, etc., can solve the problems of low rigidity, reduced mechanical strength of solar back sheets, low low temperature impact strength, etc.
- Summary
- Abstract
- Description
- Claims
- Application Information
AI Technical Summary
Problems solved by technology
Method used
Image
Examples
Embodiment 1
[0111] An extruded solar backboard, the backboard has a three-layer structure of inner layer / middle layer / outer layer;
[0112] (1) Inner layer structure: add 10 parts of titanium dioxide R960 (DuPont, USA) and 0.3 parts of silane coupling agent 3-aminopropyltriethoxysilane KH550 (Danyang Organic Silicon Material Industry Co., Ltd.) into the high mixer In, stir 30 minutes, rotating speed 600 rev / mins, obtain the filler of silane coupling agent pretreatment; Then the filler of above-mentioned silane coupling agent pretreatment and 67 parts of low-density polyethylene LD100BW (Beijing Yanshan Petrochemical Company, its density is 0.923g / cm 3 , DSC melting point is 110 ℃, melt flow rate of 190 ℃ / 2.16kg is 1.8g / 10min), 33 parts of homopolypropylene 1300 (Beijing Yanshan Petrochemical Company, its DSC melting point is 160 ℃, 230 ℃ / 2.16kg Melt flow rate is 1.5g / 10min), 0.1 part of antioxidant tetrakis [β-(3', 5'-di-tert-butyl-4'-hydroxyphenyl) propionate] pentaerythritol ester (Bei...
Embodiment 2
[0117] An extruded solar backboard, the backboard has an inner / outer two-layer structure;
[0118] (1) Inner layer structure: 10 parts of titanium dioxide R960, 10 parts of talc powder (Lingshou County Shunxin Mineral Products Processing Factory) and 0.3 parts of silane coupling agent 3-glycidyl etheroxypropyltrimethoxysilane KH560 ( Danyang Organosilicon Material Industry Co., Ltd.) was added into a high mixer, stirred for 30 minutes, and the rotating speed was 600 rpm to obtain the filler pretreated by the silane coupling agent; then the filler pretreated by the above silane coupling agent and 34 parts of linear Low-density polyethylene LLDPE7042 (Sinopec Yangzi Petrochemical Co., Ltd., its density is 0.918g / cm 3 , DSC melting point is 121°C, melt flow rate of 190°C / 2.16kg is 2g / 10min), 33 parts of random copolymerized polypropylene R370Y (Korea SK Group, its DSC melting point is 164°C, melting point of 230°C / 2.16kg Bulk flow rate is 18g / 10min), 33 parts of block copolymer ...
Embodiment 3
[0122] An extruded solar backboard, the backboard has a three-layer structure of inner layer / middle layer / outer layer;
[0123] (1) Inner layer structure: 10 parts of titanium dioxide R960, 10 parts of talc powder, 10 parts of sericite powder GA5 (Chuzhou Gray Mining Co., Ltd.) and 0.3 parts of silane coupling agent 3-aminopropyltriethoxysilane Add KH550 into a high mixer, stir for 30 minutes at a speed of 600 rpm to obtain a filler pretreated with a silane coupling agent; Segment copolymerized polypropylene K8303, 0.1 part of antioxidant tetrakis [β-(3', 5'-di-tert-butyl-4'-hydroxyphenyl) propionate] pentaerythritol ester, 0.2 part of ultraviolet absorber 2-hydroxy-4 -N-octyloxybenzophenone, 0.2 parts of light stabilizer bis(2,2,6,6-tetramethyl-4-piperidinyl) sebacate, mixed uniformly; The material is put into the A screw of the three-layer co-extrusion sheet unit, the screw diameter is 75mm, and the aspect ratio is 33;
[0124] (2) Intermediate layer structure: Add 10 part...
PUM
Property | Measurement | Unit |
---|---|---|
density | aaaaa | aaaaa |
melting point | aaaaa | aaaaa |
melt flow index | aaaaa | aaaaa |
Abstract
Description
Claims
Application Information
- R&D Engineer
- R&D Manager
- IP Professional
- Industry Leading Data Capabilities
- Powerful AI technology
- Patent DNA Extraction
Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.
© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com