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Etchant composition, method for etching multilayered film, and method for preparing display device

A technology of composition and etching solution, which is applied in the manufacture of semiconductor/solid-state devices, electrical components, circuits, etc., can solve the problems of deterioration of operating environment, change of etching rate, dissolution of resist, etc., to prevent etching residues or precipitates, The effect of maximizing linearity and reducing the amount of waste liquid

Active Publication Date: 2017-05-31
SAMYOUNG PURE CHEM +2
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  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, such an alkaline etching solution has a high pH, ​​so a large amount of ammonia volatilizes from the etching solution, and sometimes the etching rate fluctuates due to a decrease in ammonia concentration, and the operating environment may be significantly deteriorated. In addition, the pH When high, the problem of resist dissolution also occurs
On the other hand, although the volatilization of ammonia from the etching solution can be suppressed by adjusting the pH to a neutral region, in this case, there is a problem that residues are deposited when rinsing with water
On the other hand, in the case of an ammonia-based etchant containing copper ions and ammonia, it is difficult to etch titanium

Method used

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  • Etchant composition, method for etching multilayered film, and method for preparing display device
  • Etchant composition, method for etching multilayered film, and method for preparing display device
  • Etchant composition, method for etching multilayered film, and method for preparing display device

Examples

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manufacture example 1

[0112] Production example 1: Fabrication of titanium / copper / titanium / glass substrate

[0113] A layer made of titanium (metal) is formed by sputtering titanium on a glass substrate (size: 150mm×150mm) Next, a layer made of copper (metal) is formed by sputtering copper After that, a layer made of titanium (metal) is formed by sputtering titanium Thus, a three-layer film structure of titanium / copper / titanium is produced. A resist was applied thereto, a line pattern mask (line width: 20 μm) was exposed and transferred, and developed to form a resist pattern, thereby producing a titanium / copper / titanium / glass substrate.

manufacture example 2

[0114] Production example 2: Production of copper / titanium / glass substrate

[0115] A layer made of titanium (metal) is formed by sputtering titanium on a glass substrate (size: 150mm×150mm) Next, a layer made of copper (metal) is formed by sputtering copper In this way, a copper / titanium 2-layer structure is produced. A resist was applied thereto, a line-shaped pattern mask (line width: 20 μm) was exposed and transferred, and developed to form a resist pattern, thereby producing a copper / titanium / glass substrate.

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Abstract

Disclosed are: an etchant composition comprising (A) a copper ion source, (B) a source of an organic acid ion having one or more carboxyl groups in a molecule, (C) a fluoride ion source, (D) an etching controller, a surface oxidizing power enhancer or a combination thereof as a first additive, and (E) a surfactant as a second additive; a method for etching a multilayered film; and a method for preparing a display device.

Description

technical field [0001] The present invention relates to an etchant composition, a method for etching a multilayer film, and a method for manufacturing a display device. For example, it relates to an etchant composition that can be used to etch a multilayer film containing copper and titanium, an etching method for a multilayer film containing copper and titanium using the etchant composition, and an etching method using the etchant composition A method of manufacturing a display device. Background technique [0002] Conventionally, aluminum or an aluminum alloy is generally used as a wiring material for a display device such as a flat panel display. However, in the recent increase in size and resolution of displays, the problem of signal delay due to characteristics such as wiring resistance occurs in aluminum-based wiring materials, making it difficult to achieve uniform screen display. [0003] Therefore, research has been conducted on wiring mainly composed of copper, w...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C23F1/16C23F1/30C23F1/20
CPCC23F1/16C23F1/20C23F1/30C23F1/18C23F1/26H01L27/124H01L21/32134H01L27/1259
Inventor 全重翼印致成李美顺申铉亿裴俊佑
Owner SAMYOUNG PURE CHEM
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