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Magnetoconductive polyamide hot melt adhesive and preparation method thereof

A polyamide hot-melt adhesive and magnetic conductivity technology, which is applied in adhesives, adhesive additives, non-polymer adhesive additives, etc., can solve the problems of low hardness, poor thermal performance, and easy sticking of hot-melt adhesives, etc. , to achieve the effect of uniform coating, excellent magnetic permeability and high bonding strength

Inactive Publication Date: 2017-06-27
SHANDONG HIGHDEV NEW MATERIAL TECH CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] The magnetic conductive hot melt adhesive is mainly made of some polymer materials as the matrix, and the magnetic conductive material is added to make the adhesive. US patent US4427481 invented a magnetic conductive hot melt adhesive composed of EVA material as the matrix and the magnetic conductive material. However, this type of hot melt adhesive has disadvantages such as low hardness, easy sticking to the mold, poor thermal performance, and easy scratching. However, the sealing and bonding of automotive metal joints and gaps often require Adhesive materials have the characteristics of high hardness and good flexibility, so it is imperative to prepare a magnetic adhesive that can not only conduct magnetism, but also has high hardness, good flexibility, high bonding strength, non-toxic and environmentally friendly

Method used

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  • Magnetoconductive polyamide hot melt adhesive and preparation method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0029] In a 500ml four-neck flask equipped with a mechanical stirrer, a thermometer, a condenser tube, and a nitrogen inlet tube, add 210g of aliphatic dimer acid, 26.29g of sebacic acid, 2g of hypophosphorous acid, 1010 5g of antioxidant, and 5g of nanomagnetic Add 22g of ferrite, 30.05g of ethylenediamine into a 100ml constant pressure dropping funnel, pass nitrogen gas to prevent oxidation, stir and heat up at the same time, when the reaction temperature is 130°C, start adding ethylenediamine dropwise, and the dropping time is controlled at 40-60min, the temperature is controlled within 140°C. After the dropwise addition, start to slowly raise the temperature to 240°C. During the heating process, water will distill out. When the reaction temperature reaches 240°C, use a vacuum pump to vacuumize and depressurize. The vacuum degree is <100Pa , kept at a constant stirring speed for 4h, and after 4h, the vacuum was released to end the reaction, and the molten polyamide hot melt ...

Embodiment 2

[0031] In a 500ml four-necked flask equipped with a mechanical stirrer, a thermometer, a condenser tube, and a nitrogen inlet tube, add 220g of aliphatic dimer acid, 20.22g of sebacic acid, 2g of hypophosphorous acid, 1010 5g of antioxidant, and 5g of nanomagnetic Add 22g of ferrite, 30.05g of ethylenediamine into a 100ml constant pressure dropping funnel, pass nitrogen gas to prevent oxidation, stir and heat up at the same time, when the reaction temperature is 130°C, start adding ethylenediamine dropwise, and the dropping time is controlled at 40-60min, the temperature is controlled within 140°C. After the dropwise addition, start to slowly raise the temperature to 240°C. During the heating process, water will distill out. When the reaction temperature reaches 240°C, use a vacuum pump to vacuumize and depressurize. The vacuum degree is <100Pa , kept at a constant stirring speed for 4h, and after 4h, the vacuum was released to end the reaction, and the molten polyamide hot mel...

Embodiment 3

[0033] In a 500ml four-necked flask equipped with a mechanical stirrer, a thermometer, a condenser tube, and a nitrogen inlet tube, add 224g of aliphatic dimer acid, 16.2g of sebacic acid, 2g of hypophosphorous acid, 1010 5g of antioxidant, and 5g of nanomagnetic Add 22g of ferrite, 30.05g of ethylenediamine into a 100ml constant pressure dropping funnel, pass nitrogen gas to prevent oxidation, stir and heat up at the same time, when the reaction temperature is 130°C, start adding ethylenediamine dropwise, and the dropping time is controlled at 40-60min, the temperature is controlled within 140°C. After the dropwise addition, start to slowly raise the temperature to 240°C. During the heating process, water will distill out. When the reaction temperature reaches 240°C, use a vacuum pump to vacuumize and depressurize. The vacuum degree is <100Pa , kept at a constant stirring speed for 4h, and after 4h, the vacuum was released to end the reaction, and the molten polyamide hot melt...

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Abstract

The invention discloses a magnetoconductive polyamide hot melt adhesive and a preparation method thereof. The magnetoconductive polyamide hot melt adhesive is prepared from the following raw materials in percentage by mole: 35-45% of dimer fatty acid, 5-20% of dicarboxylic fatty acid, 40-55% of aliphatic diamine, 0.1-2% of an antioxidant, 0.01-0.1% of an acid catalyst and 1.5-15% of a nano magnetic ferrite. The magnetoconductive polyamide hot melt adhesive disclosed by the invention not only has a good magnetoconductive property, but also has good compatibility, and has the characteristics of being high in bonding strength, high in surface hardness, good in heat resistance, high in practicality and the like.

Description

technical field [0001] The invention relates to a magnetically conductive polyamide hot-melt adhesive and a preparation method thereof, belonging to the field of hot-melt adhesives. Background technique [0002] In recent years, with the development of the automobile industry and the electronics industry, the manufacture and use of a large number of magnetic components, and the need for sealing metal joints and gaps, magnetically conductive adhesives have emerged. Magnetically conductive adhesives are adhesives with certain bonding strength and good magnetic permeability. Adhesives are mainly used as magnetic materials in magnetic media in magnetic materials, and their functions are mainly bonding and insulation. Bonding is an adhesive that bonds magnetic materials into shape, and insulation is an adhesive that separates magnetic particles from each other. Under the condition of alternating magnetic field, the turbine loss is reduced. [0003] The magnetic conductive hot m...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C09J177/06C09J11/04C08G69/34
CPCC09J177/06C08G69/34C08K3/22C08K2003/2265C08K2201/011C09J11/04
Inventor 刘克增马其祥苟曲延石娜
Owner SHANDONG HIGHDEV NEW MATERIAL TECH CO LTD
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