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Etching solution composition, method for etching multilayer film, and method for manufacturing display device

A technology of composition and etching solution, applied in the direction of semiconductor/solid-state device manufacturing, electric solid-state device, semiconductor device, etc., can solve the problems of deterioration of operating environment, dissolution of resist, change of etching rate, etc., to prevent etching residue or precipitation The effect of reducing the amount of waste and waste liquid, and maximizing the linearity

Active Publication Date: 2021-02-05
SAMYOUNG PURE CHEM +2
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  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, such an alkaline etching solution has a high pH, ​​so a large amount of ammonia volatilizes from the etching solution, and sometimes the etching rate fluctuates due to a decrease in ammonia concentration, and the operating environment may be significantly deteriorated. In addition, the pH When high, the problem of resist dissolution also occurs
On the other hand, although the volatilization of ammonia from the etching solution can be suppressed by adjusting the pH to a neutral region, in this case, there is a problem that residues are deposited when rinsing with water
On the other hand, in the case of an ammonia-based etchant containing copper ions and ammonia, it is difficult to etch titanium

Method used

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  • Etching solution composition, method for etching multilayer film, and method for manufacturing display device
  • Etching solution composition, method for etching multilayer film, and method for manufacturing display device
  • Etching solution composition, method for etching multilayer film, and method for manufacturing display device

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manufacture example 1

[0112] Production example 1: Fabrication of titanium / copper / titanium / glass substrate

[0113] A layer made of titanium (metal) is formed by sputtering titanium on a glass substrate (size: 150mm×150mm) Next, a layer made of copper (metal) is formed by sputtering copper After that, a layer made of titanium (metal) is formed by sputtering titanium Thus, a three-layer film structure of titanium / copper / titanium is produced. A resist was applied thereto, a line pattern mask (line width: 20 μm) was exposed and transferred, and developed to form a resist pattern, thereby producing a titanium / copper / titanium / glass substrate.

manufacture example 2

[0114] Production example 2: Production of copper / titanium / glass substrate

[0115] A layer made of titanium (metal) is formed by sputtering titanium on a glass substrate (size: 150mm×150mm) Next, a layer made of copper (metal) is formed by sputtering copper In this way, a copper / titanium 2-layer structure is produced. A resist was applied thereto, a line-shaped pattern mask (line width: 20 μm) was exposed and transferred, and developed to form a resist pattern, thereby producing a copper / titanium / glass substrate.

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Abstract

The present invention relates to an etching solution composition, an etching method for a multilayer film, and a method for manufacturing a display device, wherein the etching solution composition of the present invention comprises: (A) a supply source of copper ions; (B) having 1 in the molecule An organic acid ion supply source of more than two carboxyl groups; (C) a fluoride ion supply source; (D) an etch regulator, a surface oxidation power enhancer, or a combination thereof as a first additive; and (E) as a second additive of surfactants.

Description

technical field [0001] The present invention relates to an etchant composition, a method for etching a multilayer film, and a method for manufacturing a display device. For example, it relates to an etchant composition that can be used to etch a multilayer film containing copper and titanium, an etching method for a multilayer film containing copper and titanium using the etchant composition, and an etching method using the etchant composition A method of manufacturing a display device. Background technique [0002] Conventionally, aluminum or an aluminum alloy is generally used as a wiring material for a display device such as a flat panel display. However, in the recent increase in size and resolution of displays, the problem of signal delay due to characteristics such as wiring resistance occurs in aluminum-based wiring materials, making it difficult to achieve uniform screen display. [0003] Therefore, research has been conducted on wiring mainly composed of copper, w...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C23F1/16C23F1/30C23F1/20
CPCC23F1/16C23F1/20C23F1/30C23F1/18C23F1/26H01L27/124H01L21/32134H01L27/1259
Inventor 全重翼印致成李美顺申铉亿裴俊佑
Owner SAMYOUNG PURE CHEM
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